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Via dei Vasari,17 - 05018 Orvieto (TR) - Italy Telephone +39 0763 316333 - Fax +39 0763 316002 www.res-ingenium.com - info@res-ingenium.com e-shop: www.rfpowerwave.com facebook.com/resingenium


MDF30-I 30W-RF POWER AMPLIFIER Designed for FM radio transmitters and transposers, The MDF30-I is a Power Amplifier designed in order to cover the entire FM band, from 87,5 to 108MHz. Thanks of his high gain and linearity the MDF30-I is the perfect solution for driver application. This amplifier incorporates microstrip technology and MOSFET to enhance ruggedness and reliability.

MDF30-R 30W - RF AMPLIFIER Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and MOSFET to enhance ruggedness and reliability. The MDF30-R is a Power Amplifier designed in order to cover the entire FM band, from 87,5 to 108MHz. ROHS Compliant.

FM310-108 300 W - FM Amplifier Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability

FM550-108 FM550-108 550 W - FM Amplifier Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability. The FM550-108 has the smallest footprint available on the market for > 500W output power and can be considered the state of art of the FM pallet amplifiers.

FM1100-108 1100W FM Amplifier Designed for FM radio transmitters and transposers, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability. The FM1100-108 has the smallest footprint available on the market for > 1000W output power and can be considered the state of art of the FM pallet amplifiers.

FM1200-108 1200 W - FM Amplifier Designed for FM radio transposers and Transmitters. The configuration of the amplifier is a “push-pull� stage coupled by means of a combining network fully integrated in the RF block. This design allows to obtain a broadband unit with an efficiency as high as 83% (Typical) and extremely low harmonic emissions that are typically 50dB below the carrier.

V H F


30W >30dB - ULTRA COMPACT FM RF POWER AMPLIFIER

MDF30-I New !

 87.5 ÷ 108MHz  28 Volts  Input/Output 50 Ω – 50 Ω  Pout: 30W  Gain > 30dB  Driver Class A  Output Stage Class AB  Devices: BLF245 or equivalent Via dei Vasari,17 - 05018 Orvieto (TR) - Italy Telephone +39 0763 316333 - Fax +39 0763 316002 www.res-ingenium.com - info@res-ingenium.com e-shop: www.rfpowerwave.com facebook.com/resingenium


30W >30dB - ULTRA COMPACT FM RF POWER AMPLIFIER

MDF30-I

General description MDF30-I is the evolution of MDF30-RV2. It is designed for FM radio transmitters and transposers, The MDF30-I is a Power Amplifier designed in order to cover the entire FM band, from 87,5 to 108MHz. Thanks of his high gain and linearity the MDF30-I is the perfect solution for driver application. This amplifier incorporates microstrip technology and MOSFET to enhance ruggedness and reliability. Key Feature and functions  High Power concentrated in a Small Size dimension  Best in Class Price Vs Power/Gain  High Gain Amplifier  High Reliability  Field Proven High Reliability OPTIONS MDF30-RV2 Dimensions (LxWxH): 73.5 x 59 x 17.8mm [2.89” x 2.32” x 0.7”] (Original MDF30-R)

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM. Date 19/09/13


30W >30dB - ULTRA COMPACT FM RF POWER AMPLIFIER

MDF30-I Absolute Maximum Ratings (Device Flange T=70°C) Symbol

Parameter

Value

Unit

Vs

Voltage Supply

30

V dc

Is

Supply Current

3

A dc

Tstg

Storage Temperature Range

-30 +10

°C

Tc

Operating Temperature

-10 +45

°C

ELECTRICAL SPECIFICATIONS (Base Plate T.=45°C, 50Ω loaded, Vd=30V)

Characteristiscs Fundamental Output Power Power Input

Min

Typ.

