Page 1

p. 5 Editor’s Foreword Initiative fever

p. 16 S  pecial Feature Hall of Fame


ABACO FMCs: COVERING THE WHOLE ELECTRONIC WARFARE SPECTRUM WE INNOVATE. WE DELIVER. YOU SUCCEED. Few military applications are more diverse or more demanding than electronic warfare. There are no one-size-fits-all solutions – and no room for compromise in performance. That’s especially true when it comes to FMCs.

Abaco offers the industry’s broadest range of FMC solutions, characterized by WE INNOVATE. low latency, high throughput, dense I/O and minimal SWaP. WE DELIVER. We back SUCCEED. that range with a complete, mission ready systems capability that can YOU reduce cost and risk – and substantially reduce your time-to-deployment. If compromise has no place in your plans – you should talk to Abaco.


©2017 Abaco Systems.

Keep Your FPGA System Integration on Target and above Water WILDSTARTM 40Gb 6U and 3U OpenVPX EcoSystem Altera Stratix 10® AND Xilinx UltraScale(+)TM

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On the cover The VITA Technologies 2017 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC/PMC, and related rugged boards, systems, and components. Featured on the cover: Elma Electronic’s High speed Open VPX, VITA 66 and VITA 67 compliant  backplanes with RF and Optical modules and  Curtiss-Wright Defense Solution’s COTS-based DO-254 / ED-80 safety-certifiable avionics system.

ADDITIONAL FEATURES Embedded Tech Trends 2017 wrap-up »» p. 12

By Jerry Gipper, Editorial Director

16 Special Feature

Jerry Gipper

Hall of Fame

24 Technology Feature

Ken Grob, Elma Electronic

Using the updated VITA 65 Standard to build faster high performance systems DEPARTMENTS

5 Editor’s Foreword

Jerry Gipper

Initiative fever

6 VITA News

Ken Braund, Meritec

Advances in MIL-D-38999L connectors lead to smaller, lighter, and greater bandwidth »» p. 18

Creative uses of FMC Introduction by Jerry Gipper

8 VITA Standards Update VITA Standards Organization activity updates

10 Defining Standards VITA 47, Environmentally Sound

28 Primetime Choices 30 VITA Technologies Resource Guide

VPX evolution drives ever greater capabilities »» p. 22

By Simon Collins, ADLINK Technology

Enclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Systems and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PMC/XMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

30 31 33 34 35 35 36 38

All registered brands and trademarks within VITA Technologies magazine are the property of their respective owners. ™VPX and its logo is a registered product/trademark of VITA. © 2017 OpenSystems Media © 2017 VITA Technologies enviroink.indd 1

4 | VITA Technologies Resource Guide Spring/Summer 2017

10/1/08 10:44:38 AM

Editor’s Foreword By Jerry Gipper, Editorial Director @VitaTechnology

Initiative fever Embedded Tech Trends 2017 wrapped up in New Orleans at a great venue in the heart of the French Quarter right on the infamous Bourbon Street. The agenda was packed with great presentations centered on the theme of “The Voodoo Behind Critical and Embedded Systems.” Many of the presenters had some fun with the theme and entertained us with some great analogies in the voodoo spirit. The feature “Embedded Tech Trends Wrap-up” goes into detail on the presentations. All of the sessions were video recorded and have been posted. To view the presentations and videos, visit They are worth a look if you are using any VITA technologies. Stay tuned for details on the 2018 edition of Embedded Tech Trends. The last presentations of the event led to perhaps some of the liveliest discussion. Greg Rocco from MIT Lincoln Labor­ atory and Patrick Collier of NAVAIR updated the audience on the work going on with several Department of Defense (DoD) initiatives. Program offices are working together to define common ground for technology used in various platforms with high performance computing requirements. These initiatives are looking at all aspects of critical embedded computing from hardware to software. A number of DoD programs are zeroing in on VPX as the architecture of choice. These initiatives are not a new concept, but have evolved over the past few years. In an idealistic world, having common usage models would be great for technology re-use and development. Many of us in the audience have seen these types of initiatives start and then fade away over the years. Our history with the industry has made skeptics of some of the efforts.

This time it just feels different. We have a new administration that is a total wildcard! President Trump is committed to changing the way nearly everything is done. He is bringing a business leader acumen to the presidency that we have never experienced. Matching it against a well-entrenched political establishment is going to be extremely entertaining to observe over the coming years. President Trump is sending out many signals that bode well for companies in the defense industry. He is pushing for a significant boost in U.S. defense spending, while at the same time asking that NATO nations pick up their “fair share” of defense spending. The U.S. is the largest arms supplier in the world with U.S. companies selling equipment to nations around the globe. Many nations are anticipated to increase their spending on U.S.-made equipment as a result of the Trump administration’s change on global responsibilities. What this means is that the demand will be strong in the coming years.


For the U.S. DoD to stay ahead, they must innovate faster. To do this requires an increased focus on commercial-off-the-shelf (COTS) technology. To make COTS more practical, it requires interoperability and all of the benefits of open architecture standards. The initiatives underway will see increased pressure to deliver results quickly. A second observation that I see is the greater desire of the various programs to work together on the platform initiatives. The complexity of today’s systems and platforms make it nearly impossible to go at it alone. The suppliers can’t do it all and the primes need the help, along with innovation from the industry. In the past, I have talked about strong ecosystems. That has never been more important than at the current moment. A healthy and strong ecosystem is in place ready to move the initiatives forward. The level of collaboration with the programs has never been stronger. Key individuals like Rocco and Collier are contributing tremendously to the exchange of information that is critical to the initiatives. They need commitment from the entire ecosystem to ensure the success of these initiatives. Based on the level of participation in study and working group meetings, there are a lot of companies interested in seeing these initiatives achieve their goals. VITA Technologies Resource Guide Spring/Summer 2017 |


Advertiser Index 2

Abaco Systems – More choices. More performance. Lower SWaP.


Annapolis Micro Systems, Inc. – Keep your FPGA system integration on target and above water


Excalibur Systems, Inc. –,


Interface Concept – Designed for Performance

1 Curtiss-Wright – COTS-based DO-254 / ED-80 safety-certifiable avionics system 1

Elma Electronic – High speed Open VPX, VITA 66 and VITA 67 compliant backplanes with RF and Optical modules


Elma Electronic – Development to Deployment


LCR Embedded Systems – 2-Slot Featherweight VPX System for UAVs, Ground Mobile, Man-Pack


Pentek, Inc. – Unfair Advantage


Themis Computer – NanoSwitch. Rugged GigE Smart Switch


VEROTEC Electronics Packaging – Continuing 50 years of excellence in functional and elegant electronic packaging


Vector Electronics & Technology, Inc. – VME, VXS, cPCI, Chassis Backplanes and Accessories








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6 | VITA Technologies Resource Guide Spring/Summer 2017

VITA News By Ken Braund

Advances in MIL-D-38999L connectors lead to smaller, lighter, and greater bandwidth The military circular connectors have been around since the beginning of time, or so it seems. They were developed in the 1930s for Army and Navy severe applications. The “AN” Series of Circular connectors, as they were known, originated in the 1930s as a dependable, rugged military electrical connector that has evolved into the 38999 electrical interconnect system today that now has many more demands on it than simple point-topoint electrical connections. It has been utilized by not only the military, but has also found its way into Industrial, Aerospace, and Automotive applications where dependability is paramount. The latest revision, MIL-DTL-38999L series III, standard describes a connector suitable for blind mating, high-­vibration, and elevated temperatures. They are also suitable for “severe wind and moisture problem” (SWAMP). The contacts are removable crimp style pin and tubular socket style or solder type pin and socket contacts. Little innovation has taken place in the contact design during the first approximately 70 years of the life of military circular connectors. It wasn’t until increased bandwidth requirements proved the ever-popular pin and socket contacts to be inadequate for the performance needed. It is only in the last ~15 years that bandwidth requirements have increased dramatically driven by Ethernet, DisplayPort, USB, SATA, InfiniBand, etc. that has forced innovation in contact design and contact arrangement. The Quadrax contact is an early example of increased bandwidth by rearranging the signal and ground contacts within a 38999 circular connector to isolate the signals from one another for improved isolation from crosstalk rather than redesigning the contact itself. The Quadrax design, while increasing bandwidth capability, does sacrifice pin count and pin density. For example, a 38999 size 23 shell will accommodate six (6) Quadrax contacts for a total of six bidirectional lanes each capable of approximately 2.5 Gb/s. (See Figure 1). In 2015, VITA adopted VITA 76.0: High Performance Cable – Ruggedized 10 Gbaud Bulkhead Connector for Cu and AOC Cables as a standard. It included a new 38999-style connector utilizing a new innovative contact design and arrangement due to a need for even higher performance and density than Quadrax could meet. VITA 76.0 was adopted as an ANSI standard (ANSI/VITA 76.0-2016) in early 2016. The advantages to the new contact design, pioneered and commercialized by Meritec of Painesville, Ohio, are many including increased density, increased pin count, increased bandwidth per contact, and increased aggregate bandwidth






Figure 1: Size 23 Shell with 6 Quadrax Contacts. Figure 2: Size 23 Shell with 44 Differential Data Pairs (22 Lanes)

per connector. System engineers looking for size, weight, and power (SWaP) improvements within their systems can use the VITA 76.0 standard that has been utilized in many designs. The new contact design differs from the traditional pin and socket implementations in that it is a flat hermaphroditic contact. The flat hermaphroditic contact interface is identical in both the cable plug and the receptacle. When mated, the flat mating surfaces provide two points of contact and when combined with the wire termination techniques utilized, provide a virtually transparent signal impedance path. There are no electrical stubs that are typically found in pin and socket contact designs. And while many attempts have been made to embed commercial connectors such as Ethernet and USB within 38999 shells to make them stand up to the rugged military environment, the new hermaphroditic contact design is the solution for a smaller, lighter solution with bandwidth capability for accommodating the various protocols. The advantages of the increased pin density and pin count are made obvious by comparison. For example, the VITA 76.0 contact interface in a 38999 shell size 23 contains a total of 145 contacts that will accommodate 22 bidirectional lanes at 10 Gb/s per lane for an aggregate bandwidth of 220 Gb/s per connector. (See Figure 2). More recently, a presentation was made to the VITA membership at its November 2016 standards meeting by Meritec, in conjunction with Reflex Photonics of Quebec, Canada. Evidence was presented that suggests the possibility of a new standard, VITA 76.1, which would be an Active Optic Module (AOM) version of the copper-based VITA 76.0. The VITA 76.1 standard would utilize the same VITA 76.0 copper contact interface in both the cable plug and the receptacle. Thus, the receptacle would accept either a copper cable OR optic cable. VITA 76.0 is specifically designed to stand up to the challenging environmental requirements of today and into the future. For more information, visit VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Standards Update By Jerry Gipper

VITA Standards Organization activity updates The March VITA Standards Organization (VSO) meeting was held in Salt Lake City, Utah. This update is based on the results of that meeting. Contact VITA if you are interested in participating in any of these working groups. Visit the VITA website ( for details on upcoming VSO meetings.

ANSI accreditation Accredited as an American National Standards Institute (ANSI) developer and a submitter of Industry Trade Agreements to the IEC, the VSO provides its members with the ability to develop and promote open technology standards. The VSO meets every two months to address embedded bus and board industry standards issues.

VSO study and working group activities Standards within the VSO may be initiated through the formation of a study group and developed by a working group. A study group requires the sponsorship of one VITA member, and a working group requires sponsorship of at least three VITA members.

plug-in units to this standard will facilitate the cost-effective integration of these items into larger systems. Status: ANSI/VITA 47-2005 (R2007) has been opened for revision to improve interoperability, create less reliance on individual supplier ruggedization guidelines, and make sure environments are concurrent with recent VPX updates. The working group is nearing completion of reviewing comments on the revisions and additions. Participation is encouraged.

VITA 48.4: VPX REDI: Mechanical Specification Using Liquid Flow Through (LFT) Applied to VPX Objective: This standard will establish the mechanical design requirements for an LFT-cooled electronic VPX module.

Work in progress Several working groups have current project work underway; the following roundup summarizes those projects.

ANSI/VITA 46.9: VPX: PMC/XMC Rear I/O Fabric Signal Mapping on 3U and 6U VPX Modules Objective: This standard defines PMC or XMC mezzanine rear I/O pin mappings to VITA 46.0 plug-in module backplane connectors. Status: Various updates and additions have been added for anticipated use in VPX profiles. The working group has completed their comment reviews and preparing for ANSI ballot.

ANSI/VITA 47: Environments, Design and Construction, Safety, and Quality for Plug-in Units Objective: Supplying vendors’ certification of commercial-off-the-shelf (COTS)

Status: The working group is reviewing comments from the working group. They anticipate submitting the document for ANSI balloting by May.

VITA 48.8: VPX REDI: Mechanical Standard for 3U, 6U Air Flow Through (AFT) Cooling Objective: This document defines an AFT standard using VPX connectors without the need for retainers and uses jackscrews instead of levers. Status: ANSI balloting is completed and is scheduled to be published in May.

VITA 49.2: VITA Radio Transport (VRT) Control Packet Rules Objective: The VRT standard defines a transport-layer protocol designed to promote interoperability between radio frequency receivers and signal-­ processing equipment in a wide range of applications. The VRT protocol provides a variety of formatting options

8 | VITA Technologies Resource Guide Spring/Summer 2017

allowing the transport layer to be optimized for each application. The VITA 49.2 standard specifies the rules governing control packets. Status: The working group has developed a draft document for review and discussion. Working group balloting is in process. Interested parties are invited to join the working group.

