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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

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Micro-PackS: platform for innovation

This catalog lists all equipments which can be booked on Micro-PackS platform for each service area. You will find a brief introduction for each service area, with their equipments and datasheet associated.

A SCS competitivness cluster platform, Coordinated by ARCSIS

www.pf-micropacks.org

contact@pf-micropacks.org 33+(0)04 42 61 66 00


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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Contents Micro-PackS

4 Micropackaging prototyping

5

Packages

6

Specific packaging (on demand)

7

Module on flexible substrates

8 Back-end

Back Lap DAG 810

9

Plasma R3T DISCO TWR2000-GEN

11

Wafer mounter DISCO LINTEC RAD 2500M/12 Isolated DISCO RAD 2000M/8

13

Wafer sawing DISCO DFD6361

15

Advanced technology Stud Bump

STUD BUMP K&S AT/PREMIER

Flip chip die attach Datacon APM+ With EEAA APM module FLIP CHIP + DIE ATTACH MANUEL DOCTOR TRETSKY+T3002-FC3M+

17 19 21

Wire bonder FINE PICH ESEC 3100

23

Pulls and shear tests Metronelec DAGE 4000

25

Encapsulation CAMALOT

27 Card integration

Milling and embedding machine MEX

29

Other tool 31

Cuting table GRAPHTEC FC 2250 Printed electronics

34

Inkjet printer CERADROP CERAPRINTER X-Serie

35

Screen printer DEK 260

37

Digital inkjet printing FUJIFILM DIMATIX PRINTER

39

Inkjet printer JET PAC

41

Ink curing MACROTRON MICROCURE 2100

43

2 A SCS competitivness cluster platform, Coordinated by ARCSIS

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3

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Package characterization and failure analysis

45

Dimensional analysis Ellipsometer SOPRA GES-5E

46

Mechanical profilometer AMBIOS TECHNOLOGY / XP

58

Optical profiler VEECO / NT11OO

50

Reliability Climatic chamber chock CTS / TSS-70-32

52

Variation in climatic chamber CTS / CS-70-200-5

54

Steaming salt spray CTS / SSC-140

56

Imaging AFM VEECO/CP-II

58

Interferometry FOGALE TMAP-300 M

60

Scanning electron microscope MEB EVO 50 XVP

62

SEM CARL ZEISS ULTRA 55

64

RAMAN microscope HORIBA JOBIN-YVON LABRAM-HRX

66

Acoustic microscopy SONOSCAN D9000 C-SAM

68

X-ray imaging INSIDIX-COUGAR/VXP

70

electrical and machanical tests

Semi automatic electric test bench (prober) SÛSS MICROTEC PA200

72

Nano-indenter XP

74

polymers and characterization Thermechanical testing platform DMA25

76

DSC (differential scanning calorimetry)TA INSTRUMENTS / DSC Q200

78

Goniometer of wetability APOLLO INSTRUMENT / OCA 200

80

sample preparation Ion polishing GATAN ILLION 693

82

Ion polishing MODEL 692 PECS

84

Sample preparation for microscopy

86

RF Pre-certification and diagnosis

89

Component security

92

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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-PackS

Micropackaging is a fundamental link in microelectronics value chain, between silicon technology and the increasing need to integrate complex electronic solutions. This activity now faces three challenges: the future of heterogeneous integrated systems on flexible substrates, the explosion of applications in diary life (smart card, RFID tag, token security ‌), the need to strengthen security of these systems against increasingly sophisticated attacks. Micro-PackS is an R & D partnership platform, created in 2006, the first national R & D structure in assembly of micro-technology and printed electronics dedicated to "Smart Objects". Micro-PackS is an association of 13 members from industry and academia, mainly hosted by the Center of Microelectronics in Provence (Gardanne) about 600 m2 of clean rooms and 200 m2 of laboratories. The platform is designed to focus on synergies development around contactless smart objects integration and tamper resistant circuit validation. Micro-PackS use leverages your development opportunities in new markets and decrease your innovation risks by investment sharing. Micro-Packs is an innovative platform attached to SCS Competitiveness Cluster "Secure Communicating Solutions" and is coordinated by ARCSIS association. Its range of services is divided in 5 areas: Micro-packaging prototyping Printed electronics Package characterization and failure analysis RF Pre-certification and diagnosis Component security

4 A SCS competitivness cluster platform, Coordinated by ARCSIS

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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micropackaging prototyping

The setup of this pre-production line is based on smart object industry players background. The aim of prototyping line is to improve the cycle time of new product development, by anticipating key technological building blocks needed and the availability of a versatile product line. Your needs

Our answer

Reduce cycle time of new product development

Access to a complete production line, functional and versatile prototyping

Develop feasibility studies and / or prototyping

Process and prototype validation

Test the market by producing in volume pre-industrial series of innovative products

Small and medium series production

Offset the costs of labor by a high level of integration

System In Package Investment sharing Expert team support

Limit investment risks associated introducing new products

Wafer Thinning DAG 810

Wafer Mounting Lintec RAD 2500

Die Attach

Wafer Sawing Disco DFD 6361

Stud Bump K&S premier

Flip chip

S M T

Possibility of setting up collaborative projects and / or development with members Opportunity to address new application fields

Fine pitch

Wire bonder

Peak & place

Au

Manual K&S

Globtop Al

Auto K&S

camalot

Datacon 2200 APM+

Plastic / Ceramic packages Loading in waffle Module on flexible substrates

wafer 5 A SCS competitivness cluster platform, Coordinated by ARCSIS

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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-packaging prototyping conventional package Packages Ceramic packages (open cavity)

DIL (Dual in Line)

CQFP CLCC-JLCC (C/J Leaded Chip Carrier)

PGA (Pin Grid Array)

SOIC (Small Outline) Plastic packages (open cavity) PLCC (Plastic Leader Chip) LQFP/TQFP (Quad Flat Package)

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7

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-packaging prototyping

SOIC

QFN (Quad Flat No Leads)

DILL

Specific packaging (on demand) Optical resin Hybrid Chip on Board (COB) Flip-Chip Thermal solutions Metallic packages Chip Scale Package (CSP) Microsystem packaging

7 A SCS competitivness cluster platform, Coordinated by ARCSIS

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R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-packaging prototyping

Module on flexible substrates Module film

35mm film up to 60 mm

Standard process Thinning Sawing Inteconnection (Wire Bonding or Flip Chip) Encapsulation ( Dam & Fil or Glob Top) Option module: Embedded to Card body Process adaptation on demand

8 A SCS competitivness cluster platform, Coordinated by ARCSIS

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9

Back-lap DAG 810

The Dag 810 mechanically thins silicon wafers, semiconductors and other ceramics. In addition to the standard thinning, this equipment can be used in processes for Dicing before grinding and Taiko®. This technology allows the user to decrease wafer thickness, with a minimum wafer thickness of 50µm. The compact automatic grinder accommodates work pieces up to 12” in diameter. It hosts one spindle and one chuck table and is designed to process a variety of materials. The DAG 810 easily handles hard processes and brittle substrates of various diameters. It is an excellent choice for processing a wide variety of electronic components.

Back-end

Micro-packaging prototyping

General d escription

benefits Enables the production of very thin devices (50-300µm) Equipment versatility allows for TAIKO® processes and edgegrinding. High rigidity and low vibration machining allows for process precision and rigidity. An intuitive interface and touch screen control make the equipment Compatible to Dicing Before Grinding process Easy to use

Link to other tools Dicing saw DFD6361 Plasma system R3T, stress release system Wafer Mounter RAD 2500 Isolated RAD 2000 9 A SCS competitivness cluster platform, Coordinated by ARCSIS

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Back lap

10

DAG 810

Back-end

Micro-packaging prototyping

Specifications

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PLASMA R3T DISCO TWR2000-GEN

11

After grinding processes the backside of silicon wafers shows some damage leading to less breaking resistance and more wafer bow as a result of higher strength caused by the damage mechanism. Already after a few seconds silicon etch with the remote microwave plasma the bow created by the grinding process disappears. Through the removal of a few microns of silicon a breaking resistance can be reached similar to that of an blanket wafer. Contrary to wet chemical based processes the remote microwave plasma makes it possible to remove the damage zones also from the Kerf of the wafer and to perform the damage etch of thin wafers while they are mounted on sawing frame. To get good uniformity and high etch rate at the same time the fluorine radicals in the SAN 1010 silicon etcher are distributed over the wafer area by rotating beam. Optimized for Rapid and Homogenous Silicon Etching using a new highly effective and gentle technique based on Highly Active F*-radicals.