Max

30

Unit W

-

-

30

mW

Power Gain (30W Output)

30

-

-

dB

Efficiency (Load 50Ω)

45

-

Input VSWR

1.5:1

% 1.7:1

Output VSWR (Any Phase angle)

3:1

Flatness

±0,5

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM. Date 19/09/13

dB


30W >30dB - ULTRA COMPACT FM RF POWER AMPLIFIER

PC BOARD LAYOUT

HEATSINK MOUNTING/HARDWARE 1. HEATSINK TOOLING -Planarity: better than 0.03 mm -Roughness: typical value 0.8µ 2.THERMAL COMPOUND -Paste with silicones -Thickness: optimum between 0.06 mm and 0.15 mm, on the whole back surface of the amplifier. 3.SCREWS -M3 hexagon socket head cap screws -recommended Torque is 12 Kg . cm (10.5 in . lbs). 4.TIGHTENING ORDER -See next figure

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM . Date 19/09/13


MDF30-R 30W - RF POWER AMPLIFIER Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and MOSFET to enhance ruggedness and reliability.

• • • • • •

87.5 ÷ 108 MHz 28 Volts Input/Output 50 Ω - 50 Ω Pout : 30 W Gain > 30 dB Driver Class A Output stage Class AB Devices: BLF245 or equivalent

• •

Dimensions (LxWxH): 73.5 x 59 x 17.8mm [2.89” x 2.32” x 0.7”] This picture is a mere example, it does not bind the provided product

ABSOLUTE MAXIMUM RATINGS (Device Flange T = 70 °C) Symbol

Parameter

Value

Unit

Vs

Voltage Supply

30

V dc

Is

Supply Current

3

A dc

Tstg

Storage Temperature Range

-30

+ 100

°C

Tc

Operating Temperature

-10

+ 45

°C

ELECTRICAL SPECIFICATIONS (Base Plate T. = 45 °C, 50Ω loaded, Vd = 30 V) Characteristics Fundamental Output Power

Min 30

Typ.

Max

Unit W

-

-

30

mW

Power Gain (30W output)

30

-

-

dB

Efficiency (Load 50Ω)

45

-

Power Input

1.5:1

Input VSWR

% 1.7:1

Output VSWR (any phase angle)

3:1

Flatness

±0,5

dB

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. . GR00006

Issue: 0 Date: 03/07/2001

Rev: 0 Date: 04/09/2008

Pag. 1/4


MDF30-R PC BOARD LAYOUT

HEATSINK MOUNTING/HARDWARE 1.HEATSINK TOOLING -Planarity: better than 0.03 mm -Roughness: typical value 0.8Âľ 2.THERMAL COMPOUND -Paste with silicones -Thickness: optimum between 0.06 mm and 0.15 mm, on the whole back surface of the amplifier. 3.SCREWS -M3 hexagon socket head cap screws -recommended Torque is 12 Kg . cm (10.5 in . lbs). 4.TIGHTENING ORDER -See next figure

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. . GR00006

Issue: 0 Date: 03/07/2001

Rev: 0 Date: 04/09/2008

Pag. 2/4


MDF30-R

1

3

4

2

Res-Ingenium Via dei Vasari, 17 Zona Industriale Fontanelle di Bardano 05018 Orvieto (TR) Italy Telephone: +39 0736 316333 Fax: +39 0763 316002 Internet: res-ingenium.com E-Mail: map@res-ingenium.com IMPORTANT NOTICE RES-INGENIUM RESERVE THE RIGHT TO MAKE CHANGES TO THE PRODUCT(S) OR INFORMATION CONTAINED HEREIN WITHOUT NOTICE. RES-INGENIUM ASSUMES NO RESPONSIBILITY FOR ANY ERRORS WHICH MAY APPEAR IN THIS DOCUMENT. WARRANTY INFORMATION APPLICABLE TO THE PRODUCT IDENTIFIED HEREIN IS AVAILABLE UPON REQUEST. NOTHING CONTAINED HEREIN SHALL CONSTITUTE A WARRANTY, REPRESENTATION OR GUARANTEE OF ANY KIND. RES-INGENIUM EXPRESSLY DISCLAIMS ALL OTHER WARRANTIES, EXPRESS AND/OR IMPLIED INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, AND OF FITNESS FOR A PARTICULAR PURPOSE, USE OR APPLICATION. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Res-Ingenium. WARNING RES-INGENIUM PRODUCTS ARE NOT INTENDED FOR USE IN LIFE SUPPORT APPLIANCES, DEVICES OR SYSTEMS. USE OF A RES-INGENIUM PRODUCT IN ANY SUCH APPLICATION WITHOUT WRITTEN CONSENT IS PROHIBITED. Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. . GR00006