VITA 57.4: FMC+ Objective: The goal of this project is to develop a next-generation specification calling for a new set of connectors to support higher-speed serial interfaces. Status: The working group ballot has been complete, and comments are under review before the document will be submitted to public ANSI ballot. A new study group has been formed, VITA 57.5 Physical Tools to Aid in FMC+ Development, to define a set of development tools. Interested parties are invited to join this study group.

ANSI/VITA 65: OpenVPX Architectural Framework for VPX Objective: The OpenVPX architectural framework specification is a living document that is regularly updated with new profile information and corrections. Status: The document is in ANSI balloting and expected to be published this spring.

VITA 67.3: VPX: Coaxial Interconnect, 6U, Four Position SMPM Configuration Objective: This specification details the configuration and interconnect within the structure of VITA 67.0, enabling a 6U VPX interface containing multi-­ position blind mate analog connectors with up to four SMPM contacts.

Status: The working group has been through several rounds of ballots and is close to the ANSI ballot stage.

VITA 68.2: VPX: Compliance Channel Objective: This standard defines a VPX compliance channel including common backplane performance criteria required to support multiple fabric types across a range of defined baud rates. This allows backplane developers to design a backplane that supports required Bit Error Rates (BER) for multiple fabric types. This also allows module developers to design plug-in modules that are interoperable with other modules when used with a compliant backplane. Status: The working group is updating the draft of this standard.

for ANSI ballot. Several additional dot specifications have been introduced to expand the capability of VNX. Interested parties are invited to join the working group.

VITA 78.1: SpaceVPX Lite Systems Objective: This document leverages the work done on ANSI/VITA 78 to create a specification with an emphasis on 3U module implementations. The most significant change from SpaceVPX is to shift the distribution of utility signals from the SpaceUM to the System Controller to allow a radial distribution of supply power to up to eight payload modules. Status: The working group has developed a draft document of the specification that is currently under review.

VITA 84: Hardware Open System Technology (HOST) Study Group

VITA 74: VNX Objective: VNX describes a rugged small form factor subsystem intended to be rugged for deployed environments.

Objective: This is a study group with the vision of creating a hardware technical reference framework for developing embedded computing systems Status: The working group has approved through successful development of an this specification and has submitted overarching HOST strategy to maximize LCRESSFFVPXMES_VITA_2017.pdf 1 1/10/2017 1:11:20 PM

platform and system “openness,” modularity, interoperability, scalability, sustainability, and re-use. Status: The HOST study group is actively reviewing the draft document and reviewing comments

VITA 86: High Voltage Input Sealed Connector Power Supply. Objective: This standard defines an environmentally enhanced connector pair, which is compatible with the pinouts as defined in VITA 62.0 for power supplies operating in harsh environments operating off of a high voltage input (270VDC). The connector pair features wider separation between input pins and a sealed connection. Status: The working group is collecting inputs before developing a draft document. Copies of all standards reaching ANSI recognition are available from the VITA website. For a more complete list of VITA standards and their status, go to

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Defining Standards By Jerry Gipper

VITA 47, environmentally sound The standards developed by the members of the VITA Standards Organization typically fall into one of two categories. The first are hardware standards, which define the hardware parameters for some type of form factor, interconnection, or other mechanical features such as cooling. Hardware supplier companies that have expertise in a specific aspect of that technology typically leads the creation of hardware standards, while the user community provides inputs guided by their real-life design experiences. The second category is difficult to ­classify, but ability is probably the best term. These standards focus on the “abilities” with examples including reliability, interoperability, etc. They also define the operating environments and life cycle management strategies necessary for defined applications. They tend to be living documents or dynamic documents that undergo refinements while having long applicability life spans. Another interesting aspect of this class of standards is that members of the user community usually lead the development with inputs from the supplier side participants. ANSI/VITA 47, Environments, Design and Construction, Safety, and Quality for Plug-In Units is one of the standards in the ability category. This standard defines environmental, design and construction, safety, and quality requirements for commercial-off-the-shelf (COTS) plug-in units (cards, modules, etc.) intended for mobile applications. Modules certified to a specific environmental class meet the corresponding operating temperature class, non-operating temperature class, temperature cycling class, vibration class, and operating shock class. Suppliers are encouraged to indicate this compliance in their documentation so that it is easier and faster for users to determine if a specific product will meet their environmental

requirements. This enables users to verify a specific plug-in module is applicable to a specific application and will result in the desired system reliability. The industry benefits in multiple ways: 1. A better fit between the module design and the application results in improved reliability and durability. 2. Better system engineering without reliance on a specific VPX module supplier’s ruggedization guide. There is more consistency in terminology and data across suppliers. 3. Improved capability to perform future module upgrades and resolution of obsolescence and maintenance issues. COTS plug-in units are widely used in commercial and military, ground and aerospace, and mobile applications. Certification of COTS plug-in units, by supplying vendors, to this standard facilitates the cost-effective integration of these items in larger systems. ANSI/VITA 47 was first published in 2005, but it is now undergoing a major revision. I asked working group chairman Scott Newland from Harris Corp./GCSD: What is driving the effort currently underway? His response, “New Applications. The abstract from the original release states the environments defined were intended for mobile applications. We are finding that VPX products are being applied in applications ranging from submarines to spacecraft and the environments for these different applications are unique, so we need to update the specification accordingly.” With ten years of usage history under their belt, the user community is also finding that there were some issues with the current standard that makes system engineering challenging, forcing them to rely on specific module suppliers design information. This has made designing for future maintenance or upgrades challenging. “We are creating a new dot, or sub, structure to allow the addition of new environments and applications as they arise,” Newland comments. The substructure of VITA 47 will look like this: ›› The new VITA 47.0 standard contains the current VITA 47 environments to document the heritage applications. ›› VITA 47.1 will contain all the “common” environmental requirements. ›› VITA 47.2 documents the environments that align with J-STD-001 Class 2 applications for VPX plug-in units with less severe environments and consequence of failure. ›› VITA 47.3 documents environments that align with J-STD-001 Class 3 applications for VPX plug-in units with more severe environments and consequences of failure, like airborne uninhabited fighters. In the future, additional dot standards can be added for emerging applications like space deployment. When you order a module from a VPX supplier you will specify which VITA 47 dot standard set of environmental conditions you will be implementing in your application. This will enable the supplier to provide you with the information and products you need to meet your project goals.

10 | VITA Technologies Resource Guide Spring/Summer 2017

Environments Class

Operating Temperature Class

Non-operating Temperature Class

Temperature Cycling Class



























Cooling Method

Forced Air Cooled (Over Components)


Forced Air Cooled (Heat Exchanger)
































Conduction Cooled

Liquid Cooled











Vibration Class

Operating Shock

V1 OS1 V2



Table 1 | Current environmental classes in ANSI/VITA 47.0

This is not an easy task. The working group has been diligently “plugging” away for some time on this effort. Newland points out the challenges he is facing as the working group chair, “Finding non-ITAR data to support the selection of the different environments is very difficult. There are 15 current environments: vibration, shock, and more. In VITA 47, we want to add several more including module insertions, minimal retainer performance, and explosive atmosphere.” He also emphasized that the size of the effort is substantial and very challenging given that he and the other members of the working group also have day jobs! “The overall vision has remained the same, but we have added a lot of valuable information to the effort.” Plug-in units provided to this standard shall be per one of the classes defined in the following table. (See Table 1). Anyone interested in participating in this effort should contact VITA:

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Embedded Tech Trends 2017 wrap-up By Jerry Gipper


In January, Embedded Tech Trends 2017 was held at the wonderful Bourbon Orleans Hotel in the heart of the New Orleans French Quarter. Bordered by Bourbon Street to the west with Jackson Square and the mighty Mississippi River to the east, the attendees had easy access to the sights and sounds of the true essence of New Orleans (NOLA).

everaging the history of the area, the theme for 2017 was “The Voodoo Behind Critical and Intelligent Embedded Systems.” The focus and emphasis of the presentations during the event was on the magic of the technology and solutions behind high-performance computing problems. Embedded Tech Trends is a small, but extremely effective forum where suppliers of components, boards, and system level solutions can meet exclusively with members of relevant industry media to discuss technologies, trends, and products. The small venue of the Bourbon Orleans Hotel was great for true social networking free from the stress of large venue events.

The magic of secure processing

Many of the presenters had some fun with the voodoo theme by incorporating it into their presentations. The following are short synopses of the presentations:

Chassis cooling: Do you need a witch doctor?

By Rich Jaenicke, Director, Strategic Alliances and Market Development, Mercury Systems, Inc. Defense electronic systems are constantly under attack making it seem that sometimes magic is needed for protection. Jaenicke discusses several of the threats affecting these systems, key elements of a secure deployed system, and what steps are needed to ensure that they are secure, trusted, and rugged.

The evolving role of GPGPUs in C4ISR applications By Doug Patterson, Vice President of Sales and Marketing, Aitech Defense Systems, Inc. Object detection, tracking, and classification are critical to any system that relies on computer vision systems. General-purpose graphics processing units (GPGPUs) are rapidly becoming a game-changer in many command, control, communications, computers, intelligence, surveillance, and reconnaissance (C4ISR) applications. GPGPUs are opening the doors to new levels of deep-learning and neural network vision systems never before possible. Patterson explains how the role of GPGPUs have evolved and what they can do improve our vision system technology.

By Justin Moll, Vice President, U.S. Market Development, Pixus Technologies Inc. Chassis cooling seems more like black magic than most technology. Justin ponders if using a witch doctor might be a beneficial way to solve cooling problems. On the

12 | VITA Technologies Resource Guide Spring/Summer 2017


FIGURE 1 Ken Brown from LCR Embedded Systems giving his presentation at Embedded Tech Trends. Photo courtesy of Trevor Gipper

Data to decision: Enabling good decision-making By Simon Collins, Senior Product Manager, ADLINK Technology Inc. The military relies on the timely analysis of aggregated intelligence to fulfill short-term mission and long-term strategic aims. The enabling technology needs to be both open and robust, to ensure rapid deployment and efficient use of resources in the face of loss of connectivity, while being secure against any attack. Collins looks at advances in cloud computing, sensor data processing, and machine learning that are providing solutions to convert real-time data into decisions.

6U of connectivity in a 3U bag: Meeting the demand for density and speed way, he demonstrates how something as magical as changing the location of cooling fans may be the best solution.

Infinite possibilities, infinite choices, infinite challenges? By Ken Brown, Applications and Program Manager, LCR Embedded Systems What challenges does a chassis manufacturer face when implementing VPX? Brown dives into the many I/O options available to a VPX chassis manufacturer. He presents the pros and cons of six options with suggestions on choosing the best solutions for various scenarios.

Embedded Tech Trends: Market insights By Brian Arbuckle, Senior Market Analyst, IHS Markit Market data is extremely valuable in making good business decisions and determining the health of an ecosystem. Arbuckle discusses key highlights of the latest IHS Markit study on embedded computer boards, modules, and systems. He wraps up with information on current defense budgets on unmanned air, ground, and sea vehicle market trends.

By Michael Walmsley, Global Product Management, TE Connectivity Embedded computing industry trends have always led to interconnect challenges. Fortunately, the connector suppliers are up to the difficult task at hand. Walmsley covers a broad swath of what is stewing in the cauldron to improve VPX interconnect density and speed. He offers that there is tremendous potential for emerging interconnect technologies that will remove the bottlenecks of today’s solutions.

Introducing COTS to the rail industry By Rob Persons, Sr. Field Sales Architect, Artesyn Embedded Technologies Since 2007, the Federal Railroad Administration has been pushing the industry to implement fail-safe positive train control systems. Persons discusses how a data lockstep method eliminates some of the synchronization and upgrade issues used in previous methods.

A decade with a solution looking for a problem By Michael Humphrey, Business Development, Thermal Management Solutions, Parker Aerospace Liquid flow through cooling has been around for some time now. Humphrey presents a solution that combines the best of traditional conduction cooling with a closed loop liquid flow through in the sidewalls of a conduction chassis.

Lighting the way for embedded systems By Michel Tetu, Senior Business Development Advisor, Reflex Photonics Inc. Electronic Warfare (EW), Signal Intelligence (SIGNIT), and safety is driving the demand for accurate information from embedded computers connected to high resolution sensors such as infra-red cameras and phased array radars. The choice of interconnect architecture and technologies are critical to the successful realization of high-performance embedded systems. Tetu discusses optical interconnect technologies that are scalable and deliver high bandwidth, high reliability, and low size, weight, and power (SWaP) to meet the needs of embedded systems for today and tomorrow. VITA Technologies Resource Guide Spring/Summer 2017 |



FPGA coprocessors for acceleration of shape algorithms in hybrid VPX HPEC systems

The dark powers of Intel processor boards

By Thierry Wastiaux, Sr. Vice President of Sales, Interface Concept Advances in field-programmable gate array (FPGA) technology enable improvements in shape recognition algorithm processing. Wastiaux reviews results of research leading to improvements in Fast Fourrier Transform (FFT) and Discrete Cosine Transform (DCT) algorithms leading to reduced execution time and decreased use of FPGA resources.

By Nigel Forrester, Technical Product Marketing, Concurrent Technologies Plc Intel processors are widely used in critical embedded applications. Within the latest processors are “dark powers” that can enable new capabilities for users of single board computers. Forrester points out the advantages of several of these dark powers, challenging us to push even further with the capability of Intel processors.

Safety-certifiable avionics with COTS By Mike Slonosky, Senior Product Manager, Curtiss-Wright There is an increasing demand for commercial-off-the-shelf (COTS) DO-254 safety critical avionics solutions that the digitization of cockpits is leading in commercial and military aircraft of all types. Slonosky expands on the advantages of using COTS technology to meet this demand.

