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PRODUCT BRIEF

Full Version

SERVER STORAGE MOTHERBOARD ACCESSORIES SOLUTION

http://ebg.inventec.com/


Inventec Data Center Solutions

Inventec Data Center solutions are delivered by Inventec Enterprise Business Group (EBG), focusing on providing the best solutions for compute intensive industries in mega data centers, including internet and telecom operators. Since its inception in 1998, the advancing server hardware design and manufacturing capabilities have been trusted by customers such as the world's leading server brands, hyperscale data centers and server hardware integrators. Inventec Design & Manufacturing

Inventec Design and Manufacturing states design and manufacturing excellency for EBG products ranging from rackmount, pedestrian, blade and micro servers, hot, cool, cold storage systems and RAID cards, to datacenter solutions in IT industry, and has expand its footprints in datacenter switches, server management and cloud service software to complete the infrastructure of cloud computing ecosystem.

Inventec Design

Inventec Design features the localized RD capitals reflected from the RD centers collocating in North America, China and Taiwan. They are including the cutting edge lab groups, such as the Electromagnetic Compatibility (EMC) laboratory, which is at cost of seven million US dollars, as well as the thermal, the power, the structure and packaging, the hardware, the software, the signal integration, the product assurance and system integration testing laboratories, etc., to manipulate the ever-changing technic trends of servers.

Global Scale Headquarter

Production Campus

Regional Office

Taiwan

Taiwan Shanghai Czech/Brno Nanjing Mexico/Juarez Chongqing

Silicon Valley Austin Houston Tokyo

Beijing Nanchang Tianjin Xian m²

CTO&BTO

Taiwan / 87100 m² → PC

CTO&BTO

Shanghai / 590000 m²

→ Server

CTO&BTO

Nanjing / 120000m²

→ Handheld

CTO&BTO

Chongqing / 765000 m²

→ PC

CTO&BTO

Czech/Brno / 22900m²

→ Server

CTO&BTO

Mexico/Juarez / 22900

→ Server


So far, Inventec Corporation has obtained over 12,000 global patents with ranking records of “Top 500 US Patent Assignee”, and “Top 10 Invention Patent Winners” for more than 6 years in both Taiwan or in China. In short, Inventec Design phrases the RD capability being way ahead of the peer computer companies.

Inventec Manufacturing

Inventec Manufacturing features the global logistic character of Inventec. Inventec worldwide manufacturing plants’ total footprints are as wide as 730,000 square meters, spanning Asia, North America, and EMEA. The Inventec manufacturing not only reaches global quality and green standards, such as ISO 9001, QC 080000, ISO 14001, OHSAS 18001, ISO 14064-1, etc., but also applies the carbon disclosure project to further engage in green management and green supply chain configuration. Inventec global manufacturing centers make checks at all levels via a variety of intact and certified product quality labs, as well as the component tests of heavy metal content. They not only enhance the reliability of ORT (Ongoing Reliability Test) and the quality of green parts, but also are capable to accredit certificates such as cUL, CSA, TUV, Nemko, CB, Semko, Demko, Fimko, SIQ, Infostruktura, Koncar, Gost, Bellis, EVPU, Uksert, PCBC, CCC, etc. for relating test items. In addition, Inventec’s core management systems, such as Enterprise Resourcing Planning, Supply Chain Management, Product Quote Analysis System, etc., always optimize enterprise resources to provide customers the best integrated solution and working platformsthat deal with product demand, design cooperation, product manufacturing demand, inventory control and management, after-sales service, and more other aspects. In summary, Inventec Manufacturing phrases a partnership built upon global standard manufacturing quality.

World Class Manufacturer

Towards World Class Manufacturing

Manufacturing Excellence

Value-Focused Supply Chain

Collaborative Design Diverse Products Flexible Processes Lean Production Automated Testing Carbon Reduction

Vertical Integration Consolidated Purchasing Global Logistics Strategic Alliances

Green Management

Quality Management

Intelligent Management

E Management


SERVER / STORAGE Intel

AMD

INVENTEC DATA CENTER SOLUTIONS

General Purpose

K888G4

2U1N-2P Rackmount

K405G4

2U1N-1P Rackmount

K885G4

2U1N-2P Rackmount

AI/Deep Learning P90G4

P47G4

4U1N 8-GPGPU Server

HPC

K900G4

2U4N HPC Server

K800QG4

2U1N-4P Rackmount

Storage Solution

U30G4

1U12Bay Storage Server

J80F

JBOF System

2U1N-1P 4-GPGPU Server


SOLUTIONS


ENTERPRISE As with the rapid development of informatization, the application demands for all walks of life diversify: Ranging from the small-and-medium-sized enterprises, which are depended on the local resources and retailer products to obtain solutions and emphasizing the cost, reliability and stability, to the industrial giants, who focus on system performance, quality, and reliability, and demand for the systems with extremely high performance in order to proceed its critical operation missions. Among them, all kinds of applications are emerging in an endless stream, which has raised many new challenges for the enterprise level servers in no matter what aspects, such as product quality, stability, reliability, expandability, availability, high performance, hardware virtualization, big data analysis, to name just a few. In between, VL (Virtualization) tendency has gradually ripened: A wide variety of virtualization solutions have endlessly emerged, coordinated with Cloud Services (Such as Amazon Web Services) to better flexibly and efficiently establish the operation services for the enterprise. Inventec Enterprise Level Server can serve as management node and computing node, and meanwhile support the hardware virtualization for Windows and Linux platforms.