Back-end

Micro-packaging prototyping

General d escription

benefits Stress Relief Etching after Grinding Stress Relief Etching in Kerfs (Sawing Kerfs, Laser Kerfs) Etching of taped and un-taped Si-wafers Vacuum chuck for wafer sizes up to 300 mm Chemical Etching only, no ion damage Very low thermal load for the substrates High Environmental Compliance

Link to other tools Grinder DAG 810

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PLASMA R3T DISCO TWR2000-GEN

12

Ambience conditions

Temperature

+15°C – +30°C

Relative Humidity

10% – 75%

Air pressure

86kPa – 106kPa

Pressure range

40Pa – 660Pa (0.3Torr – 5.0Torr)

Microwave Radical

Back-end

Micro-packaging prototyping

Specifications

Generator (extendable on request) Fluorine processes

100Pa – 330Pa (0.8Torr – 2.5Torr)

Gas flow

0.1 -15.0 slm

Water cooled

3 liter / min

Water temperature

min.: ambient temperature; max.: 30 °C

Magnetron output

2.450GHz +/- 10MHz, 2000W con (4000W peak)

Weight

14.5kg

Dimensions [mm]

350 x 360 x 130

Available gas

SF6, O2, CF4

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WAFER MOUNTER DISCO LINTEC RAD 2500M/12 & ISOLATED DISCO RAD 2000M/8

13

RAD 2500M/12M is a semi automatic wafer Mounter that mounts wafer onto the pre-cut dicing UV tape once the operator supplies the wafer and ring frame by hand. RAD 2000/12 is a semi automatic UV irradiation system used for curing UV type dicing tape. It is applicable for ring frame sizes used for 200mm and 300mm wafers.

Back-end

Micro-packaging prototyping

General d escription

benefits Wafer Mounter: Can be used as a laminator to protect active face component, by special equipment adaption and modification TTC system for more accurate application, by controlling the tape tension and the prevention of air intrusion. Ease to use, through the use of pre-cut film frame by programming simple parameters Very good film adhesion through the heater Insolated Rad 2000: Total process control on the overall wafer surface thanks to constant irradiation of the full wafer. Optimization and reliability of irradiation by using high-frequency inverter and closed loop control of the UV lamp. Simple usage using process protocol

Link to other tools Dicing saw DFD6361 Flip chip Die attach DATACON 13 A SCS competitivness cluster platform, Coordinated by ARCSIS

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WAFER MOUNTER DISCO LINTEC RAD 2500M/12 & ISOLATED DISCO RAD 2000M/8

14

300mm Applicable wafer size

Additional compatibility with various wafer sizes and shapes are available as an option. Please feel free to inquire

Processing capacity

Back-end

Micro-packaging prototyping

Wafer Mounter specifi cations

22sec/wafer (exclude setting time)

Options

Suitable tapes

Static Eliminator

Pre-cut dicing tape

Top cover

dicing die bonding tape

Isolated RAD 2000M/8 Applicable wafer size

150mm, 200mm Within 15 s/wafer The above processing capacity is based on following conditions:

Processing capacity

Wafer: 200 mm diameter non polished

mirror

wafer Ring frame: from 200mm wafer

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WAFER SAWING DISCO DFD6361

15

This equipment acts as a wafer saw, dicing chips and other components for wafers up to 12â€? in diameter. DFD6361 reduces distance between the blades. DISCOâ€&#x;s facing dual design help manage total cut time, while high magnification microscopes (standard) and non-contact setup sensors for both Z1 and Z2 reduce the time required for non-dicing sequences such as kerf check and blade setup.

Back-end

Micro-packaging prototyping

General d escription

benefits Possibility of making Dicing Before Grinding and edge-trimming Step cut Flexibility of support Ease to use Ability to save images from a process

Link to other tools Grinder Disco DAG 810 Wafer Mounter Lintec RAD2500M/12 and Isolated Lintec RAD2000M/12

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WAFER SAWING DISCO DFD6361

16

Back-end

Micro-packaging prototyping

Specifications

16 A SCS competitivness cluster platform, Coordinated by ARCSIS

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ADVANCED TECHNOLOGY STUD BUMP K&S AT/PREMIER STUD BUMP

17

Back-end

K&S's AT Premier Stud Bumper offers many technological advantages that make it the ideal choice for a wide range of flip chip product applications. Using industry-standard modeling, this new generation high-speed stud bumper is the clear cost-of-ownership leader in comparison to competitive bumping technology. It is composed of: Setting table (XY- ) with suction Head bumping mobile (X-Y-Z) Cameras, self-correcting vision system Soft learning by OCR Other possible materials: sawn wafers and 12''

Micro-packaging prototyping

General d escription

benefits Process flexibility and the type of bump obtained Different types of media, substrates, needles and tools Support Wafers 12'', for purposes Bump technologies stacked Opportunity to work on sawn Backlaped wafers Support and specific process

Link to other tools

Dicing before grindring i.e DFD 6361, DAG 810, RAD 2500, RAD 2000, plasma release.

17 A SCS competitivness cluster platform, Coordinated by ARCSIS

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ADVANCED TECHNOLOGY STUD BUMP K&S AT/PREMIER STUD BUMP

18

Wafers

Up to 300 mm (12‟‟)

Pads

Size : 80 µm (aside)

Positioning acurancy

Few micrometers

Bumps

Size : on average 70 µm Pitch : 50µm in-line (@3sigma)

Gold wire

Diameter: 20-50 µm (25 µm average)

Throughput

25 bumps/s

Stud bump

Back-end

Micro-packaging prototyping

Specifications

Accu bump

Coined bump 18 A SCS competitivness cluster platform, Coordinated by ARCSIS

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19

Flip chip die attach Datacon APM+ With EEAA APM module

The Datacon 2200 apm Multi-Chip Die Bonder provides flexible, single-pass process capability. Handles all die attach and flip chip processes - COB, FCOB, MCM, hybrid, stacked die, PBGA, FCBGA, CSP, SIP – at up to 2200 UPH. The Datacon 2200 apm+ Multi-Chip Die Bonder handles 300mm wafers and die up to 50mm with 5¾m @3s placement accuracy. The Datacon 2200 apm+ addresses specialized advanced packaging needs.

Back-end

Micro-packaging prototyping

General d escription

Our configuration is a bimodular: First module : all die attach and flip chip processes Second module: SMT components die attach Use these modules to establish your process Datacon 2200 apm manages automatic film handling for Reel-to-Reel processes. Each module (Flip-Chip & SMT) contains: heating downholder heating, motorized head motorized table, chips and components handling camera positioning (substrate, head support) & correction system on head (camera up looking) needles ejection

benefits Process flexibility Different types of media, substrates, needles Support 12'' wafers Opportunity to work inked and inkless technology Reel-to-Reel (35 mm film) Automatic module film advance Consistent with thin dies Processes for sensitive substrates (including temperature) head support heating (lower temperature for polymerization) Conductive and non conductive die bonding Flip chip: NCP, ACP, ACF compatibility

19 A SCS competitivness cluster platform, Coordinated by ARCSIS

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20

Flip chip die attach Datacon APM+ With EEAA APM module

Wire bonder fine pitch ESEC 3100 Dicing before grindring i.e DFD 6361, DAG 810, RAD 2500, RAD 2000, plasma release

Specifications

Substrates

Wafers 6, 8, 12‟ 35 mm film

Temperatures

Work holder : 200 °C maxi Head : 250 °C maxi

Components

Up to 100 mm²

Throughput

Accuracy Needles Bond force

Back-end

Micro-packaging prototyping

Link to other tools

Strip Reel to Reel 5 μm (Uplooking), 10 μm (Normal) Charpy, round, flat From 0 g to 1200 g

20 A SCS competitivness cluster platform, Coordinated by ARCSIS

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FLIP CHIP

+ DIE ATTACH

21

MANUEL DOCTOR TRETSKY+

T3002-FC3

The machines are easy configurable and allow carrying out multiple processes as dispensing or stamping, as die attach or flip chip, as polymerization of adhesive or soldering under inert atmosphere, as thermocompression or ultrasonic. Components can be picked up from any medias. The positioning accuracy reaches less than 5Âľm and the machines are equipped with controls and programming to ensure reproducible operations and results

Back-end

Micro-packaging prototyping

General d escription

Wafer support mobile Ejector system chip Bonding tool Bonding scheduler

benefits Transfer system specific chip and good quality With the ejector chip Tresky Flexibility and ease to use With complete freedom of movement Reliability and repeatability work With automatic control of bonding strength versatile Equipment Thanks to the different possible configurations

Link to other tools Dicing before grindring i.e DFD 6361, DAG 810, RAD 2500, RAD 2000, plasma release. 21 A SCS competitivness cluster platform, Coordinated by ARCSIS

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FLIP CHIP

+ DIE ATTACH

22

MANUEL DOCTOR TRETSKY+

T3002-FC3

Moving area

X-Y : 220 mm x 220 mm Z : 95 mm (automatic)

Components

0,2 mm x 0,2 mm (mini

Speed

5s

Die bonding

Back-end

Micro-packaging prototyping

Specifications

Strong from 15 g to 400g Less than 5 µm

Wafer size

up to 8"

Handling type

Wafer, waffle pack, GelPak®,

Dispensing process

Heated bond head and substrate heating

Applications

Die attach, Die Sorting, Flip chip, Hybrid/MCM, Laser Diode, Stacked die, Eutectic

22 A SCS competitivness cluster platform, Coordinated by ARCSIS

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WIRE BONDER FINE PICH ESEC 3100

23

This is an automatic gold ball BONDER Fine Pitch cabling equipment. It is designed for applications development / prototyping that allows for wired OR connections between an electronic component (chip, memory ...) and a flexible or rigid substrate (PCB, flexible film Smart Card). The Esec Wire Bonder 3100 pro-vides limitless levels of performance. Thanks to the unique pivoting bond head and many other cutting edge features, it consistently overcomes perfor-mance barriers, offering unprecedented levels of speed and accuracy. The 3100 is laid out for all the latest packaging technologies

