Engineering and manufacturing solutions Total Solutions Company for the Electronics Manufacturing Industry
Technology STI’s personnel include an array of multi-disciplinary experts with decades of experience designing, manufacturing, and analyzing electronic assemblies. This experience enables STI to specialize in solution development for electronics manufacturing problems from component-level to fully integrated systems. The group includes former NASA and government employees that enable us to directly understand the needs and obstacles facing critical space and military hardware.
R&D STI’s engineering team has developed a unique packaging technology through several years of research and development to address those problems of advanced military systems: size, weight, and power. This patented packaging technology coined Imbedded Component/Die Technology (IC/DT®) provides the required miniaturization coupled with passive thermal management to address the complex design challenges and thermal challenges facing today’s system design engineers.
Production Utilizing some of the most advanced equipment for prototyping and manufacturing enables engineers and analysts at STI the versatility to provide the highest quality services for a wide range of products in order to address the challenges and issues facing today’s electronic manufacturers. Through product design and manufacturability analysis, to pre-production prototype and contract manufacturing, STI is a full-service design review and production facility.
Services STI’s chemists complement the team of engineers and analysts in evaluating electronic assembly defect failures and material characterization. They provide a wide range of services designed to characterize materials, detect failure modes, and perform exploratory analysis of products or processes.
Cleanroom Capabilities STI’s ISO Class 6 (Class 1000) Cleanroom houses the microelectronics manufacturing and assembly lab for R&D, prototype, and low volume production. The cleanroom specializes in process development and assembly of state-of-the-art microelectronics packages including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology, Imbedded Component/Die Technology (IC/ DT®). A full complement of surface preparation, assembly processing, and process qualification equipment provide unlimited options for microelectronics/hybrid manufacturing and assembly.
Products Services Other Application Areas of Technology
Utilizing some of the most advanced equipment for R&D, prototyping, and analysis enables engineers and analysts at STI the versatility to provide the highest quality services for a wide range of products in order to address the challenges and issues facing today’s electronic manufacturers. Through product design and manufacturability analysis, to pre-production prototype and full production capability, STI’s Prototype and Development Lab is a full service design review, prototype, and contract manufacturing facility. As problems arise in the manufacturing process, the Analytical Lab provides a wide range of services designed to characterize materials, detect failure modes, and perform exploratory analysis of products or processes. Furthermore, the Microelectronics Lab was established to meet the rising need for advanced systems development and assembly including current technologies such as COB and Multichip Module (MCM) as well as emerging technologies such as Imbedded Component/Die Technology (IC/DT®). A class 1000 cleanroom was installed to support specialty assemblies with process development and microelectronics manufacturing capabilities.
Scope of Services ff ff ff ff ff ff ff ff
Component Procurement Assembly Profile Establishment Manufacturability Analysis Small to Medium Volume Production of Mixed Technology Assemblies Rework and Repair of Electronic Assemblies Materials Characterization Failure Analysis Class 1000 Cleanroom Microelectronics Assemblies
Examples of Application Areas ff ff ff ff ff ff ff ff
Night Vision Hardware Commercial GPS Automotive Power Electronics Missile Systems Mobile Radio Systems Avionics Electronics Satellite Electronics Radar
scope of R&D Services Terminal High Altitude Area Defense (THAAD)
In conjunction with Lockheed Martin Space Systems Company, STI has been tasked to design, assemble, and test an image processor system using its patented packaging technology, Imbedded Component/Die Technology (IC/DT®). Packaging this high density electronics system into a miniaturized form factor will increase signal processing capability, improve performance, and integrate thermal management for interceptor electronics.
Multiple Kill Vehicle-Kill Vehicle (MKV-KV)
STI, through a MDA SBIR initiative, is utilizing its patented packaging technology, Imbedded Component/Die Technology (IC/DT®) to integrate the manufacturing and assembly of KV subsystems, reliably and cost effectively, into a single high-density module. In this effort, STI is partnered with two other small businesses to implement the advanced integrated avionics systems for the KV.
Joint Tactical Radio System (JTRS)
STI is partnered with two prime contractors to decrease the number of circuit card assemblies with which to implement one of the JTRS radio system’s communications electronics assemblies. STI is responsible for the packaging of the hardware using its patented packaging technology, Imbedded Component/Die Technology (IC/DT®), to decrease the number of interconnects/failure opportunities and address the thermal related issues with the current design.
Customers and Markets
Government/Military ff ff ff ff ff ff ff ff ff
Boeing CIA DRS L-3 Lockheed Martin NASA Northrop Grumman Raytheon US Navy
Private/Commercial ff ff ff ff ff ff ff ff ff ff
American Airlines Daimler Chrysler Delta Air Lines Invensys Panasonic PEI Sanmina / SCI Schlumberger VMIC EMC2
A Brief History
STI Electronics, Inc. is a woman-owned premier full service organization for training, consulting, laboratory analysis, microelectronics assembly, prototyping, and small to medium volume PCB assembly and is located in Madison, Alabama. STI was founded by Jim D. Raby who has over fifty-five years of experience in the industry including development of the NASA and Department of Defense Soldering Schools. Over the past 25 years, the company, which started as a small family business with Jim, Ellen and David Raby, has grown to fifty employees and expanded its focus from consulting and technical seminars to providing training, laboratory analysis, advanced research and development, microelectronics assembly (class 1000 cleanroom environment), prototyping, and small to medium volume PCB contract assembly for the electronics industry. STI was chosen in 1998 and 1999 as one of the 500 fastest growing companies in the country by INC Magazine and was selected by the Huntsville/Madison County Chamber of Commerce as the 2000 Small Business of the Year in the Business Services Category.