K888G4

2U1N-2P Rackmount

N800G3

1U1N Rackmount

K405G4

K800G3

2U1N-1P Rackmount

2U1N Rackmount

K885G4

2U1N-2P Rackmount


HPC&GPU HPC (High performance computing) and cloud computing center in the present structure are in desperate need to reach the maximal performance, while by the application of virtualization on high density servers can better cater to all demands only with one single machine. Furthermore, in the fields such as life sciences, engineering analysis, molecular dynamics, medical diagnosis, electronic design automation, financial analysis, fluid mechanics, geological sciences, and graphic processing, etc., greater demands on floating-point operation are submitted; applications such as streaming media processing, computer aid design, render farm and so on, are all demanding more floating-point operation, greater memory capacity and storage, where GPU accelerated computing is emerging.

K900G4

P90G4

2U4N HPC Server

K800QG4

4U1N 8-GPGPU Server

K888G3

2U1N-4P Rackmount

2U1N Rackmount

P47G4

K900G3

2U1N-1P 4-GPGPU Server

2U4N Rackmount


Big Data Information techniques of 21th century constantly improve people's life, whilst big data also marks a fast and furious information blast. Datacenters grow terabits of data daily, so the demand for mega storage space is gradually increasing. In between, on account of the fact that the price of hard drive disk has been lowered, a new terminology as cold storage has been defined, meaning that people no longer store the cold data (data not often used) on tape devices, which, instead, is replaced by the low-end hard drive disk directly. In virtualization realm, Microsoft also submitted the new concept: CiB (Cluster-in-a-box), which means a system being self-sufficient in just one box (server), where the storage space keeps adequate, and more than two servers are mutually supporting each other for data backup and recovery in Windows Server operating system. Big data drives the needs of storage, where the market generally uses modular fabrics to construct the equipment specifically employed for one single function, and demanding higher product reliability, security, and durability.

U30G4

U90G3

1U12Bay Storage Server

4U2N Rackmount

J80F

J90G3

JBOF System

4U JBOD Rackmount

U50G3

2U2N Rackmount


Datacenter Every year, the operation maintenance cost of the traditional datacenter remains so high, such as high amount of power consumption, management, human resources, datacenter space cost, and so forth, that it has raised the enterprise a huge challenge of the construction and development of datacenters as well as hastened the cloud computing techniques. Satisfying the thirst of high C/P rate solutions from China datacenters for their rapid growth in cloud business, emphasizing high performance, great power efficiency, security, and open standards, Inventec works with end users proposing rack solutions, which submits consistent standards for Datacenter hardware design norm in order to realize the ideal where datacenters are with low cost and high expandable flexibility. Through the centralized management of power supply and the reduction of energy consumption, the electricity cost of enterprise is able to be lowered in a large scale; with high density design, which means the computing performance of per unit space is multiplied enhanced, a bottleneck in terms of the limited datacenter space for enterprise business expansion is avoided. In the specifications of China Scorpio 2.0, even nodes are diversified, which enables flexible collocation and adaptation to the Cloud Computing Eco-environment in accordance with functional requirements and caters to multiple demands based on the business growth. Furthermore, by centralized management, preceding the real-time management of a large scale of data by the unified interface, monitoring the operation status of datacenter facilities, optimizing the resources, locating the nodes and instantly removing the failures, as well as effectively cutting down the cost caused by the traditional manpower and operation can all be done. Finally, with rapid delivery, by prefabricated datacenter module, the solutions are promptly and directly delivered to clients after test completion, and the support of direct plugging of power and bandwidth eliminates the complicated installation and testing procedures, which makes the delivery efficiency of the process involved in informatization construction dramatically upgraded!

A30G3

14U 21'' China Scorpio 2.0 Rack, up to 8U compute nodes Unit Height: 46.5mm

A80G3

42U 21'' China Scorpio 2.0 Rack, up to 32U compute nodes Unit Height: 46.5mm


SERVER

PRODUCT BRIEF Intel

AMD

K888G4

K405G4

K800QG4

K885G4

K900G4

P47G4

P90G4

INVENTEC DATA CENTER SOLUTIONS


One System, Scalable for Wide Applications

K888G4 Performance Server System

K888G4 series servers target HPC (high performance computing), storage and general purpose usage with twenty-four DIMM capacity (up to 3TB with 128GB DIMMs) and expandability up to six PCIe cards. The series are optimized for great density and scalability in a simple 2U enclosure with tool-less storage drives and hot-swappable fan modules, applicable for a wide variety of virtualization solutions, big data analysis scenarios, among others that demand better flexibility, higher performance and greater storage capability. The series present,

Highlights • IntelŽ XeonŽ Processors Scalable Family • Efficient Dual-socket System supporting onboard 10GbE Network • Optimum Storage Density • Reducing OPEX • Flexible and Scalable I/O Options • Optimized Serviceability

High Performance

The new generation IntelŽ XeonŽ Processor Scalable Family are based on Intel 14nm process technology that lay new foundation of scalability offering optimized workload for synergy across compute, network and storage, with up to 3.9x higher virtualized workload throughput and number of VMs, a great boost in performance, security, DJLOLW\DQGHेFLHQF\FDWHULQJWRZLGHUDQJHRINH\ workloads.