Back-end

Micro-packaging prototyping

General d escription

benefits ultrafine pitch developments to 40 microns with loop heights below 50 microns: Precision actuators, many parameters of loops Copper extension kit enables this bonding platform to process copper wire of up to 25 ¾m diameter. Achievements in different media: flexible (type S35 and S70), rigid (PCB type, cases DIL, QFN‌): Rail adaptable Modular Equipment Reel to reel Handler Ball bonding / reverse bonding Chip interconnection fine, up to thicknesses of 50 micron: Force control and positioning during welding Ball bonding copper and gold

23 A SCS competitivness cluster platform, Coordinated by ARCSIS

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WIRE BONDER FINE PICH ESEC 3100

24

All other micropackaging tools

Back-end

Micro-packaging prototyping

Link to other tools

Specifications Welding

Gold Wire

Oven temperatures Electro acoustical soldering Frequency Positioning precision

Area : 52×70 mm² maxi Wire diameter: 25µm Wire : 7/s maxi Length: 9mm maxi From 0 to 300°C 128 KHZ ±2,5 µm

Detection threshold force

20 mN

Cycle time

56ms (standard loop)

Fine Pich

35 µm in-line

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25

Pulls and shear tests Metronelec DAGE 4000

The DAGE 4000 is characterization equipment used for performing various types of pull and shear tests on dice, wires and bumps for validating a bonding process. It consists of: Manual motorized sample holder Measuring arm Binocular for settings Soft, treatment results

Back-end

Micro-packaging prototyping

General d escription

benefits Flexibility, allowing for a wide range of measurements. Different types of treatment Accurate measurements DAGE experience A rapid and definitive characterization tool Automated result processing software Bond 'pad structure characterization and validation

Link to other tools

Stud bump Wire bonder Die bonder

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26

Pulls and shear tests Metronelec DAGE 4000

Test speed

Strenght max

5-7mm/s Wire pull

10kg

Tweeze Pull/peel

5kg

Ball shear

250g

Solder ball shear

5kg

Die shear

100kg

Precision

0,25%

Resolution X/Y

1Âľm

Back-end

Micro-packaging prototyping

Specifications

Bump

Stitch aluminium 26 A SCS competitivness cluster platform, Coordinated by ARCSIS

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27

Encapsulation Camalot

Back-end

The Camalot FX-D from Speedline enables chip encapsulation on flexible and rigid substrates using various types of resines: thermal curing resine and UV curable resine (viscous and fluid to make Dam&Fill). Configurable as stand alone or in-line, this new platform provides a low cost dispenser with mid-to-high end performance. The FX-D employs a combination of industry proven technologies in an easy-to-use, configurable and reliable dispensing system. Control using Benchmark™ software within the Windows® XP environment facilitates a quick, “hassle free” program creation and fast product changeovers. The base platform can be conveniently reconfigured or upgraded to easily accommodate a change in process requirements. The pumps used on the Camalot FX-D platform are based on proven designs, enhanced with closed loop DC servomotors. These new motors provide a finer dispense resolution and adjustable speeds that deliver material to your product in a way that is faster and more precise. Various auger screw pitches are available for applications with more stringent volume requirements. Optional: This tool can be automatically loaded and unloaded using 35 mm film on reel.

Micro-packaging prototyping

General d escription

benefits A fast and accurate industry process: “reel-to-reel” system, fully automated process, closed loop control of the DAM&FILL. Flexibility of the equipment for process development: modular dispensing system, support for various substrates Production of heterogeneous packages

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28

Encapsulation Camalot

Flip chip die attach manual Dr Tretsky Flip chip die attach DATACON Wire bonder fine pitch ESEC 3100

Viscosity range per pump 635D 680 MPP

100000 cP 60000 to 100000 cP 1500 to 4000 cP

Back-end

Micro-packaging prototyping

Link to other tools

Specifications SMT applications

SMA, solder Paste,Conductive adhesives

Semiconductor packaging

Underfill, encapsulants, thermal grease, Lid Seal, die attach, spacer bead epoxies

Platform performance

Chuck Temperature Range

Ambient to 130°C

Pump/DU temperature Range

Ambient to 50°C

DISPENSE METHOD Pump Control

Closed loop DC servo axis

Total system accuracy (TSA)*** cpk>1.0

±125microns(0.005*)@3sigma

Pump Type

Rotary or positive displacement pumps

XY placement accuracy*

±75 microns (O.003*)@3 sigma

Pump Options

Z Axis accuracy*

±25 microns (O.001*)@3 sigma

XY Axis

6 & 20oz. bulk feed cartridge assembly, low Level sensor STANDARD FEATURES

PreDispense/Purge Station

XY calibration station

Repeatability*

±5microns@3sigma

Light Tower

50” inserted conveyor (inline only) Split beam on-axis llumination Red, Blue or white light

speed

500mm/sec(7.38*/sec)

Vision System

Encoder resolution

2 µm

Computer

Desktop

Gantry drive system

Closed loop DC servo,Ballscrew drive

Operating System

Microsoft Windows XP

Z Axis

Program Storage

Local hard drive, DVD RW,Ethernet

Program Method

Teach camera, off-line programming

Repeatability*

±10µm @ 3σ

speed

188µm /SEC(7.38/sec)

Power Requirements

Encoder resolution

0.3 µm

Air Supply Requirements

Z-Axis type

Closed loop DC servo, Ballscrew drive

Footprint w/50” Conveyor (W x D x H)

10 CFM (4.7l/s) at >80PSI (5.5 bar) filtered @ 5µm 1270mm x 1475mm x 1730mm (50” x 58” x 68”)

Z-sense type

Mechanical probe or CCD Laser

Machine Weight

680 kg (1500lbs.)

DOT PLACEMENT PERFORMANCE

facilities 208 to 240 VAC, 50/60Hz 15 Amps

890 kg (1962lbs.)

Crated Weight

3.00mm pitch**

30,000 DPH

1.27mm ptch**

36,000 DPH

IPC 9850 test PCB**

23,000 DPH

travel Max Dispense Area (XY)***

500mm x 500mm(20” x 20”)

Z-Axis Travel

125mm (5”)

Industry Standards

SMEMA, SEMI S2 & S8 Additional options

Dual Mode Weight Scale

Die edge detection algorithms

Needle Cleaner/Detector

Time Pressure Dispensing

Pipeline Conveyor

Secondary Z Axis XYZ Calibration Station

BOARD HANDLING Conveyor Type

Flat belt with auto width adjust

Min Conveyor Width 25.4mm (1.0”) Above Board Clearance 25.4mm (1.0”) Underboard Clearance 30.5mm (1.2”)

Above Board Clearance 25.4mm (1.0”)

Transport Height

790 to 965mm(32.1” to 38”)

25.4mm (1.0”)

Underboard Clearance 30.5mm (1.2”)

Protocol SMEMA

Protocol SMEMA

Conveyor Options

SMT edge clamps w/vacuum support

Lift Chucks Options

*At Full Speed ** 0.5mm dot diameter 2.5mm needle lift ***Consult factory for specifics. Electronic data sheet available on request. Specifications subject to change without notice.

Heated/non heated, Contact w/vacuum or non contact (convection)

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MILLING AND EMBEDDING

29

MACHINE

MEX

The MEX milling and embedding solution sets the standard for value, speed and reliability in a turnkey smart card solution. The MEX is a perfect solution for companies who are looking to enter the smart card market or for those who currently have a wide variety of projects from one day to another and require enhanced flexibility and capacity. The MEX includes the following components: Input station for 1 Magazine Changer,500 cards Milling Brushing Micromodule film handling system Micro module punching unit Micro module pick and place 2 Hot pressing stations and 1 cold presser ATR Electrical test station (answer to reset) Output station with 1 Changer (Horizontal) In6 line laminator

Card integration

Micro-packaging prototyping

General d escription

benefits Well adapted for small series Easy to use Pre-loaded milling templates for all popular module types Milling depth control A cavity milling depth control automatically compensates for variable card thickness

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MILLING AND EMBEDDING

30

MACHINE

MEX

Globtop Camalot Flip chip die attach Datacon Wire bonder fine pitch ESEC 3100

Card integration

Micro-packaging prototyping

Link to other tools

Specifications Performance

Type of plastic card

Type of film Accuracy Assembly yield Throughtpout

ISO standard (PVC / ABS / PET / PETG / PC) Super 35 mm biposition Âą0,01 mm 99,7% 1800 cph

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31

CUTING TABLE

FC 2250 GRAPHTEC

FC 2250 GRAPHTEC is a compact, professional flatbed cutting plotters capable of processing various materials with accuracy compliant to most industry requirements for pattern making. This equipment can be used to make windows to plastic or paper sheet in order to make an electronic inlay. The FC2250 large format flatbed cutting plotters are ideal for prototyping in printing electronic and flexible substrates micro packaging etc. This flat cutting machine is a tool designed for cutting plastic or heavy paper cartons of type E / F / G. It can also draw directly on substrate all form factors.