Issue: 0 Date: 03/07/2001

Rev: 0 Date: 04/09/2008

Pag. 3/4


FM310-108

300 W - FM Amplifier Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability.

• • • •

87.5 ÷ 108 MHz 48 Volts Input/Output 50 Ω Pout : 300 W min I quiescent 50mA Gain : 23 dB typ Class B Devices: MRF6V2300NBR1 or equivalent Configuration Single End Connectorized version available on request

• • • • •

Dimension (L x W x H): 101 x 45 x 38mm [4” x 1.8” x 1.5”] This picture is a mere example, it does not bind the provided product

ABSOLUTE MAXIMUM RATINGS (Device Flange T = 70 °C) Symbol

Parameter

Value

Unit

Vs

Drain Voltage Supply

50

V dc

Is

Supply Current

12

A dc

VSWR

Load Mismatch (all phase angles, Tc=40°C, Id=10A)

Tstg

Storage Temperature Range

-30

+ 100

°C

Tc

Operating Temperature

-10

+60

°C

3:1

ELECTRICAL SPECIFICATIONS (Base Plate T. = 45 °C, 50Ω loaded, Vd = 48 V) ELECTRICAL CHARACTERISTICS Characteristics

Min

Operating Frequency Range

87.5

Fundamental Output Power

300

Typ.

21.5

Power Gain (300W output)

Collector Efficiency (Load 50Ω)

70

MHz

2.5

W

23 8.2

I Drain

Unit

108

W 1.4

Power Input

Max

dB 9

A

78

%

Input VSWR

1.3:1

Insertion Phase Variation (Unit to Unit )

±10

Degrees

Power Gain Variation (Unit to Unit)

±1

dB

-40

dB

-40

dB

-35

F2 Second Harmonic F3 Third Harmonic

1.7:1

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM310-108

Issue: 0 Date: 04/03/2008

Rev:1 Date: June 27, 2008

Page 1/3


FM310-108

104.00

108.00

104.00

108.00

100.00

96.00

92.00

-36.00 -37.00 -38.00 -39.00 -40.00 -41.00 -42.00 -43.00 -44.00 -45.00 88.00

[dBc]

Typ. 2ยบ HARMONIC vs FREQ.

F. [MHz]

100.00

96.00

92.00

25.00 24.50 24.00 23.50 23.00 22.50 22.00 21.50 21.00 20.50 20.00 88.00

[dB]

Typ. GAIN vs FREQ.

F. [MHz]

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM310-108

Issue: 0 Date: 04/03/2008

Rev:1 Date: June 27, 2008

Page 2/3


FM310-108

PHYSICAL LAYOUT AND HEATSINK MOUNTING/HARDWARE 1.HEATSINK TOOLING -Planarity: typical value 0.8Âľ -Roughness: better than 0.03 mm 2.THERMAL COMPOUND -Paste with silicones -Thickness: optimum between 0.06 mm and 0.15 mm, on the whole back surface of the amplifier. 3.SCREWS -M3 hexagon socket head cap screws or equivalent. -The recommended Torque is 0.6 N-m for M3 or 4-40 type screws as indicated on Freescale Semiconductor Application Note AN3263 Rev. 0. - The screw tightening must be done at ambient temperature. 4.TIGHTENING ORDER -See next figure:

WARNING: when mounting this mechanical component, please add thermal compound between its bottom part and the device surface, as described in point 2 of this paragraph. NOTE: ensure a minimum air flow on the components surface of the pallet.