Great Density and Scalability

Adopting Intel ÂŽ C622 chipset, supporting dual IntelÂŽ XeonÂŽ Processor Scalable Family and up to 3TB of DDR4 memory. K888G4 series host four PCIe x16 lanes, enabling expansion of up to six PCIe cards with riser boards, and support the latest IntelÂŽ technologies, such as IntelÂŽ OptaneTM Persistent Memory which is ready with platform codenamed Cascade Lake, etc.

ÂŽ at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


One System, Scalable for Wide Applications

Model Name

Flexible Network Configuration

2à¡„HULQJGXDO*6)3RQERDUG1,& 1HWZRUN Interface Controller), and a variety of network FKRLFHV WKURXJK 2&3 1,& PH]]DQLQH FDUGV UDQJLQJ IURP * (WKHUQHW WR * RSWLFDO RU %DVH7 FRPSDWLEOH ZLWK 2&3   WKH high-speed performance and IO flexibility are realized, catering to suitable demands of GLà¡„HUHQWDSSOLFDWLRQSURFHGXUHV

Standard/Mainstream 81UDFNPRXQWZLWKVOLGHUDLO Dual Socket; Intel® Xeon® Processor Scalable Family

Memory Slot Chipset Disk Drive Bay

24x DDR4 DIMM slot Intel®&VHULHV & VXSSRUWLQJ*E( Front primary bays: Option1: 12x 3.5" SAS/SATA (including RSWLRQDO[190H KRWSOXJGULYH Option2: 24x 2.5" SAS/SATA (including RSWLRQDO[190H KRWSOXJGULYH Optional 4x U.2 or M.2 NVMe drive Rear SSD bays: 2x 2.5" SATA hot-plug drive

Expansion Slot

2SWLRQ[3&,(*HQ[ /RZ3URà¡…OH

2SWLRQ[3&,(*HQ[ )+)/  [3&,(*HQ[ /RZ3URà¡…OH

[3&,H*HQ2&3$%1,&PH]] 1x Inventec Storage mezz Onboard: 'XDO*6)3 Supporting 10GbE/25GbE/100GbE Mezz and Standard PCIe card Inventec network OCP mezz card options: Option1: 1,&,*'& 'XDOSRUW*E5-

Option2: 1,&,*' 'XDOSRUW*E6)3

Option3: 1,&,*'& 'XDOSRUW*E5-

Onboard: 12x SATA3 6Gb/s port Inventec storage mezz card options 2SWLRQ6$6L *EV

Option2: SAS3-3216-16i (12Gb/s) Option3: SAS3-3224-24i (12Gb/s) Option4: SAS3-3324-24i (12Gb/s, RAID) ,30,FRPSOLDQW.90ZLWK'HGLFDWHG/$1

Network Controller

Storage Controller

® at core

System Management TPM Power Supply

ABOUT INVENTEC ,QYHQWHF (QWHUSULVH %XVLQHVV *URXS (%*  ZDV established in 1998 and has been focusing on the design and manufacturing of server V\VWHPV,QYHQWHF(%*LVWKHNH\VHUYHUV\VWHP supplier of the global branding clients.

K888G4

Positioning Form Factor Processor

Fan

 UHGXQGDQF\ 2SWLRQ: 9 3ODWLQXP 2SWLRQ: 9 3ODWLQXP 1UHGXQGDQF\ [KRWVZDSIDQ

Inventec Corporation (TAO) 1R'D]KL5G7DR\XDQ'LVW 7DR\XDQ&LW\7DLZDQ 7HO )D[ (PDLO TAOproductsupport@inventec.com :HEVLWH(%*,QYHQWHFFRP Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLà¡…FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLà¡…FDWLRQV and photos from time to time without notifying the Party.

© 2018 Inventec Corp.


Optimize TCO for High Density Datacenter

K800QG4 2U4P High Density Server

In the past, the amount of data a datacenter could handle was determined by physical space. However, with the rapid growth in data usage demand from cloud, big data IT and new data-intensive workloads, with limitations in power, cooling and spaces, high density datacenter is how you can best utilize the resources and maximize the data capacity. High density datacenters offer greater computing performance to clients, with a much smaller footprint, delivering lower costs in data center operations, greater efficiency, and higher capacities in power, compute and virtualization applications. K800QG4 server system is designed for high density datacenters. Supporting quad processors of latest Intel Ž Xeon Ž Scalable Family on a single node of 2U rackmount form factor with impressive scalability, K800QG4 not only delivers optimal TCO with lower OPex and CAPex for high density datacenter rack deployments, but also tremendous computing power that is critical for High Performance Computing (HPC) and advancing applications LQ$UWLॅFLDO,QWHOOLJHQFH $, FOXVWHU7KHVHULHV presents,

Highlights • Quad Processors of IntelŽ XeonŽ Scalable Family • High density computing node that optmize TCO and resource usage • Best value choice for High Density and High Performance Computing • Great Scalability; Enhanced Reliability

including 1.5x memory bandwidth and 2x FLOPs capability compared with previous platform, as well as faster socket interconnection through three Intel ÂŽ UPI channels that make balance between energy efficiency and throughput, K800QG4 series is ideal for High Performance Computing applications.

