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DICING

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DIE ATTACH/FLIP CHIP

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ENCAPSULATION

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ENVIRONMENTAL LIFE TEST

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FAILURE ANALYSIS

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TEST & INSPECTION

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WIRE BONDING

Custom Microelectronic Assembly Think SMART. Unique Sensor, MEMS, and Power Sub-Assemblies

PROTOTYPE DEVELOPMENT

ENVIRONMENTAL LIFE TEST

MANUFACTURING SERVICES

SMART Microsystems works with Design Engineers who need high-quality, low volume microelectronic sub-assemblies for their innovative new products. As North America’s leading full-service microelectronic assembly supplier, SMART Microsystems takes complete responsibility for custom process development for your new design, taking it from prototyping through launch in less overall time and cost than other package assembly suppliers. Call us today at 440-366-4203 or visit our website for more information about our capabilities and services.

Innovative Microelectronic Solutions. 141 Innovation Drive, Elyria, Ohio 44035 Telephone: 440.366.4203 info@smartmicrosystems.com SMART Microsystems is Powered by

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MEPTEC Report Fall 2018  

A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council

MEPTEC Report Fall 2018  

A Quarterly Publication of The Microelectronics Packaging & Test Engineering Council

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