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM310-108

Issue: 0 Date: 04/03/2008

Rev:1 Date: June 27, 2008

Page 3/3


FM310-108

Res-Ingenium Via dei Vasari, 17 Zona Industriale Fontanelle di Bardano 05018 Orvieto (TR) Italy Telephone: +39 0736 316333 Fax: +39 0763 316002 Internet: res-ingenium.com E-Mail: map@res-ingenium.com IMPORTANT NOTICE RES-INGENIUM RESERVE THE RIGHT TO MAKE CHANGES TO THE PRODUCT(S) OR INFORMATION CONTAINED HEREIN WITHOUT NOTICE. RES-INGENIUM ASSUMES NO RESPONSIBILITY FOR ANY ERRORS WHICH MAY APPEAR IN THIS DOCUMENT. WARRANTY INFORMATION APPLICABLE TO THE PRODUCT IDENTIFIED HEREIN IS AVAILABLE UPON REQUEST. NOTHING CONTAINED HEREIN SHALL CONSTITUTE A WARRANTY, REPRESENTATION OR GUARANTEE OF ANY KIND. RES-INGENIUM EXPRESSLY DISCLAIMS ALL OTHER WARRANTIES, EXPRESS AND/OR IMPLIED INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, AND OF FITNESS FOR A PARTICULAR PURPOSE, USE OR APPLICATION. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Res-Ingenium. WARNING RES-INGENIUM PRODUCTS ARE NOT INTENDED FOR USE IN LIFE SUPPORT APPLIANCES, DEVICES OR SYSTEMS. USE OF A RES-INGENIUM PRODUCT IN ANY SUCH APPLICATION WITHOUT WRITTEN CONSENT IS PROHIBITED.

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM310-108

Issue: 0 Date: 04/03/2008

Rev:1 Date: June 27, 2008

Page 4/3


30W >30dB - ULTRA COMPACT FM RF POWER AMPLIFIER

MDF30-I PHYSICAL DIMENSIONS

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM . Date 19/09/13


Ultra Compact 1200W FM Pallet

FM1200-108

The most compact 1200W FM pallet available (88-108MHz)

Last generation Ultra Rugged LDMOS Power Device

Unsurpassed Quality Vs Price/W

Drain Efficiency higher than 83%

Extremely low harmonic emission

Via dei Vasari,17 - 05018 Orvieto (TR) - Italy Telephone +39 0763 316333 - Fax +39 0763 316002 www.res-ingenium.com - info@res-ingenium.com e-shop: www.rfpowerwave.com facebook.com/resingenium


Ultra Compact 1200W FM Pallet

FM1200-108

General description The RF Pallet FM1200-108 is the state of the art product for OEMs for final power stages for band II FM amplifiers using a single LDMOS of the Ultra Rugged generation type BLF188XR (or equivalent), capable of 1200W RF output. The pallet concept is the most compact layout available today and includes the bias circuits, matching networks and circuits for stabilization of the operating point. The configuration of the amplifier is a “pushpull” stage coupled by means of a combining network fully integrated in the RF block. This design allows to obtain a broadband unit with an efficiency as high as 83% (Typical) and extremely low harmonic emissions that are typically 50dB below the carrier.

Key Feaure and functions  Compact, Powerful and Reliable

 Best in class for Efficiency and Robustness  Available with Aluminum or Copper carrier (Option)  Extremely low Harmonic emission

OPTIONS Copper carrier

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM. (Rev.0 – August 2013)


Ultra Compact 1200W FM Pallet

FM1200-108 ELECTRICAL SPECIFICATION All specs are valid for load impedance 50 Ohm, 25°C ambient temp. and 48Vdc Parameter

Min.

20

10

Input Power Frequency range

Max

1200

Output power Gain

Typ.

