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An Electronic Material Supplier’s perspective on Challenges and Opportunities in 3D Packaging Mr. Leo Linehan Global Business Director of Advanced Packaging Technologies, Dow Electronic Materials

Biography up to 100 words Leo Linehan has more than 20 years of experience in the semiconductor packaging and manufacturing. Prior to joining Dow, he held several roles in materials development, process engineering, R & D, and business development at both Rohm & Haas and the IBM Microelectronics Division. Leo has authored numerous papers in semiconductor applications and holds more than 20 patents.

Abstract: (200 – 500 words) 3D packaging is a competitive market with an ever expanding diversity of package designs and manufacturing processes. The rapid growth in 3D packaging is largely driven by strong consumer demand for ultraportable electronics with higher performance and more functionality. A review and discussion of the significant challenges and opportunities in 3D packaging for material suppliers will be presented.

China Semiconductor Technology International Conference SEMICON China 2011  SEMI 2011 A-1


http://semiconchina.org/downloadFile/1289283034515