K800QG4 is based on quad IntelÂŽ XeonÂŽ Scalable Processors, TDP per socket up to 205W, providing high density computing power up to 112 cores and up to 24 DDR4 DIMM channels in 2U enclosure. Supported by latest Intel ÂŽ technologies such as Intel ÂŽ Optane TM Persistent Memory (ready with Cascade Lake platform), and boosted performance,

Furthermore, K800QG4 provides excellent scaleout and load sharing capability with up to twelve slimline x8 and three slimline x4 connectors. Together with four 2.5� SAS/SATA/NVMe drives, two onboard M.2 SATA, dual onboard 10G SFP+ NIC ports, as well as expandability from a variety of OCP 2.0 card choices and up to four standard 3&,H[RUWZR3&,H[FDUGVLWRॄHUVDॆH[LEOH high dense computing node that is applicable for deployments demanding tremendous computing power, such as AI clusters.

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos from time to time without notifying the Party.

H i g h D e n s e Co m p u t i n g N o d e w i t h G re at Scalability

Š 2018 Inventec Corp.


Optimize TCO for High Density Datacenter

Optimal TCO choice with Enhanced Reliability

When comparing 2U4P with 1U2P and 2U2P systems, in a 15kW rack, 2U4P system would deliver the same computing performance with less node deployments, and less purchasing costs. Meanwhile, if comparing power consumption per core among the three systems, 2U4P could be the most cost effective - which makes 2U4P solution the optimal TCO choice in high density datacenter deployments. To further increase reliability and reduce downtime, K800QG4 supports five hot-swappable dual rotor fans that are easily serviceable from system front, and tool-less power supplies in 1+1 redundancy at the rear. K800QG4 optimizes your TCO, bringing the highest efficiency that your high-density datacenter needs.

Model Name

K800QG4

Positioning Form Factor Processor

HPC/HDC 2U1N rack mount Quad Socket; IntelÂŽ XeonÂŽ Processor Scalable Family

Memory Slot Chipset Disk Drive Bay

48x DDR4 DIMM slot IntelÂŽ C620 series (C622) Rear primary bays: 4x 2.5" SAS/SATA/NVMe hot-plug drive Supporting 2x onboard M.2 SATA drive 1x PCIe Gen3 OCP 2.0 A+B NIC mezz Option1: 4x PCIe Gen3 x8 (FHHL) Option2: 2x PCIe Gen3 x16 (FHHL) Onboard: 12x slimline x8 connector 3x slimline x4 connector

Expansion Slot

Network Controller

Onboard: Dual 10G SFP+ Supporting 10GbE/25GbE/100GbE standard PCIe network card Supporting 10GbE/25GbE Mezz card Inventec network OCP mezz card options: Option1: NIC-I350-1GDC (Dual port 1Gb RJ-45) Option2: NIC-I599-10GD (Dual port 10Gb SFP+)

Storage Controller System Management Power Supply

Onboard: 14x SATA3 6Gb/s port

Fan

IPMI 2.0 compliant+ KVM with Dedicated LAN 1600W Platinum 1+1 redundancy 5x hot-swap dual rotor fan

ÂŽ at core

ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients. Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


K900G4 2U 4-node HPC Server

In the past, the amount of data a datacenter could handle was determined by physical space. However, with the rapid growth in data usage demand from cloud, as well as emerging data/computing-intensive workloads, with limitations in power, cooling and spaces, high density rack configuration is how you can best utilize the resources and maximize the compute and data capacity. Supporting dual processors of latest Intel ® Xeon ® Scalable Family per node, K900G4 multi-node server solution offers relevant advantages for datacenter rack deployments from lower purchasing cost, smaller footprint, unleashed computing power, energy saving, easy serviceability and management, as well as elastic expandability in its 2U fournode high density enclosure. K900G4 could be easily scaled out to be High Performance Computing (HPC) clusters and fulfill mission critical workloads with optimized TCO. The series presents,

Unleashing Computing Power for HPC Applications

K900G4 is comprised of four high performance nodes, each with dual Intel ® Xeon ® Scalable Processors, TDP up to 105W, providing high density computing power up to 160 cores and 64 DDR4 DIMM slots, equal to 4TB memory capacity in a single system! Supported by latest Intel ® technologies, and boosted performance, including 1.5x memory bandwidth and 2x FLOPs capability compared with previous platform, as well as faster socket interconnection through two Intel ® UPI channels, K900G4 series is more than capable

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

Highlights • High memory capacity and CPU density, up to 4TB and 8 CPU counts - ideal for HPC, Datacenters and Enterprise • Shared Infrastructure for Space, Power and Cost Efficiency • Easy Service and Maintenance

for HPC and applicable for mission critical workloads.

Sufficient Expandability and Flexible Storage Options Furthermore, each of K900G4 nodes is equipped with efficient scale-out capacity, providing one standard PCIe x16 slot, offering expandability from a variety of OCP 2.0 NIC card choices.