88

108

Units

Notes

W

CW

dB

At full Power

W

Nominal

MHz

Class of Operation

B

Drain Current

30,5

A

Drain efficiency

83

%

Input return loss

15

dB

Saturated

Insertion phase variation

±5

Deg.

Gain variation

±1

dB

Harmonic emissions

- 50

dB

Power Supply

48

Vdc

Heat sink requirement

< 0.1

C°/W

Operating Temperature

-5

+ 45

Heatsink temperature

-5

+ 75

At 1200W CW

All across the band

±2%; 32A max.

Weight

150

gr.

Aluminium carrier

Weight

350

gr.

Copper carrier (Option)

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM. (Rev.0 – August 2013)


FM1200-108 PHYSICAL DIMENSIONS

52 3,5

5

VDC (M4)

RF OUT

13,5

RF OUT

3,5

Vdc MAX 23

223A-0

115

WARNING

35

Power Devices flange screw torque should not exceed 0,9Nm

3,5

12,5

3,5

224A-0

RF IN 3,5 7,75

4,5 7,75

RF IN (All dimensions are in mm)

Important Notice Technical specifications are subject to change without notice. RES-INGENIUM is not liable for third party use of information contained in this data sheet. All information are property of RES-INGENIUM. (Rev.0 â&#x20AC;&#x201C; August 2013)


Registered ISO 9001:2000 File No. A10480

FM1100-108

GR04920

Product Name

Part Number

Technical Specification Summary Frequency Range 87.5-108MHz Pout(min) 1100 W Typ. Gain 22,5 dB Typ. Efficiency 80%

Temperature Range Max VSWR Working Class Supply Voltage

-10 to +60 °C 1,7:1 C 50 V

Device: MRF6V2300NR1 or equivalent General Description

Designed for FM radio transmitters and transposers, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability. The FM1100-108 has the smallest footprint available on the market for > 1000W output power and can be considered the state of art of the FM pallet amplifiers.

Actual Power Amplifier Picture

Physical Dimensions (LxWxH): Weight Electrical Specifications Parameter Frequency Output Power Power Input Power Gain Drain Current Collector Efficiency Input VSWR Insertion Phase Variation Power Gain Variation F2 Second Harmonic

101mm x 45mm x 38mm / 4" x 1,8" x 1,5" 150 g. / 0,33 lb Min. 87.5 5 21

-40

Typ. 1100 6,0 22,5 0,4 80 1.3:1 ± 10 ±1 -48

Max 108

Units MHz W W dB A %

Notes Fundamental Output power @ 1100W output Load @ 50:

1.7:1 Degrees Unit to Unit dB dB

All Specifications are valid for load impedance 50 Ohm

Release Date 22/06/2011

Revision: 0 File: FM1100-108

Page 1 of 4


Registered ISO 9001:2000 File No. A10480

FM1100-108

GR04920

Product Name

Part Number

Graphs and Charts Table 1: Vdc 50V - Idq 100mA each device Freq. MHz 87.50.00 98.00.00 108.00.00

Pow.In W 6,00 5,00 6,00 [dBc]

Ref.In Ret.L.In W dB 0,15 -16,02 0,10 -16,99 0,15 -16,02

Pow Out W 1100,00 1100,00 1100,00

Gain dB 22,63 23,42 22,63

ID A 27,50 27,30 27,40

Effic. % 80,00 80,59 80,29

2° Har. dB -40,00 -50,00 -48,00

2 Harmonic vs Freq.

­40

­44

­48

­52 87,5

dB

98

108

Typ. Gain vs Freq.

23,6 23,4 23,2 23 22,8 22,6 22,4 22,2 87,5

Release Date 22/06/2011

98

Revision: 0 File: FM1100-108

108

Page 2 of 4


Registered ISO 9001:2000 File No. A10480

FM1100-108

GR04920

Product Name

Part Number

Mechanical specifications PHYSICAL LAYOUT AND HEATSINK MOUNTING/HARDWARE 1.HEATSINK TOOLING Planarity: typical value 0.8 Roughness: better than 0.03 mm 2.THERMAL COMPOUND Paste with silicones Thickness: optimum between 0.06 mm and 0.15 mm, on the whole back surface of the amplifier. 3.SCREWS M3 hexagon socket head cap screws or equivalent. The screw tightening must be done at ambient temperature.