A steaming cauldron of VPX fixin’s – All the wicked ingredients you need for high-speed wizardry By Michael Munroe, Technical Product Specialist, Elma Electronic Inc. Having the right ingredients to solve a complex application is a necessary part of any recipe. Munroe reviews the ingredients and wizardry behind VPX that make it the right choice for high-speed critical embedded platforms.

Connector technology trends By Bob Hult, Director of Product Technology, Bishop & Associates It all starts at the connector so understanding trends in the industry can provide guidance in selecting the right technology. Hult shares his knowledge of the connector industry in strategic areas of the embedded computing industry.

The top five issues I encountered working with embedded vendors and why I decided to join the industry to address them By Mrinal Iyengar, Vice President of Product Management, Abaco Systems Iyengar presentation focuses on understanding that the customer requires almost magical-like skills. Iyengar recently moved from the demand side to the supply side of the equation. She shares her experiences as a customer while presenting challenges for what the supply side of the industry must do to satisfy those customers.

Building hybrid rugged systems using a mix of applicable embedded standards By Bill Ripley, Business Development, Alligator Designs Pvt Ltd Sometimes a solution requires a hybrid of standards to meet the design requirements. Ripley presents a case for building a rugged system that is more efficient and the “right size” for the target platform.

FIGURE 2 Curtiss-Wright’s Mike Slonosky discusses the trends of DO-254 certification process during Embedded Tech Trends. Photo courtesy of Trevor Gipper.

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Get consolidated! Virtualization technology for railway communication systems By Michael Plannerer, Director Global Research & Development, MEN Mikro Elektronik GmbH The modern train is becoming a rolling communications infrastructure. Plannerer details how the voodoo magic of operating system virtualization, widely used in modern information systems, can fulfill the requirements of these rolling communications platforms.

Protecting safety critical systems from voodoo curses By Scott Engle, Director of Business Development, Mercury Systems, Inc. Sometimes it just seems that someone has put a voodoo curse on your safety critical system; high integration costs, too many suppliers, managing for obsolescence, not planning for upgradability, and robustness of suppliers seem to plaque a designer. Engle delves into these curses, presenting options for what can be done by a customer to avoid them.

Sometimes hoodoo rituals are needed to implement new technology features in OpenVPX chassis By David Hinkle, Field Applications Engineer, Elma Electronic Inc. Dealing with emerging technology in a complex system can sometimes lead one to contemplate hoodoo rituals to get to a solution. Hinkle shares his experiences in managing the complexities, offering insight into how to overcome them in process of selecting an OpenVPX chassis.


New tools and standards boost embedded systems performance By Rodger Hosking, Vice President and Cofounder, Pentek, Inc. Developing real-time embedded signal processing systems poses many challenges. Much has changed in tools and standards critical to these systems. Consequently, Hosking navigates us through many of those challenges with his tutorial for developers of FPGAbased platforms.

Addressing the platform challenges of next generation electronic warfare systems By Haydn Nelson, Director of Marketing and AE, Abaco Systems Weapon systems are now primarily electronic, creating a new set of challenges for platform designers. Nelson reviews some of the fundamental concepts utilized in electronic warfare discussing how a modular platform addresses the various challenges to next generation electronic warfare systems such as integration, Internet Protocol (IP) Security, I/O, and compatibility.

CERDEC C4ISR/EW hardware/software convergence By Greg Rocco, MIT Lincoln Laboratory Communications-Electronics Research, Development, and Engineering Center (CERDEC) has been instrumental in driving hardware and software convergence initiatives. Joined by government, industry, and academia participants they have established working-level teams to coordinate development activities and conduct yearly demonstrations. Rocco provides an update on the activities and demonstrations.

HOST and SOSA Update, By Patrick Collier, NAVAIR Several Department of Defense (DoD) programs are zeroing in on VPX as the architecture of choice for various platforms. Program offices are working together to define common ground for technology. The stage is set for a shift in the industry. Collier discusses the latest reports from two of the key initiatives.



Rugged GigE Smart Switch Layer 2 and 3 Switch VICTORY Compliant Embedded x86 Processor 10 Port 16 Port options

High speed VPX signal integrity By Ivan Straznicky, Technical Fellow, Curtiss-Wright The challenges of signal integrity become greater with each speed step. The parameters get tighter to accommodate higher signaling rates. Straznicky talks about some of the hoodoo-voodoo that engineers must use to eke out more performance.

OpenVPX tutorial By Greg Rocco, MIT Lincoln Laboratory Greg Rocco is perhaps the most knowledgeable VPX person in the world. He created a tutorial for OpenVPX and during his presentation, he shares an introduction to his material. If you think of the OpenVPX standard as a reference manual, then think of this material as a user’s manual. It helps you sort through the large number of options in the standard, further locks in common industry practices, helps build a more consistent ecosystem, and provides invaluable suggestions for best engineering practices.

SWAP-C optimized vehicle networking switch MIL-STD-810G Sealed Enclosure Operating temp: -40°C to 71°C

MIL-STD-461F EMI MIL-STD-1275E Power

t he mis.c om/na noswit c h

©2017 Themis Computer. All rights reserved. Themis and the Themis logo are trademarks or registered trademarks of Themis Computer. All other trademarks are the property of their respective owners.

VITA Technologies Resource Guide Spring/Summer 2017 |



Hall of Fame Since the announcement of VMEbus in 1981 there have been a great number of people and ideas that have had an impact on the development and advancement of open standards used in critical embedded computing systems. The intention of the VITA Technologies Hall of Fame is to honor and preserve the remembrance of those people and technologies that have had the greatest influence on the VITA open standards industry. Many others are to come – innovators and influencers who have made a significant impact on developing, designing, creating the technology, and ferrying the technical specifications into open standards. These are the people who have overcome the technical and procedural problems, the products that set new expectations. It is our pleasure to honor these primary contributors to this industry. On November 20, 2013, VITA Technologies announced its first inductee into the VITA Technologies Hall of Fame. This spring we add three more to the VITA Technologies Hall of Fame.

Warren Andrews With more than 30 years in the embedded computer industry, Warren Andrews combined his engineering, marketing, and journalistic skills to identify and analyze leading-edge technologies and trends. His participation in the embedded computing industry in all of his roles inspired many to greater heights. His many articles and market analysis provided insight into this emerging part of the computer industry. Andrews was the editorial director and publisher/associate publisher of RTC magazine, a highly respected monthly magazine in the embedded-computer industry. He also founded COTS Journal, a leading publication in the military/government electronics market. Prior to joining the RTC Group, Andrews worked with Computer Design, Electronic Design, and EE Times in various capacities including to his own newsletter, InfoBus Report, which he published for over 10 years. In addition, he published

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several marketing/technology studies including landmark volumes on the “Bus and Board Market,” and “PCI, its Markets and Technology.” Before joining the fourth estate in 1980, Andrews owned his own engineering and manufacturing company where he designed microprocessor-based switching systems for the retail and lodging industries. He is also the developer of several unique products for the security and automotive industries, and holds a U.S. Patent for one of his inventions. Andrews has been the keynote speaker at the PCI SIG annual meeting, a regular speaker at the annual Bus and Board Conference, and was often invited to participate at companyspecific events with companies that include Motorola, Wind River Systems, and Zilinx. Andrews was on the Board of Directors of SBS Technologies and the board of advisers of StarGen, Inc.



Elwood Parsons Parsons was a long-time participant in the VITA Standards Organization (VSO). He participated in countless working groups over his twenty-plus years of contributions, extending all the way back to the original VMEbus standard. He was the chair of the VITA 30.x (2mm Connector Practice for Eurocard Systems) working group. Parsons was the chairman of the VSO for nine years. During his tenure, VITA adopted new ex ante patent terms for its members, setting a new high-bar for standards development organizations. It was also during his years that VPX became the mainstay activity for the VSO. In 1996, Parsons joined the VITA board of directors as the representative for AMP who had just become a sponsor member. He was involved in many changes that VITA ­experienced in those years, as the charter expanded from VMEbus to include other technologies important to the critical embedded computing industry.


Connector technology is the root of many of the standards developed by VITA, Parsons’ background in the connector industry was key to his contributions to the many ­standards he was involved in during his career. After graduating with an aerospace engineering degree and working in that industry for seven years, Parsons moved to AMP as a product engineer and later as the Harrisburg liaison for AMP Packaging Systems. In 1988, he moved to AMP Standards and Approvals department as a Standards Development Manager where he was a key contributor to dozens of VITA standards. He also participated in PICMG, IEEE, SFF, SCSI, and other standards activities, continuing after the merger with Tyco Electronics and Foxconn until his retirement in 2010.

Jim Robles Robles is a retired Boeing Senior Technical Fellow with over thirty years of experience in electronic packaging disciplines including system architectures, hardware design for commercial and military ground and airborne avionics, mechanical tolerance analysis, thermal and dynamic/vibration analysis, weights/mass properties analysis, design of experiments, environmental analysis and test, reliability, and environmental stress screening. He is a recognized expert on the application of commercial-off-the-shelf (COTS) hardware on military platforms. Robles led the ITAA working group for EIA-933 Standard for Preparing a COTS Assembly Management Plan. He was the Boeing Focal for VITA and PICMG, developing open standards for next generation COTS assemblies for military/ aerospace applications.


Robles’ technical leadership in VITA drove the development of standards and COTS VPX products that are compatible with two-level maintenance. He led the implementation team that established a two-level maintenance baseline on FCS resulting in projected life cycle cost savings of $4 billion for the ICS alone. His development of a practicable liquid flow-through cooling design resulted in a 30 percent weight and volume reduction in the F/A-18 E/F active electronically scanned array (AESA) radar processor. His led a multi-company team to develop a mission systems design that the customer regarded as “nearly flawless.” Robles received a Special Incentive Award for the $50 million projected savings from the application of his approach for the integration of COTS electronics on AWCS Extend Sentry hardware. He is a prolific consultant who has been involved with many Boeing programs including 787, 737 RS, AWACS, F-15, F/A-18, F/A-22, FCS, P-8, V-22, and WedgeTail. Robles was the Boeing Fellowship focal for Communities of Practice and Knowledge Management. He presented well-received workshops at the University of California at Berkeley, WSU, and at Society of Hispanic Professional Engineers National Technical Career Conferences.

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Creative uses of FMC Introduction by Jerry Gipper

The FPGA Mezzanine Card (FMC) standard has become the defacto mezzanine standard for anyone wanting a modular solution for platforms using an FPGA [field-programmable gate array]. The convenience of having modular I/O for any FPGA family makes it hard to not use an FMC as the I/O front-end. Consequently, the FMC standard, VITA 57, has gained worldwide acceptance and is endorsed by the major FPGA manufacturers. The FMC technical community has been working diligently on upgrades for what is known as FMC+, calling for a new set of connectors to support higher-speed serial interfaces. FMC+ augments the FMC interface by adding 14 additional full duplex high speed serial lanes for 24 total. Beyond FMC+, VITA 57.4 also has a provision for even more high-speed serial lanes. FMC+e calls for a mechanically separate connector to the primary FMC+ connector, adding eight more high-speed serial lanes, bringing the total possible to 32. The engineering community has been getting creative in ways to leverage the modularity of FMC. Let’s take a look as some of those applications. Optimizing pin utilization with FMC stacking By Abaco Systems Advances in I/O technology have led to multiple signal types being defined for the FMC interface. Additionally, FPGA density and complexity has led to higher device cost, making I/O pins a valuable commodity in any FPGA-based system. Rapid advancement in both FPGA and ADC/DAC technology has led designers to favor modular solutions to accommodate future upgrades without requiring a complete system re-architecture.

The FMC connector is a 400-pin interface accommodating both low-voltage differential signaling (LVDS) and high-speed serial pins as shown in Figure 1. It should be noted that the term ‘serial lane’ often refers to a bundle of two differential pairs: a mezzanine-to-carrier (M2C) differential pair and a carrier-to-mezzanine (C2M) differential pair. This distinction is critical to understand the FMC stacking technology. It is important to note that I/O and clocks dedicated to serial lanes often require connection to specialized pins on the FPGA. Thus, engineers must take care when designing both carrier and FMC to ensure these pins are mapped appropriately. FMC interfaces are designed to accommodate both LVDS and high-speed serial interfaces. Often, FMC designs don’t require using all I/O, leaving valuable FPGA pins unused and wasted. If intentionally designed in, these unused pins can be utilized by passing these wires to the topside of the board in an intelligent way to enable FMC stacking.

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An example of a board with this capability is the Abaco Systems FMC216 shown in Figure 2. This design includes 16 analog output channels at 312.5 MSPS at 16-bits. The FMC216 requires eight high-speed serial lanes from the carrierto-mezzanine (C2M) and four of the LVDS lanes. This leaves the FMC216 with 10 M2C lanes, 2 C2M lanes, and 76 LVDS lanes unused. VITA 57.1 calls for all LVDS and serial lanes to be populated in ascending order; thus, the FMC216 re-maps unused pins from the bottom of the board to the top of the board starting at index zero on its respective bus. The topside FMC interface now only has 76 LVDS I/O, all 10 M2C lanes, and only 2 C2M lanes – making it a partially compliant FMC site. If a subsequent FMC board only requires a subset of the LVDS or high-speed serial lanes, an additional FMC can be stacked. The Abaco Systems FMC116 is designed to specifically pair with the FMC216 to create a compact MIMO solution with 16 DACs and 16 ADCs. This matched pair can then be placed on any compliant carrier board. Limitation and practical considerations FMC stacking is a way to utilize more of the valuable resources on the FMC interface and connect more sensing capabilities to a single FPGA card, thus reducing the overall system cost. However, it does require the pair of FMCs to be analyzed carefully to ensure compatibility. FMC stacking is a natural consequence of the evolution of I/O types and the FMC standard accommodating both LVDS and high-speed serial. When utilizing FMC stacking, engineers must account for the additional spacing required – often calling for an additional slot in PCIe or VPX systems. Special cooling considerations may be required depending on the FMC type.







