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Textool TM

3M/Textool Product Over View 2013 Sep.


TM product over view Textool Evaluation & Burn-in FAST Socket /Textool Function test & Burn-in Major Products

Std. Socket

Available to select various contact SMT type socket Modular style socket

QFN BGA

Type-1

Type-2

Type-3

Type-4

Type-0

Spring probe

One body probe (Stamping contact)

Stamping probe

Heatsink attachment

Production test Socket

BGA / LGA

CMOS

LD


WLCSP typical specification Textool TM Major Textool Products Typical Wafer Level CSP specification 1. 2. 3. 4.

Body Size Pin count Die thickness Bump height

5. Solder ball dia.

0.8mm – 6.5mm 4-196 ball count 0.27mm – 0.45mm 0.5mm pitch 0.4mm pitch 0.3mm pitch 0.5mm pitch 0.4mm pitch 0.3mm pitch

0.25mm 0.21mm 0.17mm 0.30mm 0.25mm 0.20mm

6. WL CSP structure

Bump on repassivation

We evaluated below WLCSP and confirmed our socket applicable to Bench test and HTOL for WLCDP. Thickness : 0.35mm+0.24mm solder ball 0.4mm pitch 14*14 matrix 196pin

Bump on redistribution


Glass Lid FAST Socket Textool TM Major Textool Products Quartz glass Floating Guide

An exploded view of the lid

Application *LED Burn-in and Test *Vision IC Burn-in and Test *WLCSP *Package size coverage : 1mm□ - 8mm□


Textool TM FAST T-0

4 cavity for 3*3mm or less

Multi cavity socket for QFN/CSP FAST T-2

4 cavity for 5*5mm or less


High Power Application


High Power Application


High Power Application


High Power Application


High Power Application


High Power Application


High Power Application


High Power Application


2013 3m fast presentation