Connections

RF In

+ 50V

RF Out

Ordering informations Product Name

Manufacturer's Part n.

Feature Description

FM1100-108

GR04920

Standard version

Release Date 22/06/2011

Revision: 0 File: FM1100-108

Page 3 of 4


Registered ISO 9001:2000 File No. A10480

FM1100-108

GR04920

Product Name

Part Number

IMPORTANT NOTICE RES-INGENIUM RESERVE THE RIGHT TO MAKE CHANGES TO THE PRODUCT(S) OR INFORMATION CONTAINED HEREIN WITHOUT NOTICE. RES-INGENIUM ASSUMES NO RESPONSIBILITY FOR ANY ERRORS WHICH MAY APPEAR IN THIS DOCUMENT. WARRANTY INFORMATION APPLICABLE TO THE PRODUCT IDENTIFIED HEREIN IS AVAILABLE UPON REQUEST. NOTHING CONTAINED HEREIN SHALL CONSTITUTE A WARRANTY, REPRESENTATION OR GUARANTEE OF ANY KIND. RES-INGENIUM EXPRESSLY DISCLAIMS ALL OTHER WARRANTIES, EXPRESS AND/OR IMPLIED INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, AND OF FITNESS FOR A PARTICULAR PURPOSE, USE OR APPLICATION. NO PART OF THIS DOCUMENT MAY BE COPIED OR REPRODUCED IN ANY MEANS WITHOUT THE PRIOR WRITTEN CONSENT OF RES-INGENIUM.

WARNING THE SPECIFICATIONS CONTAINED HEREIN ARE SUBJECT TO CHANGE WITHOUT NOTICE. RES-INGENIUM S.r.l. ASSUMES NO LIABILTY FOR THE USE OF THIS INFORMATION. THIS DATA SHEET AND CONTENTS ARE THE PROPERTY OF RES-INGENIUM S.r.l.. RES-INGENIUM PRODUCTS ARE NOT INTENDED FOR USE IN LIFE SUPPORT APPLIANCES, DEVICES OR SYSTEMS. USE OF A RES-INGENIUM PRODUCT IN ANY SUCH APPLICATION WITHOUT WRITTEN CONSENT IS PROHIBITED.

Release Date 22/06/2011

Revision: 0 File: FM1100-108

Page 4 of 4


FM550-108

550 W - FM Amplifier Designed for FM radio transposers and transmitters, this amplifier incorporates microstrip technology and LDMOS device to enhance ruggedness and reliability. The FM550-108 has the smallest footprint available on the market for > 500W output power and can be considered the state of art of the FM pallet amplifiers.

• • • •

87.5 ÷ 108 MHz 48 Volts Input/Output 50 Ω Pout : 550 W min I quiescent 200mA Gain : 20 dB typ Class B Devices: MRF6V2300NR1 or equivalent Configuration Push pull Connectorized version available on request

• •

• • •

Dimension (L x W x H): 101 x 45 x 38mm [4” x 1.8” x 1.5”] This picture is a mere example, it does not bind the provided product

ABSOLUTE MAXIMUM RATINGS (Device Flange T = 70 °C) Symbol

Parameter

Value

Unit

Vs

Drain Voltage Supply

63

V dc

Is

Supply Current

24

A dc

VSWR

Load Mismatch (all phase angles, Tc=40°C, Id=10A)

3:1

Tstg

Storage Temperature Range

-30

+ 100

°C

Tc

Operating Temperature

-10

+60

°C

ELECTRICAL SPECIFICATIONS (Base Plate T. = 45 °C, 50Ω Ω loaded, Vd = 48 V) ELECTRICAL CHARACTERISTICS Characteristics

Min

Operating Frequency Range

87.5

Fundamental Output Power

550

Typ.