LVDS Parallel I/O (22 Pairs)

LVDS Parallel I/O (22 Pairs)






LVDS Parallel I/O (24 Pairs)




High Speed Serial (One Lane)

LVDS Parallel I/O (12 Pairs)



High Speed Serial (9 Lanes)

JTAG & Power

VITA 57.1 FPGA Mezzanine Card (FMC) simplified pin class definitions.

FIGURE 2 Abaco Systems FMC216.

FIGURE 3 Abaco Systems CES821 Stacked FMC Compact Embedded System.

FPGA and I/O technologies have shown significant evolution over the past 25 years, from very simple devices to systems-on-chip (SoC) with 1000s of pins. System integrators are more often looking to build systems on modular components based on standard interface.

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VITA defined the FPGA mezzanine card to accommodate both parallel and serial I/O pin classes: however, many FMC board designs don’t use all available resource pins, leaving extremely valuable FPGA I/O unused. FMC stacking is a technique to get back unused pins on an FMC interface. The CES821 with the FMC216 and FMC116 was given as an example of an integrated solution implementing this technique to not only use as many of the valuable FPGA pins as possible, but also do so in an extremely compact embedded system. When considering I/O system requirements in an FPGA-based system, it is possible to leverage Abaco FMC Stacking technology to ensure valuable FPGA pins do not sit idle.

that allows the insertion of FMC modules. In this case, the user will end up with a fully PXI-compatible module, but with the raw measurement function defined by the FMC. Additional processing can be done by the FPGA on the carrier, on another PXI module, or by the PC software, to customize the measurement functions.


PXI, meet FMC By Sundance Multiprocessor Technology PXI and FMC have different roots and have historically served differing markets. So separate are the markets, that most users are familiar with either one or the other, but not both. However, creatively combining the two standards onto a single product can expand the advantages of either past their current application space.

An example of this approach comes from Sundance DSP, with their PXIe700 FPGA PXIe Carrier Module. (See figure 4). The PXIe700 is a 3U PXI Express module with a FMC “site” where an arbitrary FMC module can be inserted. The mechanical positioning of the site aligns the faceplate of the FMC module with the faceplate of the PXI card, making it one integrated PXI device. The PXIe700 carrier supports PXI control, trigger, and clocks to the backplane, including four-lane Gen 2 PCIe communications. It also supports the HPC (High Pin Count) connector to the FMC, including 10 GTX transceivers at 12.5Gb/s each, as well as 144 single ended I/Os or 72 differential I/Os.

PXI is a modular pluggable card-based standard common in test and measurement applications. It was released as a standard in 1997 as an abbreviation for PCI eXtensions for Instrumentation, and is maintained by the PXI Systems Alliance. PXI adopts the rugged CompactPCI form factor and adds integrated clocks, triggers, and synchronization critical to test and measurement applications. PXI modules fit into a multi-slot chassis, and are configured and managed by a PC and software. As PCI speeds increased by the adoption of PCIe (PCI Express), PXI has followed with high-speed PCIe fabrics in the chassis and on the modules. Though occasionally referred to as PXIe, PXI remains a generic name, whether the backplane relies on PCI or PCIe. PXI and FMC standards can be combined into a single product by creating an FMC-compatible PXI carrier card


The Sundance PXIe700 FPGA Carrier (left) without any FMC inserted. The large black connector is the electrical interface to the FMC, while the faceplate houses an opening for the FMC’s front panel. The same PXI carrier (right), but with an FMC inserted, specifically the Sundance FMC-DAQ2p5. Note how the front panels align.

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All of this is made possible by the onboard Xilinx Kintex7 FPGA, which connects between the PXI backplane and the FMC HPC connector. This can be seen in the Figure 5 block diagram. FMC, by its very name, is intended to interface directly with the I/O pins of an FPGA. This makes for a very high-performance low-latency interface. Applications The combination of a high performance PXI carrier with any of the hundreds of FMC modules allows a wide set of applications to be addressed. Though PXI was conceived as a test and measurement platform, its small rugged form factor has also allowed it to be deployed as an embedded application in industrial, medical, and military markets. An example is using the PXIe-700 with the FMC-DAQ2P5 mezzanine to address radar applications. The FMC-DAQ2P5 hosts a 12-bit 2.7Gs/s ADC (analog-todigital converter), two 16-bit 2.8Gs/s DACs (digital-to-analog converters), and a number of single ended and differential I/O lines. This is a good example of the high performance instrumentation that can be hosted on an FMC module. In this case, IP is downloaded into the Xilinx FPGA that both analyzes and generates the high frequency signals used in radar applications. Using Mathworks Simulink, the user can add custom algorithms. These signals may be wideband baseband signals, which can be coupled to microwave downconverters, and upconverters available in the PXI format to address the spectrum of interest. Using PXI plus FMC, a small, powerful radar system can be prototyped in a small PXI chassis. FMC also fills an important role in PXI systems – customization. In many systems standard PXI modules need to be augmented with custom tailored instrumentation or signal conditioning. FMC allows a user to design their own custom printed circuit board that then is deployed in a PXI system via a carrier card. If more board space is needed than available on a standard FMC module, a custom design can be created that is nearly the size of a PXI module. As long


Block diagram of the PXIe-700 carrier. The embedded Xilinx FPGA contains the IP for all PXI operations to the right, as well the interfaces to the FMC on the left. The user programs the FPGA to access and control the specific FMC functions they desire.

as the custom board places the FMC HPC connector correctly, the new daughter card acts as a supersized FMC. If power dissipation is a concern, the new FMC can extend into the space of an adjacent slot, where the PXI chassis will supply ample cooling. Sundance was not the first organization to deploy PXI plus FMC. CERN did as well, in a very sophisticated data acquisition and control system. The possible applications are only limited by the measurement functionality of FMC modules, which is growing rapidly. The combination expands PXI’s addressable market from primarily test and measurement to data acquisition and control, embedded, and prototyping applications. It is also an effective method for a user to add their own custom card to a PXI system. PXI metrology grade instrumentation coupled with the growing number of analog, digital, and RF products from FMC is a powerful combination. PXI has addressed a wide set of applications in numerous industries. Over 1500 modules are available from over 50 vendors. With PXI-based FMC carriers, the new applications are nearly endless.

FMC BASICS FMC is an abbreviation for FPGA Mezzanine Cards, standardized as VITA 57.1. As its name implies, FMC describes a low-profile mezzanine module envisioned to connect from above, typically onto 3U and 6U cards with the front panels aligned. It refers to these host cards as ­carriers, and assumes an FPGA with reprogrammable I/O exists on the carrier. The FMC modules come in two standard sizes, with a high­-density 400-pin connector interfacing to the carrier card. By standardizing on the mechanical footprint and electrical interface, FMC cards can host a wide range of analog, digital, RF, and I/O functions to then be deployed onto more generic carriers, which may also span several standards. VITA Technologies Resource Guide Spring/Summer 2017 |



VPX evolution drives ever greater capabilities By Simon Collins


he original specification was driven by the need to provide a 2.5 Gbps channel for PCI Express, but also encompassed other high-speed interconnects such as Serial ATA (SATA) and 10 Gigabit Ethernet. The latter was provided for by using the XAUI standard, implemented on a “fat pipe” with each of four lanes running at 2.5 Gbps. Over time and driven by technology evolution in the commercial marketplace, PCI Express has seen upgrades to Gen2 at 5 Gbps and then Gen3 at 8 Gbps. With each new generation, connector vendors and board manufacturers have risen to the challenge, employing more rigorous signal integrity models and design standards to keep pace with the technology. More recently the challenge was thrown down by 10 Gigabit Ethernet, when the Intel Xeon Processor D released with two ports native to the device. The catch was that this capability used the 10GBASE-KR standard instead of XAUI, requiring a single pair in each direction

As VPX completes its first decade since ratification, it is clear this standard is here for the long haul. A healthy competitive marketplace has driven product adoption in actual programs, which have been proven in real combat operations. However, the true strength of VPX is its continuing evolution to keep pace with technological advancements. to carry 10 Gbps. This transition from the “fat pipe” with four pairs in each direction to the “ultra-thin pipe” with a single pair in each direction has pushed the envelope again. The nature of the VPX and OpenVPX specifications means that this new technology can be absorbed without the large-scale changes of previous architectures. Each successive improvement in capability at the hardware level drives greater performance at the system level. As customers seek to exploit their data to facilitate better decisions, the combination of ever-faster data rates and higher levels of processing density is allowing system designers to bring new functionality to the end user. The Intel Xeon Processor D represents both elements of this technological progression with its high-speed interfaces, including 10 Gigabit Ethernet, PCI Express Gen3 and SATA 6 Gbps, and its multicore Xeon architecture which includes built-in hardware virtualization and storage extensions. The multicore nature of the Xeon D processor lends itself well to applications, which require processing and analysis of vast quantities of data, such as radar and sonar. The PCI Express Gen3 interfaces mean that systems can be integrated with higher-­ performance sensors, as well as with offload capabilities such as field-programmable gate array (FPGA) or general-purpose computing on graphics processing units (GPGPU), leading to more sophisticated analysis on-platform, close to the sensor. Different systems have different size, weight, and power (SWaP) goals; for some, the need is to produce the same result with lower SWaP, while for others it is to provide greater capabilities within the same SWaP constraints. The hardware virtualization features of the Xeon D processor mean that multiple legacy applications can be condensed onto a single platform; this reduction of several legacy boards into a single

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10G-KR with up to three 1G Ethernet ports latest platform aimed at meeting the rugged and standards-based requirements of today’s military and aerospace applications.


ADLINK Technology VPX 3010 Processor Blade

slot not only make a system lighter, but could also pave the way for greater functionality in the newly vacated slots!

With products like ADLINK’s VPX3010, (Figure 1) system designers now have greater capability to collect, store, analyze, and share data, and more scope to convert that data into good, timely decisions. VPX is at the heart of this evolution, and will continue to be an important driver for systems designers well into the future. Simon Collins is the Senior Product Maganer at ADLINK Technology. He works within the Embedded Computing Product Segment.

The storage extensions of the Xeon D mean that the architecture is well placed to be used in on-platform server architectures, offering storage capability, and potentially additional processing resources for systems throughout the platform. This consolidation of resources into a server may allow for lower overall SWaP across the platform if individual systems don’t require their own highperformance processing and storage. VPX platforms can leverage the Xeon D architecture’s capabilities to improve security and efficiency of the network. To simplify the implementation of distributed computing at the edge of the network, fog computing enables secure and interoperable data exchanges between fog subsystems containing high performance edge node applications communicating with each other on a local area network (LAN), and other nodes and subsystems that are connected over a wide area network (WAN). In order to optimize both processing overhead and network bandwidth efficiency, fog computing enables the edge devices to be configured so that only “data of interest” is forwarded to the WAN. Leading this technological evolution is the ADLINK VPX3010 processor blade with 12-core Intel Xeon Processor D-1500 SoC, which implements Intel’s new micro-server architecture to introduce the high performance computing power formerly limited to larger form factors into embedded environments. This VPX processor blade includes dual

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Using the updated VITA 65 Standard to build faster high performance systems By Ken Grob


ates supported by new single board computers (SBCs) and Ethernet switches now require backplanes to operate at 8 G/T per second for PCIe Gen 3, and up to 10 Gbaud for 10GBASE-KR Ethernet. In the case of Ethernet, the rates have increased from 3.125 Gb to 10.3125 Gb per lane. To address this significant speed increase, new backplane designs are required.

VPX adapts to a changing industry Technology trends are also driving changes to the OpenVPX standards. New signaling rates of 8 Gb/sec for PCIe Gen3, and 10 and 40 Gb/s for Ethernet are addressed in the third major release of OpenVPX, which is now comprised

Over the past five years, 3U OpenVPX has been the architecture of choice to implement rugged military electronic systems. Application areas include Command, Control, Communications, Computers, Intelligence, Surveillance and Reconnaissance (C4ISR), Electronic Warfare (EW), radar, and network communications. Current technology roadmaps show that signaling rates for PCIe and Ethernet are rapidly increasing and that the mentioned applications are sure to utilize all of the incremental bandwidth.

of two documents - VITA 65.0 and VITA 65.1. The primary specification information is contained in VITA 65.0, with additional Slot and Module definitions moved to VITA 65.1 In addition to the updates for PCIe and Ethernet protocols, other necessary features included in the specification’s update include: ›› Backplanes supporting high speed Control and Data planes ›› Radial clock lines to provide a means for more accurate skew-adjusted clock ›› A defined timing Board profile, SLT3x-TIM-4S16S1U2U1H-14.9.1-n to allow a central source of radial clock (Figure 1) ›› Ref Clock increased from 10 MHz to 100 MHz ›› New I/O connectors are addressed with VITA 67.3, allowing for new connector apertures supporting both RF and fiber optic I/O using MT ferrules ›› High power VITA 62 power supply slots Standards that drive the use of the new VPX features include the U.S. Army’s CMOSS (C4ISR/EW Modular Open Suite of Standards). In order to test many of these new features, a backplane profile (BKP3-TIM12-15.3.6-n) has been created that addresses this CMOSS architecture (Figure 2).

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Elma Electronic





one fiber optic connector, with up to 12 individual fibers. VITA 67.3 addresses similar I/O configurations supported by VITA 67.1, VITA 67.2, and VITA 66.4. In addition to the I/O, Slot profiles now describe the interface to new high-speed Ethernet switches supporting Gigabit – and 10 Gigabit – Ethernet rates.

