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>> Get this Report Now by email! Some Important Technologies 168 PRINTED CIRCUIT BOARDS 168 Background 168 Technologies 168 PCB Substrates 168 Overview 168 Current Material Usage 169 Standard FR-4 Epoxy Resin 169 Higher Performance Epoxies 169 Polyimides 169 Issues That Will Impact Types of Resins Used in PCBs 169 Flexible Printed Circuit Boards 170 Background 170 Technology 170 Standards 170 Advantages 170 Materials Used 171 Overview 171 Polyimides 171 Polyesters 171 Liquid Crystalline Polymers 171 Aramids 171 Epoxy Resins 172 Adhesiveless Laminates 172 Molded/3-D Printed Circuit Boards (MIDs) 172 Background 172 Technology 172 Manufacturing 173 History 173 How Do They Differ From PCBs' 173 Materials Used 173 Market Targets 174 Process Technologies 174 Impact of MIDs 174 Examples of New Plastics for MIDs 175 Lanxess 175 BASF 175 Ticona 175 Evonik 175 Industry Trends of Printed Circuit Boards 175 PLASTICS IN ELECTRONIC COMPONENTS 176 Introduction 176 Active Devices 176 Active/Passive Devices 176 Passive Devices 176 FLEXIBLE ELECTRONICS 177 Overview 177 Concept of Flexible Electronics 177

Engineering Resins, Polymer Alloys and Blends: Global Markets (From Issuu)

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Engineering Resins, Polymer Alloys and Blends: Global Markets  
Engineering Resins, Polymer Alloys and Blends: Global Markets  

INTRODUCTIONSTUDY GOALS AND OBJECTIVESThe objective of this study is to provide a detailed analysis of engineering resins along with polymer...

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