Regarding to storage configuration, K900G4 onboard supports three drive types, SAS, SATA and NVMe, up to six hot-pluggable drives per node, or 24 drives per system, plus two SATADOM modules per node. Storage RAID is available from a variety of Inventec storage card options.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party.

© 2019 Inventec Corp.


Optimized TCO with Enhanced Serviceability and Reliability

The 2U4N K900G4 system delivers 4x computing power or 1/4 datacenter footprint compared with traditional 2U1N deployments, lowering the CAPex by high density configurations. To further reduce OPex, with increased reliability and availability, K900G4 supports three dual rotor fans per node, made serviceable on the hot-swappable MLB tray. Together with the hotpluggable 1+1 power supplies at the rear, the K900G4 system is easily maintainable. With optimized TCO, K900G4 multi-node high density server system provides the highest efficiency of massive parallel computing for your HPC applications.

Model Name Positioning Form Factor Processor Memory Slot Chipset Disk Drive Bay Expansion Slot

Network Controller

Storage Controller

System Management TPM Power Supply Fan

K900G4

High Performance Computing (HPC) 2U4N rack mount Dual Socket per node; Intel® Xeon® Processor Scalable Family 16x DDR4 DIMM slot per node; Up to 64x DDR4 DIMM slot per system Intel® C620 series Primary bays: 24x 2.5" SAS/SATA/NVMe hot-plug drive

Rear per node: 1x PCIe Gen3 OCP 2.0 A+B NIC mezz 1x PCIe Gen3 x16 (Low Profile) Supporting 10GbE/25GbE mezz card Inventec network OCP mezz card options: Option1: NIC-I540-10GDC (Dual port 10Gb RJ-45) Option2: NIC-I599-10GD (Dual port 10Gb SFP+) Onboard per node: 8x SATA3 6Gb/s port 2x SATADOM Inventec storage mezz card options: Option1: SAS3-3008-8i (12Gb/s)

IPMI 2.0 compliant+ KVM with Dedicated LAN Option: 2.0 2200W Platinum 1+1 redundancy Per node: 3x 4056 dual rotor fan; Six rotors with N+1 redundancy

ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients. Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party.

© 2019 Inventec Corp.


Accelerate with Flexibility for HPC and AI

P90G4 - 4U GPGPU Optimized Rack-mount Server

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Datacenter-ready Platform with Low Latency and High Bandwidth

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Ever Cost Effective Single-socket Solution

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Best Value Solution for HPC, AI and VDI

P47G4 Single-socket HPC/AI/VDI Server

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Best Value Solution for HPC, AI and VDI

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Model Name

P47G4

Positioning Form Factor Processor Memory Slot Chipset Disk Drive Bay

6R&VXSSRUWLQJ3&,H*HQODQHV Front Primary Bay: KRWSOXJGULYH Supporting 2x onboard M.2 NVMe drive

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Single Socket Server Cost Benefits for Enterprise Business and Datacenter Applications

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Supporting 10GbE/25GbE standard PCIe network card Supporting 10GbE/25GbE/100GbE Mezz card Inventec network OCP mezz card options: 2SWLRQ 2SWLRQ 1,&,*'& 'XDOSRUW*E5-

Storage Controller

System Management TPM Power Supply

Native support from CPU: [8190HSRUW [0190HVRFNHW 

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(PDLO7$2SURGXFWVXSSRUW#LQYHQWHFFRP :HEVLWH(%*,QYHQWHFFRP ,QYHQWHFORJRVDUHWUDGHPDUNVRUUHJLVWHUHGWUDGHPDUNVRI,QYHQWHF&RUSRUDWLRQ $OOWUDGHPDUNVDQGORJRVDUHWKHSURSHUWLHVRIWKHLUUHSUHVHQWDWLYHKROGHUV

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© 2018 Inventec Corp.


STORAGE

PRODUCT BRIEF U30G4 J80F

INVENTEC DATA CENTER SOLUTIONS


All-in-one 1U Ultra Dense Storage

U30G4 1U12Bay Storage Server

Driven by the soaring of big data and the growing popularity of IOT, the storage market has been booming for years, which defines the new term "next-generation data storage" to claim for better agility, higher scalability and lower TCO without losing reliability and durability. Nowadays, data can be classified as hot, warm or cold. To utilize the characters of data could facilitate the efficiency of datacenters owned by the service providers. U30G4 is a compact 1U dual socket storage server supporting twelve 3.5â&#x20AC;? and two slim 2.5â&#x20AC;? form factor hot-swappable drives with easy serviceability, offering balanced computing power and storage capacity, flexible IO expansibility, and hardware redundancy. It is ideal for deployments of warm and cold storage and the software defined workloads, such as Hadoop, Ceph, VMware vSan and Microsoft Storage Spaces Direct (S2D), with relevant reduction in CAPex and OPex. The series presents,

Ultra-Dense Storage in 1U Compact Form Factor

The U30G4 storage server not only composes of twelve LFF HDD bays and two lower front SFF SSD bays that are both hot-pluggable in a compact 1U form factor, but also offers multiple storage RSWLRQVIRUJUHDWHUŕĄ&#x2020;H[LELOLW\DQGVFDODELOLW\ZKLFK include two M.2 NVMe or SATA SSDs via interposer connection, two SATADOMs, and a variety of storage mezzanine cards. U30G4 series is an ideal hybrid system for warm storage and applicable for further storage tiering applications. By optimizing the ratio of SSDs and HDDs, it could highly accelerate IOPS and throughput performance while the excellence of storage capacity is delivered; both

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

Highlights â&#x20AC;˘ 12 LFF HDD Bay in 1U Compact Form Factor â&#x20AC;˘ Balanced Computing Power for Distributed Data â&#x20AC;˘ High Scalability Realized by Great IO Flexibility â&#x20AC;˘ Easy Serviceability & Relevant Reliability

demands from warm data as online analytics and cold data as offline archives can be satisfied in an all-in-one system with minimized CAPex.