NEW CONNECTORS, WHICH ADDRESS THE VITA 67.3 STANDARD, CAN NOW BE IMPLEMENTED IN THE DESIGN OF VITA 65.0 BACKPLANES. Growing supplier ecosystem and support VPX suppliers will build VPX boards that conform to the new OpenVPX profiles. Vendors, such as Elma Electronic and others, will address deployment backplanes built for high-speed data transmission and newly introduced profiles. In fact, a 12-slot

Backplane and connector technologies critical to program needs Actual program needs will address specific backplane topologies, which may have reduced a slot count. The topology diagram at the top of Figure 3 shows the presence of two primary domains. Note that most of the interconnects between slots are accomplished via Ethernet. The backplane supports rates from 1 GBASE-KX up to 40 GBASE-KR.


A defined timing Board profile is one of the new features of the updated VITA 65 specification


This BKP3-TIM12-15.3.6-n profile addresses a CMOSS architecture.

New connectors, which address the VITA 67.3 standard, can now be implemented in the design of VITA 65.0 backplanes. This allows new connector apertures to adapt to evolving connector placements, which can be used to implement radio-frequency (RF) payloads, timing cards, and RF switches. The architecture also includes the use of expansion plane connections from standard SBCs via PCIe, shown in two groups as Slots 3, 4, and 5 as well as Slots 8, 9, and 10 in Figure 3 on following page. The new I/O scheme allows mixed I/O including RF and optics. In this example, the payload slots are fitted with VITA 67.3 combo connectors that support up to four RF connections, and

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backplane has recently been designed, built and tested to support a variety of Slot profiles for Payload (SBCs), Peripheral (high speed network switches) and Storage. With

options to allow for the latest RF and fiber optic interconnects, this newest, major release of VITA 65.0 (VITA 65.x2017) allows rear I/O transition of analog and fiber optic high density signals to be passed through the backplane.

Interoperable high-speed system architectures The third release of the OpenVPX standard will allow system designers to build the latest high speed systems using the next generation of SBCs, switches, and backplanes. The updated standard supports the transition to embedded 10 Gbit Ethernet, supports new radial clock techniques necessary for high performance analog and digital systems, and OpenVPX provides the module and slot profile definitions to support open systems development as well as a means to develop standard, interoperable, offthe-shelf payload modules.


New connector apertures, such as expansion plane connections, ensure VITA 65 meets evolving connector placements.

Ken Grob is the Director of Embedded Technologies at Elma Electronic.

Verotec Integrated Packaging • Ph: 603.821.9921 • • 19”DIPLOMAT AND VEROTEC CASES Stylish desktop cases for 19” systems


Standard Veroshield EMC screened and IP sealed Eurocard mounting


Horizontal and vertical board mounting 19” Rack Mount and Desktop Systems TecSYS ‘Ready to Run’ Development Systems


DIN41494 and IEC60297 general purpose IEEE1101.10/11 for cPCI , VPX, VME64x, PXI etc. MIL-STD-167 IEEE1101.10/11 for rugged applications


VME, VME64x, VXI. OpenVPX, cPCI and PXI Custom Design Capability



Intelligent, ltered and standard 19” 1U fan trays

20 - 240W General Purpose 200 - 600W PICMG 2.11

Instrument Cases • Card Cages • Integrated Systems • 19” Fan Trays Backplanes and Extenders • Rack Cases • Pluggable PSU

TecServ + Modication Services

Continuing 50 years of excellence in functional and elegant electronic packaging


Standard, modied and custom products and systems to meet specic requirements

26 | VITA Technologies Resource Guide Spring/Summer 2017


3U VPX H.265 (HEVC) video encoder with dual 3G-SDI inputs “Every single pixel matters if the operator of the vehicle, such as a reconnaissance plane or drone, is going to accurately determine whether a target is friend or foe,” comments Selwyn L. Henriques, president and CEO of EIZO Rugged Solutions. The EIZO Rugged Solutions Condor VPX-H265-SDI is a rugged 3U VPX H.265 High Efficiency Video Encoding (HEVC) video/audio encoder featuring dual 3G-SDI inputs and support for CoT (Cursor on Target), KLV (Key Length Value), and VANC (vertical ancillary data) metadata insertion Information such as a plane’s GPS coordinates, speed, altitude, and other closed caption data can be streamed efficiently in non-picture regions of the frame. The Condor video encoding and streaming solution is designed for harsh field environments such as manned and unmanned airborne applications where low-latency encoding, streaming, and low power consumption are essential. “For airborne applications, this contextual metadata is a key requirement and without it, operators or analysts cannot make informed decisions,” adds Henriques. EIZO Rugged Solutions | |

3U VPX rugged server boasts performanc The march to improved size, weight, and power metrics for servers is never-ending, each generation improving the ratios thus opening the door to more applications. The Concurrent Technologies TR G4x/msd boasts an Intel Xeon processor with up to 64 Gbytes of soldered Error Correcting Code (ECC) DDR4 memory. Rear connectivity includes dual Gigabit Ethernet for control, dual 10-Gigabit Ethernet for data and a x16 PCI Express pipe for direct connection to graphics processing unit (GPU) and field-programmable gate array (FPGA) accelerators. The default boot device on TR G4x/msd is a 64 or 128 Gbytes solid-state drive (SSD) module designed for use in hostile environments. Additional on-board mass storage options include a 2.5-inch SSD or up to two M.2 module adapters. The 2.5-inch SSD connects to the front panel I/O module and is a solution for high capacity, air-cooled deployments. For air and rugged conduction-cooled environments, the M.2 adapters fit directly to the base board via higher speed PCI Express connections and utilize the NVMe protocol, which is designed to work best with SSDs. Various RAID modes are supported when using a pair of M.2 modules, offering application performance and reliability options. The Intel Xeon processor D-1500 family used on TR G4x/msd is available with up to 16-cores, enabling board variants to be optimized for high compute performance or lower power consumption. Concurrent Technologies | |

Industry’s first DDR4 high density secure memory device Memory solutions optimized for density while withstanding the harshest operating environments are a rare breed. Mercury Systems, Inc. Advanced Microelectronics Center (AMC) announced the latest development in its high density secure memory product line, integrating double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) with its size, weight, and power (SWaP)-efficient packaging technology. Replacing up to 18 industrial or commercial DDR4 devices with a single military-hardened component, Mercury delivers space savings, up to 75 percent, in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Defense prime contractors now have a trusted supplier of compact, military-grade DDR4 memory for high-speed, low-power, mission-critical subsystems. The three-dimensional packaging technology developed transforms a two-dimensional array of discrete memory devices into a single, vertically stacked, dense BGA package without sacrificing the benefits of DDR4 adoption. Component selection and integration is optimized through advanced thermal, mechanical, and electrical modeling. Mercury’s precision engineering delivers the robust mechanical integrity needed to withstand the harshest of operating environments. For enhanced board-level reliability over commercial memory devices, lead alloy solder is used for the mechanical and electrical interface to the customer’s mission computing subsystems. All high-density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA) trusted facility. Mercury Systems | |

28 | VITA Technologies Resource Guide Spring/Summer 2017

VITA Technologiess Resource Guide

2017 RESOURCE GUIDE INDEX Company Category Page Advantech Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating Systems and Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Annapolis Micro Systems, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Artesyn Embedded Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 Curtiss-Wright . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Dawn VME Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Dawn VME Products, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Elma Electronic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Extreme Engineering Solutions (X-ES). . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Innovative Integration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PMC/XMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Innovative Integration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Interface Concept. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Interface Concept. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Intermas, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Enclosures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Kontron. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 LCR Embedded Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Phoenix International . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 Pixus Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Techway. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . FMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Themis Computer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VPX/OpenVPX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Vector Electronics & Technology, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . VME . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37


Subrack InterProtect® – Maximum protection up to IP66


Intermas develops electronic enclosure systems:

ĄĄ InterProtect® – protection up to IP66 by ingenious and unique construc-

Cabinets, housings, subracks, and an extensive range of accessories for the 19" rack systems and small form factors used in the fields of PCI, VME/VME64x, cPCI, IEEE, and communication applications with state-of-the-art EMI- and RFI-shielded protection.

ĄĄ InterProtect® is well suited for tough environments such as tropical

Intermas has an extensive product range of more than 10,000 separate components and more than 30 years of experience.

Go to for our new catalog.

tion with sealing that strictly complies to all 19 inch system dimensions.

regions where humidity up to 100% or in deserts with sandstorms.

ĄĄ For use in railways, defense, and naval applications as well as all other

applications requiring special protection of electronics.

ĄĄ Robust shock and vibration resistance in accordance railway and military

standards up to 20g/200 ms.

ĄĄ Heat generation can be dissipated through integrated heat sinks in the

top and bottom modules. ĄĄ Standard subrack has an overall depth of 295.4 mm and is designed for PCB depths 160, 220 and 240 mm and typical 19 inch width (84 HP). Special widths can be produced easily. ĄĄ Subrack is hermetically sealed with a special conductive silicone sealing. Therefore, an optimal EMV/ESD-protection is provided.

Intermas US, LLC

30 | VITA Technologies Resource Guide Spring/Summer 2017  1-800-811-0236 

<<Title>> <<Description>>

Ultra-Low Latency DRFM Mezzanine Cards & High Bandwidth Mezzanine Cards

Ultra-Low Latency DRFM-Optimized Mezzanine Cards have been designed from the ground up for latency sensitive DRFM applications. The Board Support Interface, which is available in VHDL or Open Project Builder, was also designed from the beginning to be suited for DRFM applications. This interface provides a Digital Bypass Mode to achieve the lowest possible latency and a Fabric Space Mode to allow the user to do additional processing of the ADC data before returning it out the DAC. The Fabric Space Mode adds as little as 13ns of latency. The Board Support Interface also includes a built-in Bypass FEATURES Delay. This allows the user to “walk” the latency out from the minimum Digital Bypass latency to slightly beyond the Fabric ĄĄ <<Feature 1>> Space latency, providing for a smooth transition between the two modes. Open Project Builder, Annapolis’ Design Tool, allows ĄĄ <<Feature 2>> the user to design a DRFM-optimized application in minutes. ĄĄ


<<Feature 3>>

ĄĄ <<Feature 4>> Single or Dual Channel available running at up to 5.0 GSps eachĄĄ <<Feature 5>>

Ultra Low latency from ADC SMA input to DAC SMA output • Digital Bypass Mode (SMA-to-SMA): as low as 15ns • Fabric Space Mode (SMA-to-SMA): as low as 23ns


<<Feature 6>>


<<Feature 7>>


Digital Bypass Mode has built-in run-time adjustable delay providing additional ĄĄ <<Feature 8>> delay from 0ns up to 124 Sclk periods


Firmware and Software Board Support Interface provided in Open Project Builder ĄĄ <<Feature 9>>


Converter channels can be synchronized


<<Feature 10>>

High Bandwidth Mezzanine Cards have been designed from the ground up for maximizing data throughput.

WFMC+ enabled cards include 32 high speed serial lanes and 100 LVDS lines to accommodate even the most bandwidthhungry ADC or DACs. All Annapolis wide-bandwidth mezzanine cards deliver high channel counts, allow for synchronization across multiple cards, and have flexible high-precision trigger options. These rugged COTS mezzanines are optimized for high-performance operation in Wireless Communication, SATCOM Uplink/Downlink, Phased Array RADAR, SIGINT, and EW.


Channels: 1-16


Sample Rate: Up to 6.0 GSps


Resolution: 10-16 bits


Firmware and Software Board Support Interface provided in Open Project Builder


Converter channels can be synchronized

Company Annapolisname Micro Systems, Inc.

<<magazine_url>>/<<product_id_number>> 

<<contact email>>

<<website_url>>  <<linkedin>>

  <<phone>>  410-841-2514 @<<twitter_name>>

VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Technologiess Resource Guide

<<Category>> FMC

VITA Technologiess Resource Guide


FMC Family of Modules FMC modules were created to provide a standard mezzanine card form factor, connectors, & modular interface to an FPGA located on a base board (carrier card). Decoupling the I/O interfaces from the FPGA in this manner simplifies I/O interface module design while maximizing module reuse. Our FMC modules cover a multitude of applications – Seismic DAQ, Audio & Acoustic Testing, ATE, Real-time control systems, machine learn system, remote embedded communications, Medical Imaging, Wireless Receiver & Transmitter, RADAR, and High Speed Data Recording & Playback. Our FMCs are compatible with our our SoC computers: Single Board/ Cardsharp, COPious-PXIe, and COPIous-PCIe; FPGA carriers: XU-COP, XU-COP. Create customized, turnkey, embedded instruments with our embedded PCs – ePC-K7 and Mini-K7. Online pricing and datasheets are available at

FEATURES ĄĄ FMC-1000: 2x 1250 MSPS 14-bit A/D, 2x 1250 MSPS 16-bit DAC ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ ĄĄ

with PLL and Timing Controls FMC-500: 2x 500 MSPS 14-bit A/D, 2x 1230 MSPS 16-bit DACs with PLL and Timing Controls FMC-310: 2x 1250 MSPS 14-bit A/D, 2x 1250 MSPS 16-bit DAC with PLL and Timing Controls FMC-25: 2x 250 MSPS 16-bit A/D, 2x 1230 MSPS 16-bit DACs with PLL and Timing Controls FMC-SERVO: w/(8) 16-bit, 500 kSPS A/D Channels; (8) 16-bit D/A Channels with onboard PLL FMC-SDF: four 24-bit, 625 kSPS A/D Channels; two 18-bit D/A Channels with on-board timing controls FMC-QSFP: Dual QSFP+ Ports Up to 40 Gbps per port (IEEE 802.3ba)

Innovative Integration

  805-383-8994


WildcatFMC – High-speed Optical FMC for Harsh environments High-speed optical communication has emerged as a necessary requisite for high-end calculator in real-time. Their presence in harsh, demanding environments has become the new paradigm. In 2015, TechwaY pioneered the TigerFMC – a FMC card for highbandwidth optical communication based on SAMTEC FireFly technology. Two years from then, TigerFMC is the flagship product of our FMC range, used by Defense and Avionic key players in the global market. Capitalizing on this success, TechwaY goes beyond the state-of-the-art FMC technology with the new WildcatFMC series. These new communication boards are dedicated to markets where customers have strong environmental and high-bandwidth data-management requirements. Based on D-Lightsys® technology from Radiall, the WildcatFMC range draws on the FMC and the new FMC+ standard. It features three configurations: TM

• WildcatFMC_4x4 – 4 full duplex channels @ 10 Gbps, VITA 57.1 card • WildcatFMC_10x10 – 10 full duplex channels @ 10 Gbps, VITA 57.1 card • WildcatFMC_12x12 – 12 full duplex channels @ 12 Gbps, VITA 57.4 card

FEATURES ĄĄ Designed for strong environmental requirements ĄĄ Fully FMC & FMC+ compliant

ĄĄ D-Lightsys Technology from RADIALL ĄĄ Protocol agnostic

ĄĄ Support 10/40 GbEthernet

Thanks to the VITA FMC and FMC+ compliance, our mezzanines can easily be integrated in existing system or in brand-new architecture. WildcatFMC series is compatible with both air and conduction cooled environment.