Other Tools

Micro-packaging prototyping

General d escription

benefits

ARMS Advanced Detection System Benchmarks Facilitates the cutting of the pre-printed images Alignement system 4 points Ensure accurate contour cutting graphics deformed when printing. Segmentation sizes Compatibility with software creation / illustration. Multiple Page Automatic detection of landmarks

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32

CUTING TABLE

FC 2250 GRAPHTEC

Max cutting surface

1200 x 920 mm

Film width consistent

1010 mm on Y axis

Max cutting speed

400 mm/s

Cutting force configurable

Tool 1: Max. 500 gf in 40 steps (140), Tool 2: Max. 1 kgf in 40 steps (180)

Mini size. characters

About 10 mm (depending on the font type and material)

Mechanical resolution

0.0025 mm

Tools blade

Speed steel, Pen: Water-based fiber, oil-based ballpoint, disposable pen

Film types

Adhesive films (vinyl, fluorescent, reflective), Thick paper / card up to 0.5 mm thick, Sandblasting mask until a thick, high-intensity reflective film, polystyrene foam

Accuracy

Âą0,1% (drawing mode)

Reproducibility

About 0,1 mm (drawing mode)

Other Tools

Micro-packaging prototyping

Specifications

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33

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-packaging prototyping

Not booked equipments Microapckaging prototyping line

supplier

fume acid / base room 10000

HPE

model

scoring boxes

CEPRIM TECHNOLOGIES

83600

Binocular microscope safety area

MOTIC

LED 728? Kseries?

Leica secure area

LEICA

DM-RME

Table Handling

Disco

8-12"

UV irradiation step

Lintec

Precision balance Denver

Denver Instruments

Balance 0-6 kg Denver

Denver Instruments

Summit S-6002

Wire bonder 3006F/XX

Esec

3006F/XX

Welder for bagging

Audion Elektro

Sealmaster 620

ALD

Encapsulix

ITS

VWR ultrasonic bath chemistry USC300TH 10000

VWR

USC300TH

specifications

RAD-2000m/12

PCB etching tank

Mega Electronics

PA104

Hot backend platform (30x30 cm)

Stuart

SD300

Wedge bonding wire bonder KS 8060

K&S

KS 8060

Steaming Backend Heraus

HERAUS

ET405

Memmert oven 100l

Memmert

U40

Binocular microscope backend

Nikon

SMZ 1500

microscope backend

Nikon

LV150

2 ovens secure area

Binder

Turbula mixer

WAB

Agitator-mixer roller

Stuart

Wire bonder Wedge bonding KS 4129

K&S

KS 4129

material: or diameter: 18µm to 33µm

Wire bonder Wedge bonding

Orthodyne

M20

material: aluminium diameter: 6 mills to 25 mills

Turbula T2C

precima (manuel)

material: aluminium diameter: 1 mills to 3 mills

wire bonder

KS

1471

materiau: aluminium diamètre: 18µm à 33µm

ball bonder

KS

1488

materiau: or diamètre: 18µm à 33µm

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34

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Printed electronics

Printed electronics is a merging technology associating microelectronics and foil technologies to design flexible Integrated Smart Systems (ISS). Printed electronics is covering a wide range of ISS products: smart cards, RFID Tags, Wireless sensors, Smart label, Smart clothing, Chemical and biology sensors, and is particularly useful for flexible interconnect technologies: wafer printing for 3D integration, printed wires. Micro-PackS platform has invested up-to-date R&D printers to develop and prototype innovative low cost ISS combining „printed‟ functionalities (interconnects, antennas, energy microsources, sensors…) with silicon IC chips on plastic foils. Micro-PackS offers expertise in following fields: Ink development Surface treatment Printing conditions Sintering/annealing treatments Encapsulation . from a wide range of R&D equipments: Inkjet printers Screen printer Sintering and oven equipments Associated characterization tools In addition to micropackaging line ( see P 7), major equipments are inkjet printer, screen printer, sintering/oven equipments and associated characterization equipments. Platform services: access and support on a large range of equipments to develop new processes, innovative smart objects and new material tests.

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35

INKJET PRINTER CERADROP CERAPRINTER

X-SERIE

Printed electronics

General d escription The Ceraprinter X-Serie is an advanced multi-materials inkjet printer for process development in printed electronics. It provides an exclusive process approach allowing the user to quickly go to functional components. It is based on automated printhead switching and orientation. The CeraPrinter X-Series is the most accurate and versatile inkjet deposition tool on the market for the development of inkjet processes for printed electronics. The CeraPrinter X-Serie includes all the necessary facilities for high-level R&D, pre-production work and small-batch manufacturing for a wide range of applications.

benefits Deposition of a wide range of inks (water based, oil, solvent, UV, biological fluid) dedicated to printed electronics (conductive, dielectric, magnetic, piezoelectric, semi-conductive, photocatalytic, etc.) onto different kinds of substrates such as plastic, paper, glass, ceramics, silicon. High process accuracy A wide range of printing parameters: allow developing various printing strategies focused on accurate reproduction of designed circuits for device integration. Software package with innovative functions: CeraSlice: exclusive software for component design and printing job definition (DropAnalyser): automated jetting analysis software, full report on ejection reliability, non-active nozzles detection. 35 A SCS competitivness cluster platform, Coordinated by ARCSIS

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36

INKJET PRINTER CERADROP CERAPRINTER

X-SERIE

Printed electronics

Specifications 2 printheads 3 translation axes High accuracy droplet positioning system (<3µm in XY and <50 µrad in θ) 300×300 mm² printing area Substrate thickness up to 30 mm Semi automatic realignment of the substrate using camera Drop watcher for droplet observation and jetting tuning Chuck flatness less than 10µm 2 Dimatix Spectra SE printheads 128 nozzles, 30 pL Max printing speed : 500 mm.s-1 Automatic switch and orientation of the printheads

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37

SCREEN PRINTER DEK 260

Printed electronics

General d escription The DEK 260 is an ink screen printing technology for processes as diverse samples as thin film printing and wafer printing. It can be used for a variety of advanced materials applications at film and wafer level.

benefits

Manufacturing repeatability: System ÂŤ VISION DEK ALIGN 3â&#x20AC;? helps a quickly positioning with great accuracy, This system is adapted to dispersion technology thanks to a production tolerances card and to reflection specifications of the different substrates and thinning.

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38

SCREEN PRINTER DEK 260

Printed electronics

Specifications

Automatic alignment system for CCD vision Screen Cleaner Wet / Dry Screen area of 440 x 430 mm Accuracy of ± 5µm screen at 3 sigma Repeatability of ± 50 µm 3-sigma

Emulsion thickness 0 - 50µm ± 2µm; 51 - 100µm ± 5µm; 101 500 µm ±10%; 501 - 1000µm ±15%

Line widths from 50µm

Maximum Frame size 1000 x 1000mm O/D

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39

DIGITAL INKJET PRINTING

FUJIFILM

DIMATIX PRINTER

Printed electronics

General d escription This is a small digital ink jet printing system with XYZ motion control. The main feature of this table top printing system is the interchangeable printhead that allows users to fill their own fluids and print immediately. Cartridges can easily be replaced to facilitate printing of series of fluids in a short time. Each single-use cartridge has 16 nozzles linearly spaced at 254 microns with typical drop sizes of 10 pL.

benefits Self contained ready-to-go system Non-contact fluid deposition User-fillable up to 1.5 ml disposable low cost cartridge User-variable drop size and drop density Drop watcher: jetting tuning (active nozzles detection, piezo electric waveform management)

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40

DIGITAL INKJET PRINTING

FUJIFILM

DIMATIX PRINTER

Printed electronics

Specifications

Printing area

200 mm² x 300 mm² (8 in x 12 in) with an adjustable Z height

Print any pattern at 5 - 254 μm dot pitch (100 - 5080 dpi) Wide fluid compatibility/capability Substrates up to 25 mm thick Accuracy±25 μm (± 0.001 in) Heated vacuum table for rigid or flexible substrates Pre-loaded patterns, cleaning cycles and jetting waveforms or create your own Drop watcher Semi automatic realignment of substrate

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INKJET PRINTER JET PAC

41

Printed electronics

General d escription Jetpac is a semi-industrial prototype dedicated to printed electronics by inkjet. This is an in-line system with several built-in stations dedicated to pre and post- printing treatments (see diagram below). The equipment allows achieving different steps for multilayer purposes: De-ionization system for substrate preparation Atmospheric plasma torch dedicated to surface preparation of plastics. UV station: for polymerization of photosensitive inks Microwave oven (under development): for the selective curing and metal inks sintering.

benefits

Simulation of in-line process, equipment near real industrial factory environment Full multilayer processing

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INKJET PRINTER JET PAC

42

Printed electronics

Specifications

All kind of 30x30 cm²substrate (PVC, PET, silicon, etc.)

