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Intel 32nm Technology

Mark Bohr Intel Senior Fellow Logic Technology Development Feb. 10, 2009

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Key Messages • Intel has developed a 32nm logic technology with industry-leading features • Intel is first to demonstrate working 32nm processors • Intel’s 32nm process is on track for production readiness in Q4 ’09 • Both CPU and SoC versions of this 32nm process will be available • Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence 2


Intel Logic Technology Development

Process Name

P1264

P1266

P1268

P1270

P1272

Lithography

65nm

45nm

32nm

22nm

16nm

1st Production

2005

2007

2009

2011

2013

Manufacturing Development

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45nm High-k + Metal Gate Transistors

Revolutionary transistor technology for

improved performance and lower leakage 4


45nm Microprocessor Products Single Core

6 Core

Dual Core

Quad Core

8 Core

45nm production ramp has been the fastest yet Twice as fast as the 65nm ramp in its first year 5


Intel Logic Technology Evolution

Process Name

P1264

P1266

P1268

P1270

P1272

Lithography

65nm

45nm

32nm

22nm

16nm

1st Production

2005

2007

2009

2011

2013

Manufacturing Development

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32nm Technology • 2nd generation high-k + metal gate transistors • Immersion lithography on critical layers • 9 copper + low-k interconnect layers • ~70% dimension scaling from 45nm generation

• Pb-free and halogen-free packages

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32nm Transistors • 2nd generation high-k + metal gate 

0.9nm equivalent oxide thickness high-k (scaled from 1.0 nm on 45nm)

Replacement Metal Gate process flow

30nm gate length

4th generation strained silicon

• >22% performance increase

• Tightest reported gate pitch • Highest reported drive currents

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Transistor Pitch Scaling 1000 Pitch

Gate Pitch (nm) 0.7x every 2 years 100 1995

32nm Generation 112.5 nm Pitch

2000

2005

2010

Transistor gate pitch continues to scale 0.7x every 2 years

Tightest gate pitch of all reported 32nm technologies 9


32nm Transistor Performance NMOS

PMOS

1000

1000 Intel 45nm

100

10

Intel 32nm

+14%

>5x

100

10

Better

1

1.0 V Intel 45nm

IOFF (nA/um)

IOFF (nA/um)

1.0 V

Intel 32nm

+22%

>10x Better

1 0.8 1.0 1.2 1.4 1.6 1.8 2.0 ION (mA/um)

0.6 0.8 1.0 1.2 1.4 1.6 1.8 ION (mA/um)

32nm provides improved performance or reduced leakage

Highest drive current of all reported 32nm technologies 10


SRAM Cell Size Scaling 10

Cell Area (um2)

1 0.5x every 2 years 0.1 1995

2000

32nm Generation 0.171 um2 Cell

2005

2010

Transistor density doubles every 2 years

Moore’s Law continues! 11


32nm SRAM Test Chip

• 0.171 um2 cell • 291 Mbit • >1.9 billion transistors • 4 GHz operation • First demonstrated Sep ’07

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Rapid Yield Improvement 90 nm

Defect Density (log scale)

65 nm

45 nm

32 nm

2 year

Higher Chip Yield

32nm yield improvement on track for Q4 ’09 production 13


32nm Manufacturing Fabs

D1D Oregon - Now

D1C Oregon - 4Q 2009

Fab 32 Arizona - 2010

Fab 11X New Mexico - 2010 14


System Integration Discrete

Memory

Power Regulator

Low Power Logic

High Performance Logic

SoC

I/O High Perf. Logic Memory

Graphics Analog

I/O

Analog

Graphics

Power Reg. Low Power Logic I/O

System integration will continue, using key elements such as the AtomTM core, to realize improved performance and power in a smaller form factor 15


32nm SoC Process

45 nm Process:

Products:

P1266 P1266.8

CPU

SoC

32 nm P1268

P1269

CPU

SoC

22 nm P1270 P1271

CPU

SoC

Intel is developing both CPU and SoC versions of each process generation, to provide transistors, interconnects and other device features optimized for each product line 16


Integrated Device Manufacturer Advantage Process

Product

Design for Manufacturing

Co-Optimized Process+Product Rapid Yield Learning Early Product Ramp Design Tools

Masks

Manufacturing

Packaging

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Summary • Intel has developed a 32nm logic technology with industry-leading features • Intel is first to demonstrate working 32nm processors • Intel’s 32nm process is on track for production readiness in Q4 ’09 • Both CPU and SoC versions of this 32nm process will be available • Intel’s strength as an integrated device manufacturer allows us to continue to deliver new generations of advanced process technology on a 2 year cadence 18


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Mark Bohr 32nm final