ĄĄ Front or rear I/O: MTP connector or MT ferrules


  003 316 453 3790

32 | VITA Technologies Resource Guide Spring/Summer 2017

ĄĄ Programmable oscillator

Processing with Zynq UltraScale+ MPSoC In 2017, Annapolis introduced four high-performance FPGA boards that integrate a powerful Xilinx Zynq® FEATURES UltraScale+™ MPSoC (Zync+) controller. The quad-core Features ARM’s higher performance eliminates the need for a ĄĄ General • Three (6U) or one (3U) Xilinx Ultrascale(+) FPGAs separate Single Board Computer (SBC) in many digital • – Hard 8x (6U) or 4x (3U) PCIe Gen3 endpoint for DMA and • register access signal processing systems. The Zynq+ features a 64-bit quad-core ARM Cortex-A53 running up to 1.3 GHz, plus a dual-core 32-bit Cortex-R5 real-time processor running up to 533 MHz. This is a significant upgrade from the Zync-7000 SoC. ®

The Zynq+ memory bandwidth also surges, with DDR4 DRAM now running up to 1200 MHz. In addition to higher performance, the Zynq+ is Xilinx’s most secure solution – it has multiple levels of hardware and software security. The four new Annapolis boards with Zynq+ are spread across three form factors – 6U OpenVPX, 3U OpenVPX, and PCIe – and are available in air or conduction-cooled configurations.

• • • • • • • • • • •

– FPGAs programmable from attached flash or Annapolis provided software API – 16 or 20-nm copper CMOS process – DDR4 DRAM ports on all FPGAs running up to 2400 MT/s Xilinx Zynq UltraScale+ MPSoC Controller – Quad-core 64-bit ARM Cortex-A53 running up to 1.3GHz – Dual-core 32-bit Cortex-R5 processor running up to 533 MHz – 4 GB (6U) or 2 GB (3U) 64-bit (6U) or 32-bit (3U) DDR4 memory running up to 1200 MHz – Multiple levels of hardware and software security A Full BSP using Open Project Builder for Fast and Easy Application Development • System Management • Hot Swappable

ĄĄ OpenVPX Backplane I/O

• 24 (6U) or 20 (3U) HSS I/O lanes to VPX Backplane for 60 (6U) or 50 (3U) GB/s of Full Duplex Bandwidth • Two PCIe Gen3 8x (6U) or 4x (3U) Connections to VPX Backplane • Backplane Protocol Agnostic connections support 10/40Gb Ethernet, IB capable, AnnapMicro protocol and user designed protocols • Radial Backplane Clock Support for OpenVPX backplane signals AUXCLK and REFCLK

ĄĄ Front Panel I/O

• Wild FMC+ (WFMC+) next generation I/O site based on FMC+ specification • – Accepts standard FMC and FMC+ cards (complies to • FMC+ specification) • Up to 32 HSS and 100 LVDS connections to FPGA

ĄĄ Mechanical and Environmental

• Available in Extended Temperature Grades • Air or Conduction Cooled Path • RTM available for additional I/O

Annapolis Micro Systems, Inc.

  410-841-2514

VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Technologiess Resource Guide


VITA Technologiess Resource Guide

Operating Systems and Tools

Industry-Leading Board Support Package Annapolis Micro System’s high-performance FPGA-based Boards and Systems are supplied with the most comprehensive and easiest-to-deploy BSP, reducing programming time from weeks to just days. Here’s why: • Tested and proven interfaces to all board components with examples:

» Clock » GPIO » MMC


» PCIe DMA » 40/10GbE » Register Access

» Fan » MDIO Bus » Crossbar

» Interrupt Handling » Processing Element » SPI

» Sensor » SMA

• Dozens of valuable included IP Cores that conform to latest Xilinx and Intel Altera architectures • Tight synchronization of 10s or 1,000s of A-D and D-A channels – with NO manual tuning • Integration with latest technology, including full access to Xilinx Zynq+ MPSoC via PCIe • Optional distribution via GitHub, for automatic updates • All operating within the integrated and agile Wild40 EcoSystem™ Note: Annapolis supports customers at the level they are comfortable working at, Level I through Level IV. The capability of Level III and Level IV are only available from Annapolis Micro Systems. All levels are included with every board purchase.

ONE TOOL, TWO PATHS Open Project Builder™ VHDL Toolflow Open Project Builder™ GUI Toolflow

Whichever path you choose, you can rest assured knowing that your application is built on a solid foundation off our 35 years of FPGA knowledge and experience. Annapolis Micro Systems, Inc.

34 | VITA Technologies Resource Guide Spring/Summer 2017   410-841-2514

OpenVPX Backplanes & Chassis Platforms Are you ready for a better experience for your OpenVPX backplane and chassis platform design? Then it‘s time to try Pixus Technologies. Our knowledgeable team will guide you through the process and help you find a cost-effective solution that meets your application‘s specific requirements. Pixus has a wealth of standard backplanes and modular OpenVPX enclosure platforms as a framework to start your tailored design. Whether it‘s a rugged chassis/ATR that meets MIL-704, 810, or 461, or a 19" rackmount design, Pixus has an OpenVPX solution for you.

FEATURES ĄĄ OpenVPX backplane expertise with various standard configurations ĄĄ Virtually unlimited options of OpenVPX chassis platform designs ĄĄ Integrated system management options ĄĄ Rugged conduction-cooled or convection-cooled options ĄĄ Options for full systems with OpenVPX SBCs, FPGAs, & specialty


ĄĄ 40G backplanes, other high-speed options

Enclosures Cases Subracks Backplanes Chassis Integrated Systems Components

Pixus Technologies

  519-885-5775

 @pixustech PMC/XMC

XMC Modules Kintex UltraScale & Virtex Advantage Introducing cutting-edge I/O without the increased investment and risk required to include such new technology in larger, fully custom products. The XU-TX is an XMC module which features two AC-coupled single-ended 16-bit DAC outputs with programmable DC bias. The DAC devices employed support synchronization, interpolation, and their unique output circuits allow improved frequency synthesis in the 2nd Nyquist zone. This can shift the Nyquist null frequency in the output spectrum to two times the typical Nyquist null frequency. The maximum sample rate of the DAC IC is 12 GSPS, the maximum external direct clocking rate is 6 GSPS and the on board PLL can generate clocks up to 4.8 GHz. The DACs’ JESD 204B interfaces can stream data with transfer rates up to 6 GSPS. The XA Family provides an extremely economical solution for real-time, FPGAaccelerated stimulus-response applications such as RADAR, LIDAR, optical servo or medical scanning. Mated with one of our rugged, embedded PCs, the XA-160M becomes an autonomous, self-booting instrument with dual, 10 GbE connectivity – perfect for distributed instrumentation. Applications: High Speed Arbitrary Wave Generation, Wireless MIMO transmitter, RADAR Waveforms, Electronic Warfare, Medical Scanning & Imaging, Optical servo, LIDAR, Servo Control, High speed stimulus-response, and more. Online pricing and datasheets at

Innovative Integration

FEATURES ĄĄ XU Series: 4GB component memory system, Eight x 16 2400 MHZ


DDR4 SDRAM sync bandwidth of 20 GB/s! One x 18 600 MHz QDR SRAM bandwidth to 72 Mbit XU-TX 12 GSPS: 2 channel 16-bit transmitter XU-RX 4 GSPS: 2 channel 12-bit receiver XU-RT 2.8 GSPS: 2 channel 12-bit transceiver XA-160: Two 160 MSPS A/Ds, Two 615 MSPS DACs & Artix-7 excellent for stimulus response, ultrasound & servo control XA-RX: Eight 125 MSPS A/Ds & Artix-7– excellent for RADAR & high speed servo control XA-TX: Eight 300 MSPS DACs & Artix-7 – excellent for Wireless Transmitter, RADAR & Pulse Generation  805-383-8994 

VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Technologiess Resource Guide


VITA Technologiess Resource Guide


MVME250X Series VME64x SBC with NXP QorIQ P2010/P2020 The Artesyn Embedded Technologies MVME250X series features the NXP® QorIQ® single-core P2010 or dual-core P2020 processor. It is a cost-effective migration path for older generation MVME3100, MVME4100, MVME5100 and MVME5110 boards. The MVME2500 series is ideal for automation, medical, and military applications such as railway control, semiconductor processing, test and measurement, image processing, and radar/sonar. Memory includes up to 2GB DDR3 and 512KB non-volatile MRAM. The MVME2502 variant has 8GB soldered eMMC solid state memory for additional rugged, non-volatile storage. Connectivity includes Gigabit Ethernet, USB2, serial, SATA and either one or two PMC/XMC sites. A hard drive mounting kit and conformal coating are available. Leveraging 30 years of development expertise, Artesyn is committed to supporting the MVME2502, and other Power Architecture® processor based SBCs in our VME portfolio, until at least 2025.

Artesyn Embedded Technologies


800 MHz, 1.0 GHz or 1.2 GHz NXP QorIQ P2010 or P2020 processor


Up to 8GB soldered memory


Optional rear transition module


Extended temperature and rugged variants


Unmatchable longevity of supply enables long lifecycle programs and protects investment

 +1 800-759-1107

 

OpenSystems Media works with industry leaders to develop and publish content that educates our readers. High-Speed, Real-Time Recording Systems (Third Edition) By By Rodger Hosking, Pentek, Inc. In today’s world of high-speed A/D converters operating in the gigahertz range, real-time signal recording has become a challenging task that requires specialized hardware and intelligent application software. When designing a real-time recorder capable of streaming sustained data to disk at rates of up to 3 GB/sec and higher, the system developer has to consider the limitations presented by the recorder’s operating and file systems, the limitations of disk drive technology, the hardware interfaces, and the RAID controller technology.

36 | VITA Technologies Resource Guide Spring/Summer 2017

Check out our white papers at white-papers/


cPCI, PXI, VME, Custom Packaging Solutions VME and VME64x, CompactPCI, or PXI chassis are available in many configurations from 1U to 12U, 2 to 21 slots, with many power options up to 1,200 watts. Dual hot-swap is available in AC or DC versions. We have in-house design, manufacturing capabilities, and in-process controls. All Vector chassis and backplanes are manufactured in the USA and are available with custom modifications and the shortest lead times in the industry. Series 2370 chassis offer the lowest profile per slot. Cards are inserted horizontally from the front, and 80mm rear I/O backplane slot configuration is also available. Chassis are available from 1U, 2 slots up to 7U, 12 slots for VME, CompactPCI, or PXI. All chassis are IEEE 1101.10/11 compliant with hot-swap, plug-in AC or DC power options.


Made in the USA

Our Series 400 enclosures feature side-filtered air intake and rear exhaust for up to 21 vertical cards. Options include hot-swap, plug-in AC or DC power, and system voltage/temperature monitor. Embedded power supplies are available up to 1,200 watts.


Most rack accessories ship from stock

Series 790 is MIL-STD-461D/E compliant and certified, economical, and lighter weight than most enclosures available today. It is available in 3U, 4U, and 5U models up to 7 horizontal slots.


Card sizes from 3U x 160mm to 9U x 400mm


System monitoring option (CMM)

All Vector chassis are available for custom modification in the shortest time frame. Many factory paint colors are available and can be specified with Federal Standard or RAL numbers.


AC or DC power input


Power options up to 1,200 watts

For more detailed product information, please visit


Modified ‘standards’ and customization are our specialty


or call 1-800-423-5659 and discuss your application with a Vector representative.

Made in the USA Since 1947

Vector Electronics & Technology, Inc.

  800-423-5659

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MIC-6330 3U OpenVPX CPU Blade The MIC-6330 is based on the Intel® Xeon® Processor E3 Lv5 with 16GB DDR4 ECC, offering server grade compute with maximum reliability. Its low-power, conduction cooled design fits rugged needs and its configurability enables various backplane topologies. The MIC-6330 offers the highest PCIe gen.3 dataplane I/O throughput. The Intel graphics engine supports resolutions up to 4K, and multiple displays. Five GbE ports provide front and rear LAN connectivity, while the PCH offers a rich I/O set. For projectspecific applications, a PCIe x8 gen.3 X8D XMC site can host high-speed offload or I/O mezzanines. For maximum expandability, the XMC interface can be modified to add another DisplayPort and extra UARTs. An optional front panel module facilitates development and qualification.


