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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Micro‐Packs: R&D Technologies Enabler for Smart  Object In Object In nnovation  nnovation

A SCS competitiveness Cluster platform, coordinated by ARCSIS

www.pf-m micropacks.org Booklet realization tha anks to F2I-UIMM support

contact@pf-micropacks.org +33 (0)4 42 61 66 00


R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Introduction Micro PackS is a cooperative platform: Micro-PackS • Part of the Frennch competitiveness cluster “Secure Communication Solutions” (SCS)

Micro-electronics

3 micro-electronics platforms

1 of 3 CIMPACA A micro-electronics platforms, coordinated by ARCSIS,

« association loi 1901 » started in 2006

P Presentation i purpose: p

To present Micro-PackS service offer available to support pean innovation French and Europe

A SCS competitiveness Cluster platform, coordinated by ARCSIS

www.pf-m micropacks.org

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Security & Digital Identities

Networks, M2M & mobiles services

CONTACTLESS

Telecommunications Software Materials Sensors

Microelectronics LASER Energy Harvesting

CIMPAC CA Program g A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Mi Micro-Pac P ckS kS Vision Vi i From Silicon technology to smart Objec ct Values

Innovation n n  support support Sharing Reactivity

Confidentiality C fid ti lit

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Mi Micro-Pack P kS k Mission Mi i

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

mobility

Logistic

5 Service S i D Domains i Micropac ckaging prototy yping P i Printed d electronics l i

Environment

Caracterisation Failure analysis Component security analysis

Health&wellness

RF F precertification and diagnosis

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Micro-PackS service domains 1. 2. 3. 4. 5.

Micropackaging k prototyping Printed electronics Package Characterizattion and failure analysis RF Pre-certification e ce t cat o an and dd diagnosis ag os s IC security Based on 5 service domains d Micro-PackS is your partner from Prooff of Concept to Pre-series Pre series

A SCS competitiveness Cluster platform, coordinated by ARCSIS

www.pf-m micropacks.org

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Mi Micropackaging k i prototyping t t i Prototyping and pre pre-series series production n line for flexible substrate and conventional package

Wafer mounting Wafer mounting Wafer sawing Wafer sawing

300 mm  300mm grinder Grinder ( > 50 µm) >50µm

Stu ud Stud d Bump ping bum mping

Pick&& place Pick place Die attach Die attach Flip‐chip Flip-chip

Wire Wire bonding bonding (Au, Al) (Au, Al)

Globtop Encapsulation encapsulation

Electroless bumping

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Printed electrronics

Inkjet, Screen printer, Sintering equipment Project support : • Definition of target features • Identification of blocking points (su ubstrate , ink and layout) • Training nt • Support during your developmen Screen printer serigraphy

Dimatix DMP 2831 > R&D CERADROP (stand alone) Development, Prototyping

A SCS competitiveness Cluster platform, coordinated by ARCSIS

Jetpac (semi-industrial prototyping)

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Caracterisation an nd failure analysis Expertise focus on microelectronic dies & packages: sensor, actuator, IC, active-passive compon nent, hybrid, SOC, SIP, MEMS, smart card, tag‌ To serve: -R&D Characterization -Failure analysis -Offline Quality & Reliability control

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

C Caracterisation t i ti and d failure f il analysis: l i Activity structure breakdown 1. Failure analysis M th d l Methodology

Activity structure breakdown

1.1 Non destructive analysis - Electrical analysis - Visual & structure inspection 1.2 Destructive analysis -Sample Preparation & Imaging: SEM,,

2. Characterization/ Reliab bility 2.1 2 1 Topography, Topography structural & mecha anical analysis 2.2 Climatic tests

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

RF Pre-certificatio on and diagnosis To benchmark your product versus international standards s •

For contactless objects, phones or reade ers (RF 13.56 MHZ)

ISO 1444 43 • • •

A SCS competitiveness Cluster platform, coordinated by ARCSIS

www.pf-m micropacks.org

Identification & passport Mobile phone p Contactless payment

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

S Security it lab l b offe ffer/process / To evaluate the level of your new secure product

DFA

Faults

Side channel

Preparation A SCS competitiveness Cluster platform, coordinated by ARCSIS

Acquiisition

DPA

Data extraction

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Some service exa amples •

Medical Xray sensor: Thinning, sawing (6”wafe er) in ultra thin open cavity QFN housing ( strip production) > 3 000 ins s - 15 k€

Engineering batch for design house: Thinning,, sawing (8”wafer) in DIL 16 package > 100 ins – 1.4 k€

Embedding smart cartd from Multiwafer : Thiinning, sawing (8” f ) card (8”wafer), d production d ti > 50 ins i –3k€ 3k€

2 series of RFID tag printing on paper: Thinniing, sawing (8”wafer), tag manufacturing, pick&place on pape er > 2 X 50 ins – 10k€

Sample preparation & SEM analysis: metalliza ation, polishing, analysis > 2 ins –1.1k€

FA- Acoustic analysis: 1 inche –0.6k€

FA: complex analysis: SEM cross section + XRA AY Tomography + photos : 5 ins, 1.1k€

Precertification Rfid Tag (analog and digital part)

ntial) 15k€ Security Lab access, test campaign : (confiden

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Members and publiic funding 1.

