TECHNOLOGY
www.ledinside.com
High Thermal Conductive
Organic Substrate Materials
Thermal conductivity
1.5 w/mk
For LEDS
Halogen Free
Thermal conductivity
1.0 w/mk
In recent years, there has been a rapid increase in needs for slimmer and smaller implemented devices due to the miniaturization of electronic devices, as well as the mounting of LED chips on displays and lighting. The main factor behind the generation of heat by devices such as LED chips and other implemented components is the low thermal conductivity of epoxy resins (0.2~0.3 W/m・K) which are the main component of plastic substrates. On the other hand, although metal substrates are used as high heat dissipation board materials, these substrates suffer from electrical reliability and processability problems. To overcome the problems of plastic and metal substrates, we propose the following two solutions.
1 High thermal conductivity:
Circuit board material thermal characteristics Mounted LED class / by application
In addition to the existing 1.0w/m・k type, a 1.5w/m・k & halogen free type has been newly added to our lineup.
3 Excellent processability
*Drill processing, punching processing, through hole processing possible
LED Temperature Evaluation Our Conventional FR-4
1.5
1.5
w/mk
NEW
w/mk Halogen Free
Reference Product
NEW
Halogen Free
Reference Product
Flexible Type
Metal PCB
*High electric strength, tracking resistance, CAF resistance
Thermal resistance (℃/W)
2 Excellent insulation reliability:
1w Halogen Free
1.5
w/mk
NEW
Halogen Free
3w
LED lighting
1w
2w
Edge-Light type backlight
Reference Product
1
w/mk
1w
R-1787
Local dimming type backlight
Metal CCL
Our Conventional FR-4
0.3w
Decoration lighting
High
Low Cost
LED Thermal simulation 47.7℃
21.3℃
●Test Condition
19.6℃
Size of test sample
LED : □3×2mm LED temperature : 0.4W(with Cu on the backside of board) Property
Thermal conductivity [W/m･K]
LED Copper foil
340
25mm
62.6℃
25mm
Cu
No copper foil applied to the back side
Aluminum plate
MPCB
Crosssection
Aluminum plate
Boundary condition
We can also provide a flexible substrate (ECOOL-F) that achieves the same level of heat dissipation as aluminum substrates, allowing for use in applications that require thinner, lighter, and flexible substrates. This flexible type uses a thin, uniform polyimide film as an insulating layer, achieves low thermal resistance levels, and also possesses high electric strength.
http://panasonic-denko.co.jp/em/e/
Thermal conductivity of circuit board materials(W/m･K) Temp
LED temperature
110
140
R-1787
120
NEW
Reference Product 80
100 80 60
50
40 0.5
Thermal exchange at 8W/m2K with 20℃ air
35μm Cu (Right below LED) Resin portion
Standard FR-4/ CEM-3Level
Flexible type
1/4 model
398
LED
B oard thickness 1.0mm
TH
Analysis mesh
1.0
1.5
2.0
2.5
HF FR-4/ HFCEM-3Level
0.4
0.6
123.6
104.4
Halogen Free
R-1787
0.8 94.6
1.0 88.6
NEW Reference Product
1.5 80.4