OpenVPX MOD3-PAY-2F2U-16.2.3-3 profile compliant 2/4-core Intel® Xeon® Processor E3 Lv5 and 6th Generation Intel® Core® Processors with 16GB DDR4 ECC


Four GbE ports


Configurable PCIe x2, x4 or x8 Data Plane


Optional front panel module with VGA, GbE and USB


Multiple display support

Advantech Co. Ltd


 1-888-576-9668

 @AdvantechNCG


Ruggedized Systems and High Temperatures Ruggedized COTS systems from Annapolis Micro Systems are designed to withstand the harshest environments. From the bitter cold of an Antarctic radar station to the hottest deserts of the Middle East, Annapolis equipment is real-world deployed in the most demanding embedded applications. Cooling Options Depending on the application, Annapolis chassis are robustly designed using Air, Conduction, or Liquid cooling. During the design process, every board and system is simulated for thermal performance, then subjected to hours of grueling operation to verify its ability to withstand temperature stresses. Independently Verified Annapolis verifies environmental conformance of its equipment to stringent standards such as MIL-STD-810 and RTCA/DO-160 (for airborne equipment).

Annapolis Micro Systems, Inc.

Thermal Model of an Annapolis Forced-Air, Conduction-Cooled 3U OpenVPX Chassis

Designed & Manufactured in USA All Annapolis products are engineered and manufactured under one roof in the United States. This co-location of engineering and manufacturing allows for more aggressive design, and better quality control and production flexibility. Made in the USa

38 | VITA Technologies Resource Guide Spring/Summer 2017  410-841-2514 

Data Storage Solution Offers Highest Density When Storage capability is needed, Annapolis offers the highest density OpenVPX storage solutions on the market. Available in 6U and 3U form factors, the WILD Data Storage Solution features a removable hot swappable canister with a connector rated for 10,000+ mating cycles. The WILD Solution comes with standard images to support XAUI, 40GbE and AnnapMicro Protocol (Annapolis low FPGA utilization, full flow control protocol ideal for inter-FPGA communication). The WILD Data Storage Solution is comprised of two pieces fitting in a single 1" OpenVPX slot: the “Storage Canister” and the “Storage Carrier” that plugs into the VPX FEATURES backplane and holds the disk canister. ĄĄ


Annapolis is famous for the high quality of our


products and for our unparalleled dedication to


ensuring that the customer’s applications succeed. ĄĄ

We offer training and exceptional special application development support, as well as more conventional support.


3U boards feature 8 TB (currently) or 16 TB (available in late 2017) Storage Depth and 5-7 GB/s Bandwidth 6U boards feature 16 TB (currently) or 32 TB (available in late 2017) Storage Depth and 10-14 GB/s Bandwidth Backplane I/O using PCIe or 40Gb Ethernet Scalable Depth and Bandwidth using multiple Storage Cards Hot Swappable Drive Canister with 10,000 Insertion Cycles & Hot Swappable Carrier (exclusive to WILDSTAR OpenVPX EcoSystem) 6U/3U OpenVPX (VITA 65) Compliant, 1" VITA 48.1 spacing


Air Cooled or Conduction Cooled


Proactive Thermal Management

Annapolis Micro Systems, Inc.

  410-841-2514

VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Technologiess Resource Guide


VITA Technologiess Resource Guide


DO-254 / DO-178C Safety Certifiable Mission Computer Today’s challenging airborne missions need powerful systems. While DO-254/DO-178C safety certification of these systems is imperative, development is also complex, time-consuming and costly, which leaves developers frantically trying to decipher the regulating authorities’ requirements while maintaining their time to market schedule and budget. Certification also poses certain risks and challenges for end users needing to change their mission profiles during an aircraft’s lifecycle. Curtiss-Wright, Hensoldt and CoreAVI have partnered to create a new Safety Certifiable Mission Computer that delivers both safety critical functions and high performance – all in one rugged chassis. Hensoldt can provide system/equipment design and qualification along with platform and application software.

Curtiss-Wright Defense Solutions

FEATURES ĄĄ Multi-core processing technology

ĄĄ DO-254/DO-178C DAL C Safety Certifiable with available

artifact kits

ĄĄ Multi-channel video capture and HD graphics with analog

and digital interfaces

ĄĄ FACE-compatible

ĄĄ Highly robust, reliable, and SWaP-optimized ĄĄ ITAR-free

ĄĄ Building blocks allow system to be available for rapid

prototyping as requirements evolve  703-779-7800  @curtisswrightds  


Fabric Mapping Modules Dawn OpenVPX backplane Fabric Mapping Modules simplify topology customization. Dawn VME Products FABRIC MAPPING MODULES automate optimization of OpenVPX backplane topologies. Newly patented FMM micro-overlays quickly customize off-the-shelf OpenVPX backplanes to mission requirements. Fabric Mapping Modules allow designers to work with flexible configurations of high speed links. Off-the-shelf backplanes can be quickly customized to mission requirements without the time and expense required for new backplane designs, a critical advantage when schedules are compressed by late system changes. Dawn engineers have successfully used Fabric Mapping Modules to solve many OpenVPX application problems in the design phase.

FEATURES ĄĄ Off-the-shelf backplanes can be quickly customized to mission


ĄĄ Optimize the communication topology between slots within a system’s


ĄĄ Customize inter-slot communications to meet unique system


ĄĄ Improve signal integrity between system cards beyond requirements of

PCI Express, Serial Rapid I/O and 10Gbit (XAUI) Ethernet standards

ĄĄ Directly connect PCI Express or SerialRapid I/O to multiple cards or

cards and switches

ĄĄ Link SATA from a CPU card to a Solid State Drive (SSD) carrier ĄĄ Enable XMC cards to talk to other XMC cards or other I/O like

PCI Express links

Fabric Mapping Modules provide a natural migratory development environment for moving from the lab to the field with high speed OpenVPX backplanes.

ĄĄ Facilitate rear backplane I/O connections and low profile connector

Dawn VME Products  800-258-DAWN (3296) • 510-657-4444

40 | VITA Technologies Resource Guide Spring/Summer 2017

interface systems when normal transition modules do not fit the system application envelope 

PSC-6238 800 Watt 3U OpenVPX Conduction Cooled Power Supply The PSC-6238 is designed to operate in a military environment over a wide range of temperatures at high power levels, is extended shock and vibration compliant per MIL-STD-810F and features an onboard real-time clock with switchable Battleshort and NED (Nuclear Event Detect) functions. Dawn’s PSC-6238 is a wedge lock conduction cooled module on a 1 inch pitch with an operating temperature of -40°C to +85°C at the wedge lock edge. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. The PSC-6238 front I/O panel includes a 3-color LED status indicator, VBAT battery access and a USB port for status display, access menu control and firmware upgrade. Dawn’s embedded RuSH™ Rugged System Health Monitor technology provides for intelligent monitoring and control of critical system performance parameters including voltage, current, temperature and control of power sequencing and shutdown of all voltage rails.

Dawn VME Products


True 6 Channel supply provides full OpenVPX support


Wedge lock conduction cooled module


Up to 800 Watts power output with 1 inch pitch form factor


Onboard embedded RuSH™ technology actively monitors voltage, current, temperature and provides protective control


Factory programmable power sequencing of all voltage rails


Shutdown control for each power rail


Over Voltage, Over Current and Over Temp protection

  800-258-DAWN (3296) • 510-657-4444


3U and 6U Open VPX Backplanes Elma Electronic is the leader in VITA 46/65 VPX and OpenVPX products. Our experts developed the industry’s first VPX backplane and we continue to be the innovation leader as signal speeds and system complexities increase. VPX systems present design challenges due to higher layer-count backplanes, and more demanding power and cooling requirements. At Elma, we tackle these problems with extensive signal integrity analysis and verification plus thermal simulation and functional testing to produce the most reliable backplanes on the market. That’s why our partners as well as our customers rely on Elma to address their VPX backplane requirements. We offer the largest variety of 3U and 6U OpenVPX profiles with over 35 products to choose from in slot counts from 2 up to 12. Configurations are available with standard copper connectivity as well as RF and optical connectivity featuring the most advanced connector options on the market. 40GBASE-KR4 support enables 40Gbps slot to slot data rates for data intensive applications. In VPX the backplane is the backbone of the system and provides the basis for successful operation. Work with Elma to design the custom backplane for your application as well as the final integrated solution.

Elma Electronic

FEATURES ĄĄ Designs supporting 1000BASE-BX, 10GBASE-KX, 10GBASE-KR,

or 40GBASE-KR4 connectivity

ĄĄ Multi-star, distributed mesh, custom versions and power and

ground only for system development

ĄĄ VME / VPX hybrid versions combining support for legacy payload

boards and the latest VPX boards

ĄĄ Versions supporting VITA 66.4 optical and 67.1 RF ports ĄĄ VITA 67.3 RF/Optical connectivity ĄĄ Signal speeds up to 12Gbps in copper and up to

12 bi-directional 25 Gbps optical lanes

ĄĄ Designed and manufactured in the United States

Made in the USa

 216-760-9909

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VITA Technologiess Resource Guide


Rugged, Innovative ATR Enclosure Designs Elma's full line of convection, conduction and liquid cooled enclosures support a wide range of rugged airborne, ground stationary and mobile defense applications. Our chassis platforms include standardized, cost effective solutions for COTS VPX, VME64x and cPCI card based systems. Available in 1/4, 1/2, 3/4, 1 and 1 1/2 ATR formats per ARINC 404A, ARINC 600 specifications, the modular design concept allows for a wide range of customization options without the high cost and lead-time penalties associated with traditional construction techniques. All aluminum or Al-Composite ATRs are designed to optimize weight while maximizing cooling in applications where space and overall equipment weight considerations are paramount. Custom front panel layouts allow for an application specific external I/O mix including 38999, M12 or commercial type connectors necessary to meet the configuration requirements for the end application. ATR enclosures use electrostatic dust filters, honeycomb EMI filters and EMI gasketing techniques to ensure compliance to MIL-STD-461E EMC requirements. All Elma ATRs are supported by the most complete line up of backplanes in the industry. Work with our engineering team to design and configure your complete system including payload boards and system level environmental test and verification.

Elma Electronic

FEATURES ĄĄ Aluminum or Composite construction ĄĄ Conduction with air assist designs ĄĄ Advanced airflow distribution through card cage ĄĄ Capacity for 5, 7, 12 or 15 slots 3U/6U x 160mm ĄĄ Full range of military power supplies from 150 to 750 watts,

MIL-STD-461E, 704E and 1275A compliant

ĄĄ MIL-STD-810F, 167 environmental compliance ĄĄ Modular design for feature set and size expansion

Made in the USa

 216-760-9909


IC-FEP-VPX6b Interface Concept’s IC-FEP-VPX6b leverages on Xilinx Virtex®-7 FPGA and NXP QorIQ T1042 technologies to offer a high-bandwidth processing 6U OpenVPX platform for demanding computing applications such as RADAR/LIDAR and Electronic Warfare. This QorIQ T1042 processor supports four integrated 64-bit e5500 Power Architecture® processor cores with high-performance Data Path Acceleration Architecture (DPAA) and network peripheral interfaces. Each of the two on-board Virtex®-7 FPGAs is coupled with two 2GB DDR3 SDRAM memory banks supporting up to 1800 MT/s. A PCIe advanced switch allows versatile coupling between the processor, the FPGAs and the fabric links of P1 VPX connector. Two FMC sites (Vita57.1) allow to interface various IOs and high resolution ADC and DAC converters to the FPGAs, providing modularity and flexibility to the carrier. Both air-cooled and conduction-cooled versions for rugged applications are available.


The IC-FEP-VPX6b is the ideal platform for customers who want to streamline development by concentrating their efforts on most critical tasks.

ĄĄ 4*Ethernet ports

Web product link:

Interface Concept

ĄĄ QorIQ processor T1042, e5500 quad core ĄĄ 2*Xilinx Virtex-7 XC7VX690T ĄĄ 1*Gen2 PCIe switch ĄĄ 1*Giga Ethernet L2 switch ĄĄ 4*PCIe x4 port ĄĄ 2*FMC slots  +33 2 98 57 30 30 or 510 656 3400

42 | VITA Technologies Resource Guide Spring/Summer 2017

IC-INT-VPX3d <<Title>>

The IC-INT-VPX3d is a high performance 3U OpenVPX Single Board <<Description>> Computer (SBC) based on server-class Intel ®XEON® processor D-15xx. This board is ideally suited for demanding computing applications such as Radar, Electronic Warfare, and is the key building block of next High Performance Embedded Computing (HPEC) systems. To reach high-speed networking performance, the IC-INT-VPX3d supports two 10GBASE-KR Ethernet ports, two Gigabit Ethernet ports, PCI Express ports on the OpenVPX backplane connector (Data Plane and Control Plane). A large array of IOs, such as USB, SATA ports expand the board capabilities. Interface Concept’s own UEFI (Unified Extensible Firmware Interface) allows implementing specific functions or services for secured and accurate power-up sequences. Products exist both in air-cooled and conduction-cooled versions. By combining this IC-INT-VPX3d to additional IC’s COTS Ethernet Switches, processing and FPGA boards, customers can efficiently optimize the integration of high-end computing systems. Web product link:

Interface CompanyConcept name <<website_url>>

FEATURES FEATURES ® ® ĄĄĄĄ Intel Xeon1>> Processor D-15xx <<Feature ĄĄĄĄ Two banks2>> of DDR4 with ECC <<Feature ĄĄĄĄ Boot flash3>> memory, external independent RTC with supercap <<Feature


ĄĄ <<Feature 4>> ĄĄ 2*10Gbe ports, 2* PCIe x4 ports, 2* GigaEthernet ports ĄĄ <<Feature 5>> ĄĄ 1*RS232 console port ĄĄ <<Feature 6>> ĄĄ 4*rear SATA interfaces ĄĄ

1*extension XMC slot PCIe x8 – or 2 * x4 <<magazine_url>>/<<product_id_number>>

 <<contact email>>  +33 2 98 57 30 30or<<phone>> 510 656 3400 <<linkedin>> @<<twitter_name>>

VPX/OpenVPX <<Category>>

<<Title>> 2-Slot Featherweight VPX Systems <<Description>> Weighing in at a SWaP-friendly under 8 lbs, designed in collaboration with industry leader ADLINK, and featuring ADLINK processor blades and Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conductioncooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles.