Facilities STI Electronics, Inc.’s Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of electronics manufacturing. Utilizing some of the most advanced equipment for R&D, prototyping, and analysis enables engineers and analysts at STI the versatility to provide the highest quality services for a wide range of products in order to address the challenges and issues facing today’s electronic manufacturers. ff Through product design and manufacturability analysis, to pre-production prototype and development (Engineering Services division is ISO 9001:2000 certified), STI’s Prototype and Development Lab is a full service design review and pre-production facility. With two high-speed automated assembly lines, the lab supports high and low-mix PCB assembly for volumes that range from just a few units for prototypes, to low quantities for pre-production, to thousands in mid volume production. ff As problems arise in the manufacturing process, the Analytical Lab provides a wide range of services designed to characterize materials, detect failure modes, and perform exploratory analysis of products or processes. ff The Microelectronics Lab consists of over 1000 sq. ft. of ISO Class 6 (Class 1,000) cleanroom area and 700 sq. ft. of ISO Class 7 (Class 10,000) for process development and assembly of hybrids and microelectronic systems, including development of STI’s patented packaging technology Imbedded Component/ Die Technology (IC/DT®).
Key Personnel David E. Raby | President & CEO
Mr. Raby is President & CEO of STI Electronics in Madison, Alabama. He helped found the company in 1982 in San Dimas, California, and has been its President since 1991 and CEO since 1997. The company moved to Madison, Alabama, in 1993. Mr. Raby has helped spearhead the company’s remarkable growth and diversification. STI was named in 1998 and again in 1999 as one of the 500 fastest growing private companies and 2008 as one of the 5000 fastest growing private companies–much of that is due to his leadership. Mr. Raby was elected to a two-year term as President of the Surface Mount Technology Association (SMTA) in 2004 and re-elected in 2006.
Jim D. Raby | Founder & Technical Director
Mr. Raby is an industry leader and is considered a subject matter expert on the subject of soldering by most in the industry. He is the technical director of STI Electronics, Inc. and provides technical oversight and direction for the company. He is the visionary of Imbedded Component/Die Technology (IC/DT®) and continues to research and look for breakthrough technologies that will deliver solutions to industry problems and issues. He started at NASA in 1958 and then moved to China Lake Naval Research Facility and set up the soldering school and soldering research center. He is also the creator of the Navy Electronics Manufacturing Productivity Facility (EMPF), which is still in operation today. Mr. Raby has vast military electronic hardware experience on a number of missile programs, specifically navy programs, i.e. Sparrow, Sidewinder, Maverick, Cruise, Harpoon, Captor Mine, and Standard Missile.
Mark T. McMeen | Vice President of Engineering Services
Mr. McMeen has 18 years of manufacturing and research and development experience in advanced electronic hardware. His background/experience is in the start up and manufacturing of new manufacturing facilities from printed circuit board manufacture and assembly of circuit card assemblies to the fabrication and manufacture of passive and active components. His unique background from raw PCB manufacture to component packaging and ultimately circuit card assembly brings a broad background in solving unique electronic challenges. He was one of the original design engineers on the Imbedded Component/Die Technology (IC/DT®). He has authored numerous articles on various electronic topics and is a current patent holder on building high voltage flexible circuits.
Casey H. Cooper | Microelectronics Lab Manager
Mrs. Cooper joined STI Electronics early in the development of Imbedded Component/ Die Technology (IC/DT®). She is responsible for project development and oversight of IC/ DT® implementation, manufacturing and assembly, and environmental testing in addition to new research and development endeavors. She also provides technical oversight of the hybrid assembly equipment for manufacturing chip-on-board design assemblies. Before STI Electronics, Mrs. Cooper assisted in the design of a DARPA sponsored microelectromechanical system (MEMS) based micro-cooler for electronic cooling at Harris Corporation. She has conducted research at the Center for Advanced Vehicle Electronics (CAVE) in the development of high reliability processes for flip chip-on-laminate to be used for under-the-hood automotive applications. Mrs. Cooper has authored several papers on flip chip reliability as well as the design and implementation of IC/DT®.
STI utilizes its expertise, past experiences, and leading edge technology labs to develop solutions to complex system design problems. The theory of understanding what is the weakest link in a design and its true environmental and performance threshold is the key to designing real world solutions to complex design issues. STI believes in performing test-to-failure to determine environmental as well as performance limits so as to develop margin into new designs and into solutions to existing complex system designs. This philosophy serves STI well as a value-added partner to our customer. The expertise and services provided by the three labs in STIâ€™s Engineering Services department have a synergistic effect on the high quality and level of engineering support that STI offers as a full service resource for the electronics industry.
Mark T. McMeen Vice President of Engineering Services 256.705.5515 email@example.com
STI Electronics, Inc. 261 Palmer Road | Madison, AL 35758 | 256.461.9191 | www.stielectronicsinc.com