Support

drops of 30 pL Max. speed: 1 m / s Printing

Printed area wideness: 10,7 mm / pass (multipass approach) 256 nozzles with a resolution of 608 dpi (1pxl = 40Âľm) Conductive inks , Insulating/ semiconductive inks

Inks

Viscosity: 8-20 cP Atmospheric plasma

Gas can be modified upon request Static or dynamic 200W/cm

UV curing

UV source: Ga dopped Hg lamp (can be modified upon request) 350 Watts (for in-line process) 500 Watts (for stand-alone process) Microwave curing

frequency sweeping Central frequency: 6,425 GHz Max band width: 1,15 GHz Sweep time: 0.1 to 10 sec

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INK CURING MACROTRON MICROCURE 2100

43

Printed electronics

General d escription This is equipment dedicated to metallic ink curing. It is composed of: high power microwave generator Stand Alone cavity and inline deported cavity (see Jetpac datasheet) Setup and Process Control on the PC terminal screen Data acquisition Temperature sensors (pyrometer, optical fiber) Adaptable to a inline Roll to Roll process

benefits Low temperature curing of conductive materials on flexible substrates (PVC, PET, etc. ...) Drastic reduction in curing time compared to conventional curing process Wide range of supported media: Plastics (PVC, PET, PI ...), Silicon, Glass, flexible substrates, semi-rigid or Rigid Selective process

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INK CURING MACROTRON MICROCURE 2100

44

Printed electronics

Specifications

Type Substrates / Samples

PVC, PET, PI (Kapton) Silicon (mono-, poly-, Amorphous) glasses

Sample

up to 40 x 40 cm² in standalone cavity

Max power

350 inline process on Jetpac 500 W stand alone cavity

Variable frequency mode (VFM)

frequency sweeping Central frequency: 6,425 GHz ±1,125GHZ

Sweep Rate Adjust:

0.1 to 60 s

Temperature Control

Optic fiber up to 300°C

Temperature Monitor

Up to 4 channels, to 300°C

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45

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Package characterization and failure analysis

These services area is dedicated to micro-assemblies and materials characterization. It includes resources in imaging, microscopy imaging, dimensional measurements, electrical tests, chemical and material characterizations and failure analysis. All characterizations are well adapted for thin silicium and thin System In Package .

Two way to access platform Rent equipments with startups training and support Easy access to characterization tools and failure analysis for each development step leaded by your experts. Request for services operated by platform staff Step 1: A common session to identify your need Step 2: Remote mode with your experts

3D X-ray

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ELLIPSOMETER SOPRA GES-5E

46

The GES-5E-SOPRA Ellipsometer is dedicated to R&D applications. GES5E integrates advanced and well proven opto-mechanical designs coupled to high performance electronics, Spectrometers and spectrographs and user friendly software. The unique advantage of the GES5E Platform is that High Resolution measurement mode. This allows material development qualification but also process development control by Fast routine mapping measurements. As a consequence Ellipsometers are currently used for Thin Film measurements in both R&D and the Industry in the following fields: Semiconductors, Optics, Optical Telecommunications, Flat Panel Displays, Data Storage, Thin Metals, Chemistry, Biology, organic applications etcâ&#x20AC;Ś GES5E Optical Platform allows ellipsometry measurements, made automatically as a function of: wavelength, angle of incidence, polarization state and time. It is characterized by: Automatic Goniometer, Automatic Microspots, Automatic Compensator/Retarder, Automatic wavelength scanning by spectroscopic apparatus

Dimensional analysis

Package characterization

General d escription

benefits Non destructive measurement method: non contact method, High resolution thickness measurement, Multilayer thickness measurement Refractive index of materials

Link to other tools Useful to compare thickness measurements with standard profilometry.

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ELLIPSOMETER SOPRA GES-5E

47

Spectral range from 190nm to 900nm 6 inches sample stage size

Dimensional analysis

Package characterization

Specifications

Parallel and focused beam

Resolution < 0,5 nm Angle from 7 to 90째

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48

MECHANICAL PROFILOMETER

AMBIOS TECHNOLOGY / XP

This equipment can measure topography and create a profile one dimension (Z profile) . It is composed of: Motorized sample holder (XY) & manual (rotation) Edge, adjustable force Positioning camera Software control Optical sensor, very low inertia Post-processing (filters & measurement algorithms)

Dimensional analysis

Package characterization

General d escription

benefits

Rapid and repetitive measurements of step height on various samples (deposit, etchingâ&#x20AC;Ś) Vacuum chuck & motor controlled by an intuitive software, easy camera positioning Measurements on fragile samples Setting the contact force of the stylus A wide range of measures, with high precision Software with multiple algorithms, isolated chamber measures

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49

MECHANICAL PROFILOMETER

AMBIOS TECHNOLOGY / XP

Sample Chuck

200 mm

Thickness

30 mm max

Scan length

80 mm max

Dimensional analysis

Package characterization

Specifications

Measure Z

Resolution

From 100 to 400 microns maximum 10μm 100 microns 400μm

Tip

12 microns in radius

Strenght

0.05 to 10 mg

Zoom

40×160

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50

OPTICAL PROFILER

VEECO / NT11OO

The VEECO/NT1100 is an optical profiler, for non transparent materials, allowing noncontact topological characterisation of a 3D surface in highresolution, with the ability to capture a wide range of features from subnanometer to millimeter. The equipment features:

Dimensional analysis

Package characterization

General d escription

Exchangeable objectives White light source Movable plate with tilt Software control, treatment

benefits

Swift and repetitive measurements Precision and accuracy measurements: optical system performance, soft control Complete data analysis: software contains approximately 200 algorithms

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51

OPTICAL PROFILER

VEECO / NT11OO

Modes

VSI: white light interferometry PSI: phase shift interferometry

Dimensional analysis

Package characterization

Specifications

Camera lenses objectives

× 5 × 50

Zoom

×0,5 × 2

Field Of View

0.05 to 8.24mm

Tungsten Halogen Lamp Z-Range

0.1nm to 1mm

Resolution

<10 nm

2D Scan speed

7.2µm / s max

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52

CLIMATIC CHAMBER CHOCK

CTS / TSS-70-32

The CTS temperature shock test chamber allows temperature variation rates of up to 100 C in one minute. The most common national and international standards are fulfilled (DIN, IEC, MIL). The used compressed air drying system allows up to 3000 test cycles at minimum power consumption without defrosting.

Reliability

Package characterization

General d escription

This equipment performs heat shock-like "air to airâ&#x20AC;? test on different types of electronic samples: bare components in boxes, flexible and rigid micro assemblies and complex electronic packages.

benefits

Display control, touch screen and PC remote control software: Comprehensive approach to supervision: programming, recording and viewing Rapid temperature change and realization of cycles hot / cold without icing phenomenon

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53

CLIMATIC CHAMBER CHOCK

CTS / TSS-70-32

Shelf Net capacity

32 Liters

Surface

30cm x36cm

Height

30 cm

Weight

3kg max

Reliability

Package characterization

Specifications

Temperature Cold

from - 80 ° C to +100 ° C

Hot

From 50 ° C to 200 ° C

Uniformity

± 0.1 to 0.3° C

Variation

6 ° C / min

Precision

±1°C

Transfer time

<10 sec

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54

VARIATION IN CLIMATIC CHAMBER

CTS / CS-70-200-5

Temperature/Climatic Stress Screening Chambers. Our temperature and climatic stress screening test chamber CS allow extremely high temperature variation rates up to 30 째C / min. These units will give you the possibility to determine the stress limits of your specimen very quickly. This equipment performs climatic test (temperature and hygrometry fixed or variable) of electronic samples: bare components in boxes, flexible and rigid micro assemblies and complex electronic packages.

Reliability

Package characterization

General d escription

Option: electrical bench for insitu electrical test

benefits Display control, touch screen and PC remote control software: Comprehensive approach to supervision: programming, recording and viewing Stability and reproducibility of measurements : Measurement and control of temperature and hygrometry in real time

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55

VARIATION IN CLIMATIC CHAMBER

CTS / CS-70-200-5

Shelf Volume

around. 200 Liters

Surface

65cm x40cm

Height

76 cm

Weight

35kg Max

Reliability

Package characterization

Specifications

Temperature Range

from 70 ° C to +180 ° C

Variation

5 ° C / min

Fluctuation

± 0.1 to 0.5 ° C Humidity

Range

from 10% to 98% RH

Temperature

10 ° C to 95 ° C

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56

STEAMING SALT SPRAY

CTS / SSC-140

The salt spray test is a standardized test method used to check corrosion resistance of coated samples. Coatings provide corrosion resistance to metallic parts made of steel, zamak or brass. Since coatings can provide a high corrosion resistance through the intended life of the part in use, it is necessary to check corrosion resistance by other means. Salt spray test is an accelerated corrosion test that produces a corrosive attack to the coated samples in order to predict its suitability in use as a protective finish. The appearance of corrosion products (oxides) is evaluated after a period of time. Test duration depends on the corrosion resistance of the coating; the more corrosion resistant the coating is, the longer the period in testing without showing signs of corrosion. This equipment performs tests in atmospheres saturated with sodium chloride, according to rigorous international standards. This allows predicting and verifying the lifetime of objects, materials and their surface coatings.

Reliability

Package characterization

General d escription

benefits Ease to use Through control panel and adjusting temperature, flow rate and rotation of the pump No contamination of samples during the test cycles With a tank full of plastic Reliable and repeatable measurement

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57

STEAMING SALT SPRAY

CTS / SSC-140

Tank

Volume

140 Liters

Area

70cm x 35cm

Height

57 cm

Reliability

Package characterization

Specifications

Temperature

Range

From 5 ° C to 50 ° C

Operating pressure

around 1 kg / cm ²

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58

AFM

V EECO / CP - II

Atomic force microscopy (AFM) or scanning force microscopy (SFM) is a very high-resolution type of scanning probe microscopy, with demonstrated resolution on the order of fractions of a nanometer, more than 1000 times better than the optical diffraction limit. The AFM is one of the foremost tools for imaging, measuring, and manipulating matter at the nanoscale. The information is gathered by "feeling" the surface with a mechanical probe. This technique is routinely used characterization of magnetic surfaces and structures.

