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nepes,organization that brings the future through science and technology ⶟㒒ㄮⷨ㓸㈌㉕㊤⸹㇤⸞⿙⸹㍤/&'㊊㉨㉵⼡〪ㆱ㉕,7㓹ㄽヨ㉵⽄⸺㉨㊉㉜ⳮㄐ⼎ ⳅⶃ㍾㍲ⳅア㔫㇑バⲦ㓴㉆⼎ㅕÕ,7ⱛⳅ⸑㓱⿊ⳅÖ㉕ア㇉Ⲕ㉽⼂㉉㊒ⲛ㓯ⷨ⸩㋂⼂㓸㈄ㄴⷵⷿ

バⲦ㊉㉜㒆㑰ⶒ⶟㒒ㄮ ⳪〉㓯ⷨ,7㔭Ⲕラ㇑ッⲛⱢ㉕ⷵ㋚⽄ざ⽁Ⲃ&DWFK㓯ⲛ㎎㊣ㄷ㏗バⲦ㊉㉜㒆㑰ⶒ⼎ⷩ㓴ⴜ㓯ⷨⳮ㇉ 'LJLWDOL]DWLRQ1HWZRUNLQJ&ROODERUDWLRQ㉉㑏㓸ヒⲖ㊉㉜⸑㓅ⳮ㇉㉚⹋ⲛ㉨ⵡ㉡㇊㉚ⶳ⼂㓯ⷨⳮ㇉

⵲ⶳⳮㄐ⶟㒒ㄮ ⹴㋢㐴㔕⾋㉉ⱏⷯ㓯Ⲃ㓯ⷨ㓹ㄽ⵲ⶳⳮㄐ㉕㋋ㄽ㇑㉤ⷨⳮ㇉ ⶟㒒ㄮ㉕⸺㉨㊉ⳮㄐ㉉ⳮ⿙㉆⼎㓱(QHUJ\ゟ㇉㉆⼎ⲛⱢ㉕サ㔮ラ㇑㋢ラ㊉㉜㔝㐧㉉㋂ⷨⳮ㇉

HISTORY 2009 - 2013

⻯ㄷ㆘⾎⽁⸹か㆘/('Ⲧ㉳㋄Ⲧ ⻯ㄷ㆘⾎⽁⸹か㆘㓵㉩⿹㉜ド⽑ QHSHVUXV

ㇰ㍊Ⲧ㉳ㄹⲦ㉳㋄Ⲧ ㉚⽌⸹ㄮサア⿹㉜㔫㎊⿸ ⶟㒒ㄮ⹴ㄮ㓣⻹㉚ド⽑ ⸺㉝%03BQHSHV*PE+㇜Ⳅヨド⽑ ⶟㒒ㄮ⽌ⳣ⽔ド⽑

2006 - 2008

⶟㒒ㄮ㇔㉚⹴ド⽑ ⶟㒒ㄮㄹヨ㉵㏠ㄮ⸀⹲⼏ ㇜ㄌ㈨+RWHO:HVWRI&DQDDQ㋄Ⲧ ㇰ㍊Ⲧ㉳㋄Ⲧ ㊊㉨㉵⼡

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2000 - 2005

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1990 - 1999

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BUSINESS PORTFOLIO (OHFWURQLF 0DWHULDO

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Material

Semi conductor

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Energy

Display

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Life Science

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SEMICONDUCTOR

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Core Technologies

Bumping and COF/COG Products for LCD Driver IC

8�, 12� Bumping & WLP/RCP Products

Device

Application Processor

Wifi/Blutooth

Audio Codec

PMIC

Driver IC


NANO MATERIAL

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Electronic Materials

TMAH Developer

Color Filter Developer

Etchant

Nano Stripper

Edge Slurry

Electro Plating Chemical

SOG

UHP

Spin-on Glass

Electrolyte Additives

Advanced Materials

EMC

W-EMC

CMC

LEC

DAA

Silicon

Epoxy Molding Compound

White Epoxy Molding Compound

Clear Molding Compound

Underfil Resin for COF

Die Attach Adhesive

Encapsulated for LED

Color pigments & Paste Color Paste

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Red

Green

Blue


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ENERGY

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Functional Nano Glass Ф㓯㉚㐻㐍㏠㒅ⳮㄐ⼎㐞サ㓱ヒⲖ㍾㍲㉕ⲛⳮⷯバ㏠㒅㈽⽌ Ф㉨㍤ⱡ⿛㑙⾋㏉⻯㒦㉜㑰㏠㒅㉆⼎ⷿㆹ㓱ギカ㓅㔖ⱏⷯ Ф㍟⸂⵲ⶳヨ㉵⽄㏠㒅㓯㇙㇝Ⲩ㉨㈌デ㉉㍁⸂㇑ⶒ㋢㊋ⱖ㔽Ⲩ㐝㈩ Ф㐦ㆹⲰ⿛㊊ㄷか⿙ゟ⿓㉨㊐ 6HOIFOHDQLQJ ⳮⷯ㉆⼎⿛㊊㔽㉀㔂カ

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Clean Room Design & Engineering Ф(QHUJ\ORVV⽄㍾ヨ㔫㓯ⷨⲛ㔽㉀㉨㉵⼎㎩㔭ⲔⱵ㎈ㄷⲦ Ф⿙⸹㍤Ⲧ㊐⿓㊒㊢ⳮㄐ㉉㊉㈛㓱㍲㊐⿌ㄷⲦ

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nepes 2014