Advanced Computing Performance

For warm storage, a balanced computing power is a niche. U30G4 is based on dual IntelÂŽ XeonÂŽ Scalable Processors with optional support of single CPU operation, enabling latest Intel technologies such as IntelÂŽ OptaneTM Persistent Memory (ready with Cascade Lake platform), and boosted performance, including 1.5x memory bandwidth, 2x FLOPs capability, and faster socket interconnection compared with previous platform.

High Scalability and IO Flexibility

U30G4 boasts high-level of IO flexibility that optimizes the scale-out fabrics of software defined storage. A variety of mezzanine cards are available to choose from, including standard OCP 2.0 network card compatibility with up to 100GbE bandwidth support, and a series of Inventec PHY/OCP 2.0 network and storage RAID/HBA cards. Optional standard PCIe Gen3 x16 card is supported too.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


All-in-one 1U Ultra Dense Storage

Design for Lower OPEX

Designed for reduced OPEX, coupled with full open slide rail kits and cable arm management, U30G4 offers easy serviceability and great reliability for enterprise users. The hot-pluggable hard drives allow easy operation through front top cover, while the front access SSD carrier are of tool-less serviceability. U30G4 supports N+1 system fan redundancy that could be replaced after removal the rear top cover, and the tool-less power supplies are of easy rear access. By decreasing downtime and operation efforts, balanced with the ultra-dense storage capacity in compact form factor, and the advancing capability for software-design storage, U30G4 provides the best all-in-one storage solution for your storage investments.

Model Name

Warm/Cold Storage 1U1N rack mount with slide rail Up to Dual Socket; IntelÂŽ XeonÂŽ Processor Scalable Family Supporting single CPU option

Memory Slot Chipset Disk Drive Bay

16x DDR4 DIMM slot IntelÂŽ C620 series (C622) Top bays: 12x 3.5â&#x20AC;? SAS/SATA hot-plug drive (with SAS support from HBA/RAID card) Lower Front SSD bays: 2x 2.5" 7mm SATA hot-plug drive

Expansion Slot

1x PCH PHY/OCP 2.0 x16 NIC mezz Additional expansion options: Option1: 1x Standard PCIe Gen3 x16  /RZ3URŕĄ&#x2026;OH

Option2: 1x Inventec Storage mezz Supporting 10GbE/25GbE/100GbE Mezz Card Supporting Inventec PHY Mezz Card Inventec network OCP mezz card options: Option1: NIC-I350-1GDC (Dual port 1Gb RJ-45) Option2: NIC-I599-10GD (Dual port 10Gb SFP+) Option3: NIC-I540-10GDC (Dual port 10Gb RJ-45)

Network Controller

Storage Controller

System Management TPM Power Supply Fan ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients.

U30G4

Positioning Form Factor Processor

Onboard: 2x SATADOM + 3x miniSAS HD connector Supporting 2x M.2 NVMe or SATA Inventec storage mezz card options: Option1: SAS3-3216-16i (12Gb/s) Option2: SAS3-3316-16i (12Gb/s, RAID) IPMI 2.0 compliant+ KVM with Dedicated LAN 2.0 2x 550W Platinum

6x 4028 system fan, N+1 redundancy 1x 4028 PSU fan

Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

ÂŽ at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

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Ultra-Density Hot Storage Solution

J80F All-NVMe JBOF System

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Highlights â&#x20AC;¢ High density of 80 hot-swap NVMe SSDs â&#x20AC;¢ Support up to 5 server host connections â&#x20AC;¢ Optimal serviceability with all tool-less design â&#x20AC;¢ Hot-swap SSD drives, fans, and power supply units

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Ultra Density 3U Hot Storage JBOF (Just a Bunch of Flash)

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© 2018 Inventec Corp.


Ultra-Density Hot Storage Solution

Model Name

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Disk Drive Bay

Top Bay: [190H866'KRWSOXJ

Superior CAPEX and OPEX Saving

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© 2018 Inventec Corp.