Imaging

Package characterization

General d escription

It is composed of: Sample holder, movable in X and Y AFM tip (switchable) Protective glove

benefits Characterization of organic semiconductors Thanks to the protection of the glove box* Possibility of measures in a liquid medium Imaging of electrical, mechanical, thermal and magnetic surfaces Manipulation of nano-objects Nano-lithography

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59

AFM

V EECO / CP - II

Specifications

Possible field

80μm x80μm

Resolution

close to the Ångstrom

Different modes of use:

Contact, Tapping, E-Force, Kelvin

Imaging

Package characterization

Specifications

probe, conductive AFM, Magnetic and Thermal Mode AFM, nanolithography, nano– indenter

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60

INTERFEROMETRY

FOGALE TMAP-300 M

It is a standard and customized system well suited to new metrology requirements for MEMS and semiconductor applications. Specially designed for the semiconductor applications, the T-MAP is equipped with one or two IR sensors to measures wafer geometry parameters such as thickness, TTV, shape and flatness. Capable of handling 2 inches to 300 mm wafers, T-MAP provides highly accurate and repeatable measurements on mono and multilayer substrates for all kind of materials. The whole system and especially the human-machine interface software were designed to enable the easiest and fastest measurement for the user. The optional microscopy capability is the perfect solution to perform the metrology on defined patterns of product wafers.

Imaging

Package characterization

General d escription

benefits

Microscopy capability and pattern recognition for measurement on areas defined by customer IR microscopy capability to detect post bonding defects for multi layer substrates The perfect solution for wafer on temporary carrier thinning process control Inspection and metrology for die stacking Reliability and maintenability Replacement of sensors doesnâ&#x20AC;&#x;t required calibration

60 A SCS competitivness cluster platform, Coordinated by ARCSIS

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INTERFEROMETRY

FOGALE TMAP-300 M

61

Imaging

Package characterization

Specifications

specifications

T-Point Table top Thickness/TTV measurement solution T-Map 300M Semi automatic tool for 2",3", 100mm, 125mm, 150mm, 200mm and 300mm wafers T-Map 200A Fully automated tool for 200 mm wafers T-Map 300A Fully automated for 300mm wafers Tool configuration

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62

SCANNING ELECTRON MICROSCOPE

MEB EVO 50 XVP

The EVO速50 series provides quality results from a versatile analytical microscope with a very large specimen chamber. Whether the specimen requires imaging in high vacuum, XVP速 . The class leading x-ray geometry provides users with the most accurate analyses in High Vacuum, extended Variable Pressure (XVP速).

Imaging

Package characterization

General d escription

The EVO速50 can handle 250 mm diameter specimens at the analytical working distance of 8.5 mm owing to the combination of large movement s tag e, in c lined d et ect ors and c o n ica l ob jec t iv e lens . This is a high performance scanning electron microscope It is caracterized by: electron backscattered electron diffraction motorised 5 axis stage constraints (Platinum traction / bending) and temperature (Chuck cooled / heated)

benefits

Simplicity and flexibility of use: motorized table, intuitive control system

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63

SCANNING ELECTRON MICROSCOPE

MEB EVO 50 XVP

tungsten Beam Canon Tension acceleration

200V to 30KV

SE-detector, QBSD resolution

3nm at 30kV

Variable pressure mode

10 Pa to 400 Pa detector QBSD

Sample holder

100mm, motorized 5 axis

Sample size-diameter

250mm

Height

120mm

Possibility to use a traction plate

200 째 C hot plate, cryogenic plate

Imaging

Package characterization

Specifications

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64

SEM

C ARL ZEISS ULTRA 55

The ULTRA FE-SEM is the ultimate lab tool to meet the most demanding requirements from material science, life science and semiconductor applications. The ULTRA FESEM integrates the latest developments in GEMINI® technology utilizing a newly developed Energy selective Backscattered detector (EsB®).

Imaging

Package characterization

General d escription

The ULTRA features the GEMINI® In-lens SE detector for clear topographic imaging and the EsB® detector for compositional contrast imaging enabling simultaneous real time imaging and mixing of both signals. The EsB® detector incorporates filtering technology which enables high resolution energy selective BSE imaging at low voltages revealing previously unseen image details. This is a scanning electron microscope, capable of producing high resolution images of the surface of a sample and a 3D vision of an object micrometer. It is composed of: EDX detector last generation (OxFORD), Probe qualitative and quantitative analysis EBSD detector (Oxford) Image processing system, and control STEM mode: Transmission operation Large chamber with integrated airlock O2 plasma Cleaning system 5-axis motorized table

benefits Ideal for sizing of nanoparticles: High resolution, precise control of positioning, Soft Image Processing specific method for sensitive samples: High-resolution low -energy image processing system Simplicity and flexibility of use: Motorized table, intuitive control system

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65

SEM

C ARL ZEISS ULTRA 55

Resolution

1 nm @ 15 kV, 1.7 nm @ 1 kV, 0.1 kV @ 4 nm

Voltage

0.1 to 30 kV

Magnification

12 to 900,000 x

Chamber

330 x 270 mm ² (8-inch wafers)

Mode

STEM, EDX, EBSD

Imaging

Package characterization

Specifications

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RAMAN MICROSCOPE HORIBA JOBIN-YVON LABRAM-HRX

66

The LabRAM HR systems provide high spectroscopic resolution and a unique wavelength range capability that offers both great flexibility and high performance. They are widely used for standard Raman analysis, photoluminescence (PL), tip enhanced Raman scattering (TERS) and other hybrid methods. High spectral mode is ideal for subtle band analysis such as that for phase (crystalline/amorphous), weak bonding forces and semiconductor stress measurements The LabRam-HR provides local molecular composition and structure characterization of all types of materials (Raman sensitive, which is not the case of unoxidized metals). It is equipped with several specialized lenses (numerical aperture, long working distance or immersion objectives). An automatic motorized and controlled by computer allows hyperspectral imaging confocal Raman. It is also composed of: Lasers (HeCd, Ar, HeNe and diode laser) Filter Network optical path detector

Imaging

Package characterization

General d escription

benefits

Non-destructive measurement at atmospheric pressure and without sample preparation Measures in different Wavelength with the availability of several lasers Sample Mapping through a system of moving X-Y

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RAMAN MICROSCOPE HORIBA JOBIN-YVON LABRAM-HRX

67

Analyzed volume

500 nm to 1 micron in diameter

Precision X-Y

0.1 microns

Z Accuracy

0.5 microns

Spectral resolution

0.2 cm-1

Available range

325, 488, 514, 633 and 785 nm

Spot size

1Âľm

Imaging

Package characterization

Specifications

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68

ACOUSTIC MICROSCOPY

SONOSCAN D9000 C-SAM

This is an acoustic microscope for viewing at the micrometer scale. The acoustic "images" obtained from samples lay down under DI water can provide information on the mechanical properties (density, elasticity, viscosity, porosity ...) and structure (relief, microcracks…) dedicated to failure analysis, process development, material characterization, low-volume production, or other lab inspections.

Imaging

Package characterization

General d escription

The D9000™ delivers maximum flexibility for detailed inspections. Operating in both reflection and transmission modes, the D9000 delivers a level of accuracy and robustness that sets the contemporary standard for AMI.

benefits

Essential for failure analysis: Nondestructive inspection of samples, detection of defects Reliable results and high precision : Fault location of 20 µm minimum, advanced image processing Virtual Rescanning Mode (VRM)™ : Collects and digitally stores comprehensive acoustic data enabling you to perform a complete analysis of a sample, even when it is no longer available.

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69

ACOUSTIC MICROSCOPY

SONOSCAN D9000 C-SAM

Precision

From 20 to 50 microns

Sample size

Up to 12‟‟ Wafers

Imaging

Package characterization

Specifications

Methods Temporal image (TDI) View section (Q-BAM) Digital analyzer (DIA) Simultaneous Transmission and Reflection (STaR)™ Virtual Rescanning Mode (VRM)™ Transductors

15, 50, 100, 230 MHz

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X-RAY IMAGING INSIDIX-COUGAR/VXP

70

Y.Cougar has been designed to meet the widest variety of X-ray inspection requirements in the electronics. This non destructive analysis allows characterization and failure analysis on packaged media, with the option tomography; it provides a 2D/3D representation of the sample with a resolution close to the micron.