The system will feature ADLINK’s VPX3010 processor based on the Intel® Xeon® D, and the second slot can hold either a Gigabit Ethernet switch or an ADLINK VPX3G10 Graphics Processing Unit.

LCR Company Embedded nameSystems <<website_url>>

FEATURES FEATURES ĄĄĄĄ 2-Slot VITA1>> 48.2 VPX featuring superior cooling and processing <<Feature ĄĄ Super-efficient chassis design ĄĄ <<Feature 2>> ĄĄ Available in multiple configurations for demanding sensor ĄĄ management <<Feature 3>>applications

<<FeatureADLINK 4>> VPX3010 processor blade with the Intel® ĄĄĄĄ Features

Xeon® D processor

ĄĄ <<Feature 5>> ĄĄ Supports high-speed signaling ĄĄ <<Feature 6>> ĄĄ Removable SSD hard drive ĄĄ

Optional MIL-STD-1553 XMC card for communication with avionics bus <<magazine_url>>/<<product_id_number>>

 <<contact email>>  <<phone>>  610-278-0840<<linkedin>> @<<twitter_name>> @LCREmbedded

 

VITA Technologies Resource Guide Spring/Summer 2017 |


VITA Technologiess Resource Guide

VPX/OpenVPX <<Category>>

VITA Technologiess Resource Guide

<<Category>> VPX/OpenVPX

VX6090 –

<<Title>> 6U VPX Intel® Dual 8-Core Xeon® D Multi-Processing Board <<Description>> FEATURES:

ĄĄ Dual 8-Core Xeon® D 64-bit SoC at 2.0 GHz ĄĄ 16 GB DDR4 memory with ECC per SoC soldered on PCB ĄĄ Connectivity: Multiple 10 G & 1 G Ethernet Ports/M.2 SATA III SSD Sockets ĄĄ Extended Life Cycle and Silicon Reliability

Kontron’s VX6090 is a high-performance, multi-purpose Single Board Computer (SBC) suitable for a wide range of demanding embedded deployments. Based in Intel’s® Xeon-D® Octo Core™ server class processor, the VX6090 combines dense processing with rich standard-based communication fabrics and I/O connectivity to form an ideal, flexible platform for SWaP-constrained missions, equally suitable for streaming radar signal or image-processing and embedded server-type applications. Adding advanced security, the Kontron’s VX6090 offers security protection with trusted boot, authentication by TPM and secure boot solutions. Link:

VX3905 –

3U VPX FEATURES PCI Express and Ethernet Hybrid Switch ĄĄ

<<Feature 1>>


ĄĄ <<Feature 2>> ĄĄ Compliant with OpenVPX VITA65 profile SLT3-SWH-6F6U-14.4.1 ĄĄ <<Feature 3>> ĄĄ Up to 24 Ports/32 Lanes PCIe Switch Ą <<Feature ĄĄ 9 Port ĄGiga Ethernet 4>> Switch ĄĄ Air-cooled and Conduction-cooled Builds ĄĄ <<Feature 5>>

The 3U VPX PCI Express and Ethernet hybrid switch VX3905 is the ideal partner for the centralized backplane to efficiently handle a high bandĄĄ <<Feature 6>> width. It provides up to 24 Ports with 32 lane PCI Express Gen 1 / Gen 2 switching and additional 9 port gigabit Ethernet switching capabilities ĄĄ <<Feature 7>> for the control plane. By this it offers a tenfold increase in I/O bandwidth between computing boards in High Performance Embedded Computing applications compared to VME, unleashing a new kind of application for data processing8>> platforms used for Radar, Sonar and general image ĄĄ <<Feature processing. VX3905 is available in an air-cooled version (0°C to +55°C) and in rugged conduction-cooled version (-40°C to + 85°C). ĄĄ <<Feature 9>> Link: ĄĄ

<<Feature 10>>

VX3058 –

Octo Core Intel® Xeon® D Processor OpenVPX™ Server Blade FEATURES:

ĄĄ Fit for Virtual Machines and HPEC Applications ĄĄ Extended Life Cycle and 10-year Silicon Reliability ĄĄ Dual 10 Gigabit Ethernet, x8 PCI Express Gen3 Bandwidth ĄĄ 8 Core Xeon® Processor D, 16 GB DDR4 with ECC

Kontron’s VX3058 based on the highly integrated 8-core Intel® Xeon® D architecture brings server class computing capabilities to the battlefield with its Dual 10 Gigabit Ethernet (GbE), high bandwidth PCI Express (PCIe) 3.0, and high speed DDR4 memory. Ruggedized for harsh environments and size, weight, power and cost (SWaP-C) optimized, the VX3058 provides breakthrough digital signal processing (DSP) performance. These benefits make it ideal for demanding military server and other high performance embedded computing (HPEC) applications, especially for virtual machine architectures that can take advantage of the extensive capital and operational efficiencies provided by isolated workloads configured to dynamically share common resources. Link: <<magazine_url>>/<<product_id_number>>

Company KONTRON name


<<contact email>> <<linkedin>>

44 | VITA Technologies Resource Guide Spring/Summer 2017

 <<phone>> 888-294-4558 @<<twitter_name>> @Kontron

VP1-250-SSDX This 3U VPX SATA solid state disk module delivers high capacity, high performance data storage for military, aerospace and industrial applications requiring rugged, secure and durable mass data storage. Configurable with SLC or MLC SSDs of up to 8TB capacity, the VP1-250-SSDX is available in air cooled and conduction cooled configurations and supports AES 256 encryption. When used with supporting devices, the VP1-250-SSDX supports the “purge” signal to destroy the media or the "Zeroize" that performs a DOD-approved erasure of the media. The VP1-250-SSDX’s outstanding performance and versatility is enabled by Phoenix International’s state-of-the-art technology which provides very high transfer and I/O rates, enhanced endurance and maximum data integrity. Phoenix International is an AS 9100 rev C/ISO 9001:2008 certified, Service Disabled Veteran Owned Small Business (SDVOSB) manufacturer of Rugged COTS data storage products.

Phoenix International


SLC or MLC SATA Solid State Disk


VITA 48/REDI Conduction Cooled


Operational Altitude to 80,000 Feet


Operational Temperature from -40 degrees to 85 degrees C


Solid State Disks (SSDs) up to 4TB (SLC) or 8TB (MLC) Optional AES 256 Encryption

Made in the USa

 714.283.4800


VP1-250-eSSD Phoenix International’s VP1-250-eSSD is Industry’s first Open VPX NVM Express (NVMe) Solid State Disk data storage module. With capacities up to 3.2TB, the VP1-250-eSSD is a 3U VPX SSD storage module that delivers extremely high performance via a single Fat Pipe (PICe 4x). Designed from the ground up to remove legacy layers of hard drive interfaces such as SATA and SAS, it takes full advantage of the speed and parallelism of solid state nonvolatile memory. Streamlined efficient queuing protocol combined with an optimized command set register interface enables low latency and high performance. Data is delivered fast and efficiently with minimal burden on the host CPU. NVM Express (NVMe) is an industry-standard registered interface designed to accelerate the performance of nonvolatile PCI Express (PCIe) SSDs. NVMe provides opportunities for increased data throughput and reduced latency all while reducing the number of drives needed – both now and in the future. Adoption of this industry standard is driven by a strong consortium of storage technology providers and a robust ecosystem of drivers across multiple operating systems. Phoenix International is an AS 9100 rev C/ISO 9001:2008 certified, Service Disabled Veteran Owned Small Business (SDVOSB) manufacturer of Rugged COTS data storage products.

Phoenix International

FEATURES ĄĄ Out-of-the-box software, drivers and manageability enable easy

adoption and storage interoperability

ĄĄ Capacities from 800GB to 3.2TB ĄĄ Sustained Read/Write Transfer Speeds of 3.0/2.0 GB/sec ĄĄ Up to 750,000 IOPS (Random 4KB Read) ĄĄ Streamlined protocol with efficient queuing

mechanism to scale for multi-core CPUs

ĄĄ Air Cooled or VITA 48/REDI Conduction Cooled

Made in the USa

 714.283.4800

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NanoATR Designed for rugged commercial and military field applications, the NanoATR™ is a VITA 74 standards based small form factor computing system. It packages an Intel® Atom® or AMD® APU® processor in a light-weight 4×4 footprint optimized for size, weight, power, and cooling (SWAP-C). Its fully sealed, finned, hardened, aluminum conduction-cooled chassis has provisions for two 19 mm and two 12.5 mm payload modules, a rear mounted storage slot, standard front panel MIL connectors, an I/O transition panel, and a power supply unit.

FEATURES Small form factor ĄĄ Embedded computing ĄĄ VITA standard ĄĄ Conduction cooled ĄĄ Rugged ĄĄ Scalable ĄĄ Modular I/O ĄĄ

Themis Computer

 Themis Computer

 510-252-0870 Themis Computer


XPedite7674 The XPedite7674 is a high-performance, 3U VPX-REDI, single board computer based on the Intel® Xeon® D-1500 family processor. The processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package with native extended temperature support for up to 12 core-count SKUs. The XPedite7674 provides secure network interfaces by providing one 1000BASE-X Gigabit Ethernet interface from the FPGA and passing two CPU 10 Gigabit 10GBASE-KR Ethernet interfaces through the FPGA. The XPedite7674 integrates SecureCOTS™ technology with the Xilinx Kintex® UltraScale™ FPGA for hosting custom functions to protect data from being modified or observed and provides an ideal solution when stringent security capabilities are required. It accommodates up to 16 GB of DDR4-2133 ECC SDRAM in two channels and up to 32 GB of onboard SATA NAND flash in addition to numerous I/O ports, including USB, SATA, and RS-232/422/485 serial through the backplane connectors. The XPedite7674 provides additional expansion capabilities by including an XMC site. This XMC site includes a x8 PCIe connection to the Intel® Xeon® D processor and X12d I/O mapped directly to the VPX backplane connectors. Wind River VxWorks and X-ES Enterprise Linux Support Packages (XEL) are available.

Extreme Engineering Solutions (X-ES)

FEATURES ĄĄ Supports Intel® Xeon® D-1500 family processors (formerly


ĄĄ Up to 16 Xeon®-class cores in a single, power-efficient SoC


ĄĄ 4, 8, or 12 core SKUs available with native extended temperature


ĄĄ Designed with SecureCOTS™ technology to support enhanced

security and trusted computing

ĄĄ Onboard Xilinx Kintex® UltraScale™ XCKU060 or XCKU095 FPGA ĄĄ Ruggedized Enhanced Design Implementation (REDI) per VITA 48 ĄĄ XMC site with a x8 PCIe interface and rear I/O support  608-833-1155  @XES_INC  

46 | VITA Technologies Resource Guide Spring/Summer 2017

OpenSystems Media works with industry leaders to develop and publish content that educates our readers.

Check out our white papers.

Most popular topics: AdvancedTCA Android Avionics Certification Automotive Deep Packet Inspection GUI Linux in Medical Devices Internet of Things M2M

Multicore PCI Express Radar SDR Static Analysis Switched Fabrics Test & Measurement UAVs

Unfair Advantage. 2X HIGHER performance

4X FASTER development

Introducing Jade™ architecture and Navigator™ Design Suite, the next evolutionary standards in digital signal processing.

Kintex Ultrascale FPGA

Pentek’s new Jade architecture, based on the latest generation Xilinx® Kintex® Ultrascale™ FPGA, doubles the performance levels of previous products. Plus, Pentek’s next generation Navigator FPGA Design Kit and BSP tool suite unleashes these resources to speed IP development and optimize applications. •

Streamlined Jade architecture boosts performance, reduces power and lowers cost Superior analog and digital I/O handle multi-channel wideband signals with highest dynamic range

Built-in IP functions for DDCs, DUCs, triggering, synchronization, DMA engines and more

Board resources include PCIe Gen3 x8 interface, sample clock synthesizer and 5 GB DDR4 SDRAM

Navigator Design Suite BSP and FPGA Design Kit (FDK) for Xilinx Vivado® IP Integrator expedite development

Applications include wideband phased array systems, communications transceivers, radar transponders, SIGINT and ELINT monitoring and EW countermeasures

Jade Model 71861 XMC module, also available in VPX, PCIe, cPCI and AMC with rugged options.

Navigator FDK shown in IP Integrator.

See the Video! or call 201-818-5900 for more information

All this plus FREE lifetime applications support!

Pentek, Inc., One Park Way, Upper Saddle River, NJ 07458 Phone: 201-818-5900 • Fax: 201-818-5904 • email: • Worldwide Distribution & Support, Copyright © 2016 Pentek, Inc. Pentek, Jade and Navigator are trademarks of Pentek, Inc. Other trademarks are properties of their respective owners.

VITA Technologies Spring/Summer 2017 with Resource Guide  

The VITA Technologies Spring/Summer 2017 Resource Guide showcases technologies based on VITA standards, including FMC, OpenVPX, XMC/PMC, and...

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