MOTHERBOARD

PRODUCT BRIEF B888G4 B880G4

INVENTEC DATA CENTER SOLUTIONS


One Advanced Board for Wide Applications

B888G4 L-shape High Density Motherboard

B888G4 motherboard targets general purpose usage for enterprises and datacenters with dual IntelÂŽ XeonÂŽ Scalable Processors, twentyfour DIMM capacity (up to 3TB with 128GB DIMMs) and four PCIe expansion slots. 2ŕĄ&#x201E;HULQJ EHWWHU ŕĄ&#x2020;H[LELOLW\ KLJKHU SHUIRUPDQFH and greater memory density, B888G4 is made applicable for a wide variety of virtualization solutions, big data analysis scenarios, among others. The series presents,

Highlights â&#x20AC;˘ Non-shadow L-shape MLB with dual IntelÂŽ XeonÂŽ Scalable Processors, supporting onboard 10GbE Network â&#x20AC;˘ High Density Memory, up to 24 DDR4 DIMM slots â&#x20AC;˘ Flexible I/O Design with Great Scalability

High Performance

The new generation IntelÂŽ XeonÂŽ Processor Scalable Family are based on Intel 14nm process technology that lay new foundation of scalability offering optimized workload for synergy across compute, network and storage, with up to 3.9x higher virtualized workload throughput and number of VMs, a great boost in performance, security, DJLOLW\DQGHŕĄ&#x2021;FLHQF\FDWHULQJWRZLGHUDQJHRINH\ workloads.

Great Density and Scalability

Adopting IntelÂŽ C622 chipset, supporting dual IntelÂŽ XeonÂŽ Processor Scalable Family and up to 3TB of DDR4 memory. B888G4 motherboard hosts four PCIe x16 lanes, enabling expansion of up to six PCIe cards with riser boards, and support the latest IntelÂŽ technologies, such as IntelÂŽ Optaneâ&#x201E;˘ Persistent Memory which is ready with platform codenamed Cascade Lake, etc.

ÂŽ at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


One Advanced Board for Wide Applications

Flexible Network Configuration

Offering dual 10G SFP+ onboard NIC (Network Interface Controller), and supporting a variety of network choices through the OCP NIC mezzanine slot, ranging from 10G Ethernet to 100G (optical or Base-T, compatible with OCP 2.0), the highVSHHGSHUIRUPDQFHDQG,2ŕĄ&#x2020;H[LELOLW\DUHUHDOL]HG by B888G4, catering to suitable demands of GLŕĄ&#x201E;HUHQWDSSOLFDWLRQSURFHGXUHV

Model Name

B888G4

Form Factor

L-Shape, non-shadow W x L: 471.12 x 431mm (18.55â&#x20AC;? x 16.97â&#x20AC;?)

Processor

Dual Socket (LGA-3647) IntelÂŽ XeonÂŽ Processor Scalable Family TDP: up to 205W System Bus: up to 10.4 GT/s by IntelÂŽ UPI

Memory Slot

24x DDR4 DIMM slot 6 channels per socket with 2 DPC DIMM Type: ECC RDIMM, LRDIMM, at 1866/2133/2400/2666MHz Supporting IntelÂŽ Optaneâ&#x201E;˘ Persistent Memory

Positioning General Purpose Applied System K888G4 (2U Mainstream Server) Model P90G4 (4U 8GPGPU AI Server)

Chipset Expansion Slot

Network Controller Storage Controller

System Management BMC TPM

IntelÂŽ C620 series (C622) Supporting 10GbE network 4x PCIE Gen3 x16 1x PCIe Gen3 OCP 2.0 A+B NIC mezz 1x Inventec Storage mezz Onboard: Dual 10G SFP+ Supporting 25GE / 50GbE / 100GbE Mezz card Onboard: 2x SATA connector, 3x miniSAS HD connector; Up to 14x SATA3 6Gb/s port Intel RST RAID 0/1/5/10 Supporting Inventec Storage HBA/RAID Card IPMI 2.0 compliant+ KVM with Dedicated LAN AST2500 Shared NIC Management feature Option: 2.0

ÂŽ at core ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients. Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


Best CP Ratio Board for Wide Applications

B880G4 Common EATX Motherboard

B880G4 motherboard targets general purpose usage for enterprises and datacenters with dual IntelÂŽ XeonÂŽ Scalable Processors, sixteen DIMM capacity (up to 2TB with 128GB DIMMs) and rich expansion choices from OCP 2.0 and PCH PHY mezzanine, as well as standard 3&,H*HQVORWV2ŕĄ&#x201E;HULQJEHWWHUŕĄ&#x2020;H[LELOLW\DQG higher performance in standard EATX form factor, B880G4 is made widely applicable for a great variety of virtualization solutions, big data analysis scenarios, among others. The series presents,

Highlights â&#x20AC;˘ Non-shadow standard MLB with dual IntelÂŽ XeonÂŽ Scalable Processors â&#x20AC;˘ Flexible I/O Design with Great Scalability

Advanced Computing Performance

B880G4 is based on dual Intel ÂŽ Xeon ÂŽ Scalable Processors with optional support of single CPU operation, enabling latest IntelÂŽ technologies such as such as IntelÂŽ Optaneâ&#x201E;˘ Persistent Memory which is ready with platform codenamed Cascade Lake, and boosted performance, including 1.5x memory bandwidth, 2x FLOPs capability, and faster socket interconnection compared with previous platform.

High Scalability and IO Flexibility

B880G4 boasts high-level of IO flexibility that optimizes the scale-out fabrics, offering multiple storage options, which include two M.2 SATA SSDs from SATA connectors, or two M.2 NVMe via interposer connections, and a variety of storage mezzanine cards.