Imaging

Package characterization

General d escription

It is composed of: Tomography computation unit dedicated Nano-Focus, to hit "open" Detector resolution, flat Chuck motorized and complete revolution Support tiltable detector Control system and safety Treatment pictures: real time & post-process Software analysis by grayscale

benefits Precision and non destructive analysis Visualization technologies stacked good results within heavy species (gold, copperâ&#x20AC;Ś) 3D visualization and high-resolution aberration-free. Tomographic calculation unit, tiltable detector

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X-RAY IMAGING INSIDIX-COUGAR/VXP

71

Sample size max

2D: 30cm × 30 cm 3D: 1cm × 1cm × 0,5cm Weight: 10kg

Field Of View

5cm × 5 cm

Chuck movement

X, Y, Ø

Z-Detector

tilt + / - 70 °

Resolution

4-5 µm

Voltage

10 to 160 kV

Mode

3D Tomography

Imaging

Package characterization

Specifications

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72

SEMI AUTOMATIC ELECTRIC TEST BENCH (PROBER) SĂ&#x203A;SS MICROTEC PA200

This is a bench equipped for electrical probing of wafers or printed samples. Both static and dynamic electrical measurements are available. It consists of: 8 inches semi automatic prober with termal chuck (Suss microtec PA200) Static parametric analyzer (Keithley 4200) Signal generator (Agilent 33220A) LCR meter (Agilent 4284A) Multimeter (Agilent 34401A) Oscilloscope (Tektronix TDS 1012) Network, impedance and spectrum analyzer (Agilent 4396B) Switching matrix

Electrical and mechanical tests

Package characterization

General d escription

benefits Probe-shield enabling dark and low noise measurements Automation of electrical test and up to 10000 sites probing Automation of parameter extraction Coupled electrical & mechanical measurements with a 4-points bending device and curvature measurement

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73

SEMI AUTOMATIC ELECTRIC TEST BENCH (PROBER) SÛSS MICROTEC PA200

1fA current resolution Dynamic measurements up to 1GHz

Electrical and mechanical tests

Package characterization

Specifications

Up to 8 micromanipulators, 50 µm pads probing and probing card capability Temperature control 20-200°C Up to 1.8GHz dynamic measurement capability (Vector Network Analyser VNA) Probe card: 12 points on the same media

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NANO-INDENTER XP

74

The Nano-Indenter performs indentation tests by driving a (diamond, saphir…) indenter into the specimen surface and dynamically collecting the applied force and displacement data. Material properties are derived from the load and depth data. Specimens are typically relatively smooth and flat.

Electrical and mechanical tests

Package characterization

General d escription

Hardness, elastic modulus, data are produced and can be exported as Excel spreadsheets. Test positions are targeted using an optical imaging system with a 250X display. Available options: System for measuring lateral force DCM head dedicated to soft materials and very low forces and deflections Strong support up to 60°mN Heating stage for mounting to 350 ° C

benefits Reproducible local measurements Programs builders, dedicated programs, Automatic control measures Accurate measurements The value of each mechanical property (hardness, Young's modulus) is obtained by averaging several dozen separate measures Characterization of thin films (thickness> 0.5 microns) possible without the influence of substrate Lateral resolution of the proper equipment

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NANO-INDENTER XP

75

Sample Size

Diameter: 3 cm 10 cm × 10 cm

Thickness

Max: 5 cm

Electrical and mechanical tests

Package characterization

Specifications

Indentation Resolution

<1 nm

Depth analysis

Max: 750 µm Load

Resolution

100 nN

Maximum

600 mN

Contact force

<1.0 μN

Optical Zoom

10 × OFF

Measuring time

approx. 1 hour (for a known material)

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76

THERMECHANICAL TESTING PLATFORM

DMA25

Dynamic mechanical analysis (abbreviated DMA, also known as dynamic mechanical spectroscopy) is a technique used to study and characterize materials. It is most useful for studying the viscoelastic behavior of polymers. A sinusoidal stress is applied and the strain in the material is measured, allowing one to determine the complex modulus. The temperature of the sample or the frequency of the stress are often varied, leading to variations in the complex modulus; this approach can be used to locate the glass transition temperature of the material, as well as to identify transitions corresponding to other molecular motions. DMA25 platform performs:

Polymers and characterization

Package characterization

General d escription

Determination of glass and secondary transitions Analysis of polymers and composites Analysis of films and specimens with small stiffness Tests on materials immersed in a liquid Materials humidity dependence analysis R&D/Quality control Possibility of Thermal Mechanical Analysis mode

benefits

Precision: guaranteeing precise analysis and optimum control of all parameters influencing the measurement. High force :with a dedicated electrodynamic actuator (01dB-Metravib patent). Suited for each material : A range of 10 specimen holders allows different types of strain ( 3 and 4 points bending, tension, compression)

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77

THERMECHANICAL TESTING PLATFORM

DMA25

Frequency range

1E-5 Hz to 200 Hz Resolution: 0,01%

Dynamic force (max)

50 N peak to peak

Static force (max)

25 N peak to peak

Dynamic displacement (max)

6 mm peak to peak Resolution: 1,5nm

Temperature range

From -150 to 500 °C

Hygrometry control

2% to 85% RH

Young’s modulus (Pa) Tan delta resolution

1E3 to 3E12 Resolution: 4,5 decades 0.00001 à 100 Resolution: 0,00001 Elastomers, thermoplastic polymers, thermosets, composites, biomaterials, powder...

Materials

Mechanical testing modes and specimen holders

Magnitude of sample dimensions

TMA Mode

Polymers and characterization

Package characterization

Specifications

Tension / compression / shear / 3 points bending/single-dual cantilever for rigid & soft materials

Max: L×l×w=6×3×3 cm3 Size is material dependant

For measuring coefficient of Thermal Expansion

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DSC (DIFFERENTIAL SCANNING CALORIMETRY)TA INSTRUMENTS / DSC Q200

78

Differential Scanning Calorimeters (DSC) measures temperatures and heat flows associated with thermal transitions in a material. Common usage includes investigation, selection, comparison and end-use performance evaluation of materials in research, quality control and production applications. Properties measured include glass transitions, "cold" crystallization, phase changes, melting, crystallization, product stability, cure / cure kinetics, and oxidative stability, to determine the plastic-elastic coefficient of the materials and to visualize the state of matter (temperatures and enthalpies of melting and crystallization, crystallinity ...). it is composed of :

Polymers and characterization

Package characterization

General d escription

Isolated cell with Tzero 速 technology Measurement systems Digital flow controllers Software acquisition and processing Polder, liquid, solid

benefits

Precise measurements Flexible measures

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DSC (DIFFERENTIAL SCANNING CALORIMETRY)TA INSTRUMENTS / DSC Q200

79

Temperature Range Ambient

to 725 °C

With cooling accessories

-180 to 725 °C

Temperature Accuracy

+/- 0.1 °C

Temperature Precision

+/- 0.05 °C

Calorimetric Reproducibility (indium metal)

+/- 0.1 %

Calorimetric Precision (indium metal)

Polymers and characterization

Package characterization

Specifications

+/- 0.1 %

Baseline Curvature (Tzero; -50 to 300 °C)

10 μW

Baseline Reproducibility with Tzero

+/- 10 μW

Sensitivity

0.2 μW

Crucible size

2-3 mm3

Mode

UV reticulation

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80

GONIOMETER OF WETABILITY APOLLO INSTRUMENT / OCA

The goniometer of wetability performs an analysis of drops using video, as well as contact angle measurements, surface tension and surface energy. It allow data transfers of up to 360 images per second.

Polymers and characterization

Package characterization

General d escription

It is composed of: Means for dispensing drops automatic Tank with heating and cooling A CCD camera Control and processing software Several sample holder available

benefits

Measures of wetting hysteresis Holder tilt, acquisition by the camera Movie recording video of the evolution of the drop Acquisition & Software Camera Measurements with different viscosities Heating / cooling fluid Repeatability of measurements Automatic exemption

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81

GONIOMETER OF WETABILITY APOLLO INSTRUMENT / OCA 200

Drop

a minimum 1µl

Temperature

10 to 80 ° C

Camera

1024x1024

OCA

Fitting with the given model

Polymers and characterization

Package characterization

Specifications

100mm wafers 3 types

low surface tilt

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82

ION POLISHING

GATAN ILLION 693

This technique is a planar surface preparation and polishing for SEM Cross Section Viewing (CSV). The Gatan Ilion+™ is a significant advance in the preparation of planar cross sections from difficult samples for microscopic imaging and microanalysis. The system is easy to operate allowing users to begin making samples quickly.

Sample preparation

Package characterization

General d escription

benefits

Reduced heat damage with cryogenic finger to fragile samples ( paper, plastic...) Large area section: 800µm. Large area cross sections facilitate more efficient fault/defect surveys and comparative analysis Zoom optics, Milling progress can be observed in real time Grinding attack speed: 150µm/H with Si Surface deprocessing capability

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83

ION POLISHING

GATAN ILLION 693

Ion Guns

Two Penning ion guns with miniature rare earth magnets

Milling Angle

+10° to -10°, Each gun independently adjustable

Ion Beam Energy

100eV to 6.0KeV

Beam diameter

350µm FWHM at 5keV - 800 µm FWHM at 5KeV for Broad Beam guns

Ion Current Density

10mA/cm² Peak

Beam alignment

Precision beam alignment using fluorescent screen

Beam diameter

Adjustable using gas control

Sample preparation

Package characterization

Specifications

Specimen Stage Sample Size

Up to 10mm X 5mm X 3mm

Mounting

Gatan patented DuoPost™ (Standard)

Rotation

Variable from 1 to 6rpm

Beam Modulation

Single or double sector for exceptional crosssectioning

Viewing

CCD imaging with 17" LCD monitor 300x - 2200x

Vacuum Dry Pumping System

Two stage diaphragm pump backing a 70 l/sec turbo drag pump

Pressure

5E-6 Torr base pressure, 8E-5 Torr operating pressure

Vacuum gauge

Cold cathode type for main chamber. Solid-state for backing pump.

Specimen airlock

Gatan Whisperlok™, specimen exchange time <30 seconds

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84

ION POLISHING MODEL

692 PECS

The ideal instrument for any application requiring sample etching and/or high-resolution sputter coating. The PECS™ is a unique ion beam based etching and sputter coating system producing exceptionally large, clean, viewable areas of specimens for Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM) and Light Microscope (LM) applications. The unique design features incorporated into the PECS™ make it very versatile.

