Embedded Computing Design June 2016

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BADER: Faster adoption of leading edge technology is occurring in embedded applications that traditionally used technology only after it had been adopted and in stable production by mainstream applications. We see this, for example, with the strong adoption of LPDDR4 technology in automotive applications today. While we do see the adoption of leading edge lithography to enable cost reductions within embedded/IoT devices, this is balanced by a need within these applications for extended lifecycles and higher durability. As a result, memory solutions must be developed that support both cost reductions and improved durability, such as the family of industrial-grade SSDs Micron recently introduced. Another key trend driving system cost reductions is the increasing use of multi-chip packages (MCPs) and system-in-package (SiP) solutions. Integrating DRAM with non-volatile memory in an MCP or combined with an SoC in an SiP solution can deliver significant system cost savings in addition to performance and power benefits.

BADER: The crystal ball gets a little foggy 10 years from now, but it’s probably safe to say some of the same key trends we see today will continue in embedded and IoT. For higher function IoT devices, the proliferation of mobile architectures into embedded systems will continue, taking advantage of the scale, performance, and power of those systems. This means advanced DRAM, eMMC, and universal flash storage (UFS) will combine in MCP and package on package (PoP) configurations to deliver the best performance and form factor possible. For lower function devices, we’ll continue to see NOR as the primary boot solution with a growing use of low-density NAND and eMMC. In the longer term we could also see the adoption of emerging memory solutions like Micron’s transistor-less 3D Xpoint technology, which could serve as a simple non-volatile RAM solution replacing (or augmenting) both DRAM and NAND in those devices.


Micron Technology, Inc. www.micron.com

5 to 10 years from now, what is going to be the storage architecture of choice for Industrial IoT and embedded systems?






Skip Ashton Vice President, IoT Software, Silicon Labs

Robert Miller Founder, Technologic Systems

Alicia Asín CEO, Libelium

Todd Ouska CTO, wolfSSL

Ciaran Connel CEO and Co-Founder, DecaWave

Hans Rempel CEO and Co-Founder, Exosite

Cesare Garlati Chief Security Strategist, prpl Foundation

Andy Rhodes Executive Director, Commercial IoT Solutions, Dell

Scott Hanson Founder and CTO, Ambiq Micro Jeffrey Hibbard CEO, IntervalZero Keith Jackson President and CEO, ON Semiconductor Raj Johnson President and CEO, Mapusoft Technologies Sherri McDaniel President, ATEK Access Technologies www.embedded-computing.com

Evan Thomas Assistant Professor, Portland State University, and CEO, SWEETSense, Inc. Serge Tissot Technical Fellow and Principal Architect, Technology Platforms, Kontron Lorie Wigle Vice President and General Manager, IoT Security Solutions, Intel Security

Embedded Computing Design | June 2016