Industrial: G Gemalto, lt Inside I id S Secure, LFoundry LF d y, STMicroelectronics STMi l t i

2.

SME Fogale nanotech, Invia, Nexcis, Ro ockwood Wafer Reclaim, SPS, Starchip,Tagsys RFID

3.

Academics: ENSM SE CMP CEA-LETI, ENSM-SE-CMP, CEA LETI ISEN ISEN-To Toulon l

4. Public funding:

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Technology Developm ment Support for Start-Up Domain

Names

Equipment  manufacturer

Checkup Solar E Encapsulix lix

Renewable energies

Crosslux Wysips Polymage e

Electronic printing

Genes’Inkk

Test & tools

Keolabs

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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Logos

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Micro-PackS Micro PackS Facilities F •

• •

Clean room, process and characterization(800 m2) Micro-Packaging prototyping line l (C10000)  Printed electronics platform (C1000) ( Package Package characterization and failure analysis (C10000) Thin films processing and cha aracterization (C100/1000) (*) Component security lab: side chan nnel and fault attack RF characterization h i i llab: b Pre-certif P iffication fi i and d diagnosis di i More than 200 cleanroom users,, from 20 different companies p Hosting 140 R&D equ uipment (10 M€)

(*) access thru EMSE structure

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Staff & secu urity Multi- technologies expert team allocated by y members 22 people ( 11 Full time Equivalent) Access control (all cleanroom users)

Cleanroom security Access control (only cleanroom staff)

Access control with security airlock (only secured room users)

Class  10000

Class 100 00

Camera

micropackaging prototyping

Impact sensor Class 100

Access control (only cleanroom staff)

A SCS competitiveness Cluster platform, coordinated by ARCSIS

Secured room: -2 cameras -Ultrasonic ceiling l radar d -Wire mesh under raised floor -Secured windows

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Micro PackS offer & yo Micro-PackS our development cycle Academic research

innovation

Material  Material & Equipment Suppliers

C Component & Device Makers

Integrators  & End Users

inttegration

development

qualification

production

Process/production Proof of concept

proto

Pre series

1st series

Analyse/caracterization material

MultiMulti Physical

Physical

Elec.

A SCS competitiveness Cluster platform, coordinated by ARCSIS

E Evaluatio nprocess Evaluation Perf .

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Reliability y & compliance Failure Analysis contact@pf-micropacks.org +33 (0)4 42 61 66 00 19/24

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Equipment Rental (DiY) Training

Reservation

Use by your expert

In 5 service domains : a set of state-of-the s art equipment ( see catalog on our web site: www.pf-micropacks.org/download) w Available on selected equipment list.

A SCS competitiveness Cluster platform, coordinated by ARCSIS

www.pf-m micropacks.org

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Service request Request:

 Context  Domain  Standard  Device description  Delivery date --> Service Form

In • • •

Definition fi i i off service

 Equipment  Methodology  Expectations  Planning -> quotation

Realization li i

Delivery li

 Incoming control  Production step by step  Outgoing control

 Customer notification  Shipment  Customer feedback -> invoice

5 service domains : 20 Service demands p per month h Monthly production: more than n 12 000 prototypes Average cycle time: 2 weeks Micro-PackS promotes stro ong discussion/cooperation between customer and Mic cro-PackS technical experts

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Becoming a Micrro-Packs Member 1. Access to equipment reservation and services orm management ( budget, 2. Involvement in platfo operational meeting, plan ) meeting strategic plan‌) 3. Annual fees (contact ( t us for a dedicated offer) )

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Micro Pack Micro-Pack kS Platform 1.

Mission: To serve industrial and academic in nnovation: by sharing expertise and state –of-the-art – R&D equipment With easy access for SME Es and startups

2 2.

Platform is : a. A place to develop your innovative technology t building blocks and expertise b. A place to manufacture your protottypes and small series (smart objects) c. A p place to characterize y your develop p pment d. An organisation to set up your cooperative projects

3.

Platform isn’t : a. An academic lab. b. A basic service provider. c. A certification laboratory

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

To Conttact us Platform management: Contact@pf-micropacks.org Jean Marc Marcant Operational Director: Jean-Marc M Development & Strategy Directorr : Michel THOMAS

ales@pf micropacks.org ales@pf-micropacks.org Quotation request : contact.sa Technical question: contact.micropackaging@pf-microp acks org contact micropackaging@pf micropacks.org contact.printedelectronics@pf-micro opacks.org contact.caracterization@pf-micropa acks.org contact.hflab@pf-micropacks.org contact.securitylab@pf-micropaks.o org

Don t hesitate to download our Don’t o documentation on www.pf-micropacks.org Tel: +33 4 42 61 66 00 ( EMSE E standard) A SCS competitiveness Cluster platform, coordinated by ARCSIS

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R & D Technology Enabler serving the industrial and academic innovation secure communicating objects

Smart Object

Th k you for Thank f y your attention tt ti

A SCS competitiveness Cluster platform, coordinated by ARCSIS

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Micro packs pres géné v10 12 13 manuel