Sample preparation

Package characterization

General d escription

Alternative or supplement to wet chemical etching Controlled repeatable results (Ion gun voltage, ion beam current and etching time) Etching and coating in the same vacuum chamber reduces sample handling Sample coating immediately after etching eliminates sample contamination Includes a film thickness Monitor for accurate control of film thickness High sample throughput, patented Whisperlok™ for fast and simple specimen exchange Whisperlok™ features both sample rotation and rocking to ensure uniform etching and coating

benefits Rapidity and efficiency: With a single vaccum chamber to minimize sample handling No wet chemical handling or disposal hazards

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85

ION POLISHING MODEL

692 PECS

Ion guns

Three Penning ion guns with miniature rare earth magnets

Ion Beam Energy

1.0keV to 10.0keV

Beam Diameter

Etching gun 5mm FWHM; sputtering guns 1mm FWHM

Ion Current Density

10mA/cm² Peak

Gas throughput

Argon at 0.1cc/minute/gun

Etched Area

7mm - 10mm dependent on gun energy

Etching Rate

Approximately 10µm/hr for Silicon and 3µm/hr for Tungsten at 10.0keV

Sample Holder

Accepts 32mm Metallographic mounts and multiple SEM stubs

Sample Rotation

Variable speed 10 - 60 rpm

Sample Tilt

Fixed angle or variable rocking angle (0° - 90°)

Sample Rocking

Variable speed 5° /sec - 36° /sec

Option

TEM adapters for side-entry TEM or SEM holders

Sample preparation

Package characterization

Specifications

Coating Coating Rate

Approximately 0.5Å/sec for Carbon and 1.5Å/sec for Chromium at 10.0keV

Coating Area

Uniform over a 30mm diameter

Target Holder

Two dual target sets, externally selectable while under vacuum

Target Materials

Carbon , Chromium, Tungsten, gold-palladium

Thickness Monitor

Standard - Displays coating rate and total coating thickness Vacuum

Dry Pumping System

Pressure

Two stage diaphragm pump backing a 70 l/sec Turbo Drag Pump

5E - 6 Torr (6.6E - 4Pa) base pressure 6E - 5 Torr (8E - 3Pa) operating pressure

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86

SAMPLE PREPARATION FOR MICROSCOPY

A set of equipment to prepare high quality polished surfaces on a wide variety of materials and applications dedicated to die and package failure analysis.

Sample preparation

Package characterization

General d escription

JetEtch (NISEME): acid decapsulation system, The JetEtch is fully programmable and capable of storing multiple etch programs for different package type ASAP-1 ULTRACOLLIMATOR (ultratec): mechanical decapsulation system Preparation System for backside preparation W3242 SAW (ESCIL): Diamond wire dicing saw MR100 Scriber (Optophase):manual cutting of 4â&#x20AC;? wafers manufactured in Silicon but other materials such as Saphire and AsGa are also possible MECATOME T255/300 Presi : a sensitive manual diamond wheel cut-off machine VibroMetÂŽ 2 (BULHER): vibratory polisher, remove Deformation for All Hardness Materials and Multiple Material Specimens LaboPol-1 (Struers) : single speed machine, 250 rpm / LaboPol-5 (Struers) : variable speed, 50-500 rpm, Grinding, lapping and polishing machines for manual or automatic preparation of materialographic specimens. ARC-lite (ultratec): Antireflective coating system for backside analysis MOUNTING PRESS (PRESI) and high precision dispensing (IEI) Preparation for hot molding metallurgical component before polishing

benefits a very effective set of equipment to provide advanced surface & sample preparation

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SAMPLE PREPARATION

87

FOR MICROSCOPY

Sample preparation

Package characterization

Specifications

See features of each equipment.

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88

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Package characterization

Not booked equipments Characterization of the assemblies

supplier

Model

laser profilometer titrator

Keyence schott instruments merk

LJ-G030 titroline

photometer binocular Struers polisher LaboPol-5 Struers polisher LaboPol-1 coater Presi Exemption Manual IEI Bausch & Lomb binocular microscope Leitz microscope Hirayama autoclave Oven Micro Instrument Bench electric stress

Thermal shock chamber Froilabo ATR Robot thermal cycling Equipment for mechanical fatigue ATR Impedance analyzer LeCroy oscilloscope Agilent Signal Generators HP 8657B Signal Generator Network Analyzer / Spectrum / Impedance AGILENT 4396B

Nikon Struers Struers Presi IEI Bausch&Lomb Leitz Hirayama Micro Instrument Keithley Bilt Keithley Froilabo

Spectroquant NOVA 60 SMZ1500 Labopol-5 Labopol-1 AD3000VH

SM-LUX HL 1025G model 0V-500C-2Y 2635 & 2636 BE 100 3706-S CTC System

ATR ATR

X. Boddaert

Solartron LeCroy AGILENT HP AGILENT

SI 1260 6100A 33250A 8657B 4396B

prober Signatone Resistivity - 4 measures pointes

Signatone/ Keithley Lakeshore Jandel

TTPX RM3-AR

Binocular microscope Nikon E013

Nikon

SMZ1500

Optical microscope Nikon E013

Nikon

Eclipse LV150

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89

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

To bring new products to market as quickly as possible, it is important to demonstrate early compliance and interoperability through early, thorough and effective testing. Specifications

Validation/ certification

Field test

Concept proof

Development

Test

Prototype

RF, HF, UHF characterization

RF Pre-certification and diagnosis

Business development

Micro-packS test service Availability of pre-certification test benches for validation before having the proof of concept (to anticipate standard issues). Micro-packS platform offers pre-certification benches and expertise on demand, with academic lab partnership. Two levels of services - access to a pre-certification test suite bench ( booking and payment per day): your expert run test suites and analyze results. Specific tests can also be developed. - on demand: a specific technical agreement is defined with our academic partner Two areas HF test bench for smart card/ Id documents (standard ISO14443 ) ,NFC label and associated reader device with ISEN-IM2NP Toulon partnership. partnership of UFH test bench for RFID TAG ( standard Iso18000/EPC ) associated reader device with the AMU-IM2NP Marseille partnership.

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90

RF PRE-CERTIFICATION AND DIAGNOSIS

RF, HF, UHF characterization

CONTACTLESS TEST BENCH

13,56MHZ PROXIMITY CARD

Contactless HF test bench implements testing tools for analog/digital layer up to application layer targeting both cards and readers (14443 standard) The available test suites (provide by Soliatis): Analog/digital test suites, To validate the analog and digital parts of the ICAO, ISO14443, PayPass,... specifications. There are specific test suites for PICC (contactless card or ePassport) and for PCD (contactless reader). NFC test suites, To validate the analog and the digital layers of an NFC device in card emulation mode and reader mode. There are also SWP test suites dedicated to CLF (Contact-less front-end) and to UICC testing. it is composed of: ProxiSPY V3 ProxiLAB ContactLab Oscilloscope WaveRunner LECROY 44MXI-A 3-axis robot for RFID interoperability 5 axis RFID Robot for pre-certification NI-100 RFID MESURES BENCH This Ultra High Frenquency (UHF) Radio Frequency Identification (RFID) allows you to pre-certificate your device thanks to 3 different modes: Modes Drive Emulation

NI-100

Tag Emulation

Order and Answer

Spie Reader

Tag

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91 RF PRE-CERTIFICATION AND DIAGNOSIS

RF, HF, UHF characterization

HF characterization PICC Analog Test Suite for ICAO and IS Test Suite for Digital PICC ICAO and ISO Test Suite for Applicative PICC ICAO Analog Test Suite PCD ISO Test Suite Digital PCD ISO PICC Analog Test Suite EMV PAC Test Suite Digital PCD EMV PAC Test Suite NFC Forum Analog Test Suite NFC Forum Digital Test Suite ETSI CLF

UHF characterization

der n U

ctio u r st n o c

n

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contact@pf-micropacks.org 33+(0)04 42 61 66 00


92

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Component security analysis

Component security

Component security laboratory aims to developp advanced tools in order to ensure highest level of tamper resistant development. It is organized in 2 areas: Fault injection: laser bench and parametric test bench Side chanels: consumption laboratory and electromagnetic bench

Sample preparation phase necessary

Contact us to have more informations about component Security.

92 A SCS competitivness cluster platform, Coordinated by ARCSIS

www.pf-micropacks.org

contact@pf-micropacks.org 33+(0)04 42 61 66 00


93

R & D T E C H NOL OG Y P L A T F OR M SER V I NG T H E I ND U S T R I A L A ND AC A D EM IC I NNOVA T I ON SEC U R E C OM M U NI C A T I NG OB J E C T S

Micro-PackS thanks you

Booklet realization thanks to F2I-UIMM support

To contact us mail: contact@pf-micropacks.org Phone number: +33 (0)4 42 61 66 00

Website: www.pf-micropacks.org

93 A SCS competitivness cluster platform, Coordinated by ARCSIS

www.pf-micropacks.org

contact@pf-micropacks.org 33+(0)04 42 61 66 00

Product Brochure  

This catalog lists all equipments which can be booked on Micro-PackS platform for each service area. You will find a brief introduction for...

Product Brochure  

This catalog lists all equipments which can be booked on Micro-PackS platform for each service area. You will find a brief introduction for...

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