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Global Leader in Test Technology and Expertise

Microtek Laboratories offers a wide range of Component Testing and inspection services that can be utilized to improve yield, determine root cause of failure, extrapolate life expectancy and improve reliability, and increase performance on integrated circuits (ICs), printed circuit boards (PCBs), and passive surface mount devices (such as capacitors, inductors, diodes, etc.), as well as materials and assemblies. Microtek Labs has an extensive array of equipment and technical experience to provide you with the tools and data necessary to overcome your shortfalls and failures.

TEST CAPABILITIES

COMPONENT TESTING Op cal Inspec on and external package analysis Scanning Acous c Microscopy (CSAM) Live‐Time X‐ray Curve trace / Electrical characteriza on Decapsula on: Jet‐etch and acid decapsula on Wire bond pull tes ng Ball shear tes ng Die shear tes ng Scanning Electron Microscopy (SEM) Cross‐sec onal Analysis Fourier Transform Interferometry (FTIR) Materials Characteriza on: Differen al Scanning Calorimetric (DSC) Thermal Mechanical Analysis (TMA) Dynamic Mechanical Analysis (DMA) Thermal Gravimetric Analysis (TGA) Thermal Conduc vity

Global Headquarters: Microtek Laboratories

www.THETESTLAB.com Scan to Learn More

1435 Allec Street Anaheim, California 92805-6306 U.S.A.

eMail: Phone: Fax: Toll Free:

TechSupport@TheTestLab.com 714.999.1616 714.999.1636 800.878.6601 (in U.S.) Copyright 2013 - Microtek Laboratories

Components-Testing - 1-2013  
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