19

Power Gain (550W output)

Collector Efficiency (Load 50Ω Ω)

75

MHz

7.0

W

20 14

I Drain

Unit

108

W 5.5

Power Input

Max

dB 15.5

A

82

%

Input VSWR

1.3:1

Insertion Phase Variation (Unit to Unit )

±10

Degrees

Power Gain Variation (Unit to Unit)

±1

dB

-30

dB

-40

dB

-27

F2 Second Harmonic F3 Third Harmonic

1.7:1

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM550-108

Issue: 0 Date: 01/10/08

Rev:1 Date: November 6, 2008

Page 1/3


FM550-108

PHYSICAL LAYOUT AND HEATSINK MOUNTING/HARDWARE 1.HEATSINK TOOLING -Planarity: typical value 0.8Âľ -Roughness: better than 0.03 mm 2.THERMAL COMPOUND -Paste with silicones -Thickness: optimum between 0.06 mm and 0.15 mm, on the whole back surface of the amplifier. 3.SCREWS -M3 hexagon socket head cap screws or equivalent. -The recommended Torque is 0.9 N-m for M3 or 4-40 type screws as indicated on Freescale Semiconductor Application Note AN3263 Rev. 0. - The screw tightening must be done at ambient temperature. 4.TIGHTENING ORDER -See next figure:

WARNING: when mounting this mechanical component, please add thermal compound between its bottom part and the device surface, as described in point 2 of this paragraph. NOTE: ensure a minimum air flow on the components surface of the pallet. INHIBIT PORT

WARNING: Do not apply any negative voltage to the inhibit port. It can be only grounded to reduce the output power. To mute the amplifier cut the input signal. Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM550-108

Issue: 0 Date: 01/10/08

Rev:1 Date: November 6, 2008

Page 2/3


FM550-108

Res-Ingenium Via dei Vasari, 17 Zona Industriale Fontanelle di Bardano 05018 Orvieto (TR) Italy Telephone: +39 0736 316333 Fax: +39 0763 316002 Internet: res-ingenium.com E-Mail: map@res-ingenium.com IMPORTANT NOTICE RES-INGENIUM RESERVE THE RIGHT TO MAKE CHANGES TO THE PRODUCT(S) INFORMATION CONTAINED HEREIN WITHOUT NOTICE. RES-INGENIUM ASSUMES RESPONSIBILITY FOR ANY ERRORS WHICH MAY APPEAR IN THIS DOCUMENT.

OR NO

WARRANTY INFORMATION APPLICABLE TO THE PRODUCT IDENTIFIED HEREIN IS AVAILABLE UPON REQUEST. NOTHING CONTAINED HEREIN SHALL CONSTITUTE A WARRANTY, REPRESENTATION OR GUARANTEE OF ANY KIND. RES-INGENIUM EXPRESSLY DISCLAIMS ALL OTHER WARRANTIES, EXPRESS AND/OR IMPLIED INCLUDING BUT NOT LIMITED TO WARRANTIES OF MERCHANTABILITY, AND OF FITNESS FOR A PARTICULAR PURPOSE, USE OR APPLICATION. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of Res-Ingenium. WARNING RES-INGENIUM PRODUCTS ARE NOT INTENDED FOR USE IN LIFE SUPPORT APPLIANCES, DEVICES OR SYSTEMS. USE OF A RES-INGENIUM PRODUCT IN ANY SUCH APPLICATION WITHOUT WRITTEN CONSENT IS PROHIBITED.

Conctat Res-Ingenium, +39 0763 316333 Fax +39 0763316002- or visit www.res-ingenium.com for a complete listing. FM550-108

Issue: 0 Date: 01/10/08

Rev:1 Date: November 6, 2008

Page 3/3


Vhf catalog e shop 140517