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Introduction • The complexity in the outsourced assembly and test (OSAT) industry is blowing up owing to higher functionality demand, longer battery life and thinner forms in handheld devices. • OSAT factories are readily using complex packaging technologies for blurring the line between wafer packaging and wafer processing. • Through Wafer Automation we are able to meet the challenges of various wafer-level architectures, like modern wafer fabrication.

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How Wafer Automation Helps Overcoming Productivity Challenges  

OSAT factories are readily using complex packaging technologies for blurring the line between wafer packaging and wafer processing. Through...

How Wafer Automation Helps Overcoming Productivity Challenges  

OSAT factories are readily using complex packaging technologies for blurring the line between wafer packaging and wafer processing. Through...

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