ÂŽ at core

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


One Advanced Board for Wide Applications

Flexible Network Configuration

Offering dual 10G SFP+ onboard NIC (Network Interface Controller), and supporting a variety of network choices through the OCP NIC mezzanine slot, ranging from 10G Ethernet to 100G (optical or Base-T, compatible with OCP 2.0), the highVSHHGSHUIRUPDQFHDQG,2ŕĄ&#x2020;H[LELOLW\DUHUHDOL]HG by B888G4, catering to suitable demands of GLŕĄ&#x201E;HUHQWDSSOLFDWLRQSURFHGXUHV

Model Name

B888G4

Form Factor

L-Shape, non-shadow W x L: 471.12 x 431mm (18.55â&#x20AC;? x 16.97â&#x20AC;?)

Processor

Dual Socket (LGA-3647) IntelÂŽ XeonÂŽ Processor Scalable Family TDP: up to 205W System Bus: up to 10.4 GT/s by IntelÂŽ UPI

Memory Slot

24x DDR4 DIMM slot 6 channels per socket with 2 DPC DIMM Type: ECC RDIMM, LRDIMM, at 1866/2133/2400/2666MHz Supporting IntelÂŽ Optaneâ&#x201E;˘ Persistent Memory

Positioning General Purpose Applied System K888G4 (2U Mainstream Server) Model P90G4 (4U 8GPGPU AI Server)

Chipset Expansion Slot

Network Controller Storage Controller

System Management BMC TPM

IntelÂŽ C620 series (C622) Supporting 10GbE network 4x PCIE Gen3 x16 1x PCIe Gen3 OCP 2.0 A+B NIC mezz 1x Inventec Storage mezz Onboard: Dual 10G SFP+ Supporting 25GE / 50GbE / 100GbE Mezz card Onboard: 2x SATA connector, 3x miniSAS HD connector; Up to 14x SATA3 6Gb/s port Intel RST RAID 0/1/5/10 Supporting Inventec Storage HBA/RAID Card IPMI 2.0 compliant+ KVM with Dedicated LAN AST2500 Shared NIC Management feature Option: 2.0

ÂŽ at core ABOUT INVENTEC Inventec Enterprise Business Group (EBG) was established in 1998 and has been focusing on the design and manufacturing of server systems. Inventec EBG is the key server system supplier of the global branding clients. Inventec Corporation (TAO) No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370 Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Linkedin: www.linkedin.com/company/ inventec-data-center-solutions

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLŕĄ&#x2026;FDWLRQV and photos from time to time without notifying the Party.

Š 2018 Inventec Corp.


ACCESSORIES PRODUCT BRIEF

Network Card Inventec Storage Mezzanine Card

INVENTEC DATA CENTER SOLUTIONS


Network Card Options Inventec mezzanine card options offer high speed SHUIRUPDQFHDQGLQWHUIDFHà¡&#x2020;H[LELOLW\

Open Standards

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Performance

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1,&,*6 NIC-I599-10GS

1,&,*'& NIC-I540-10GDC

1,&,*'& NIC-I350-1GDC

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SAS RAID Mezzanine SAS RAID Mezzanine SAS Mezzanine HBA Mezzanine OCP OCP SAS RAID Mezzanine Card Card OCP OCP SAS RAID Mezzanine Card Card OCP OCP SAS HBA Card C

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at core ® at®core ABOUT INVENTEC ABOUT INVENTEC Inventec Enterprise Business Inventec Enterprise Business GroupGroup (EBG) (EBG) was was established in 1998 and been has been focusing established in 1998 and has focusing ondesign the design and manufacturing of server on the and manufacturing of server systems. Inventec theserver key server system systems. Inventec EBG isEBG theiskey system supplier the global branding clients. supplier of theofglobal branding clients. Inventec Corporation Inventec Corporation (TAO)(TAO) No.88, Rd., Taoyuan No.88, DazhiDazhi Rd., Taoyuan Dist., Dist., Taoyuan City 33068, Taiwan Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Tel: 886-3-390-0000 Fax: 886-3-376-2370 Fax: 886-3-376-2370 TAOproductsupport@inventec.com Email:Email: TAOproductsupport@inventec.com Website: EBG.Inventec.com Website: EBG.Inventec.com

SAS3-3216-16i S3-3216-16i

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SAS Mezzanine HBA Mezzanine SAS Mezzanine HBA Mezzanine SAS Mezzanine HBA Mezzanine SAS RAID Mezzanine P OCP SAS HBA Card Card OCP OCP SAS HBA Card Card OCP OCP SAS HBA Card Card OCP OCP SAS RAID Mezzanine Card Card

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Dedicated to Best TCO Solution

Contact Us

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Steven Lin

阚承义 Andy Kan

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 330, Taiwan (R.O.C.) Office TEL: +886-3-3900000 ext. 23950 Email: lin.steven@inventec.com

英业达上海(浦东厂区) 中国上海市闵行区浦星路789号(漕河径出口加工区) 手机:+86 136-0166-1477 E-mail:kan.andy@inventec.com.cn

Sales & Marketing, BU6, EBG, Inventec Corp.

Inventec Data Center Solutions

英业达数据中心解决方案

业务总监 中国渠道与技术方案业务部 行销业务处

Global Office TAIWAN

CHINA

NORTH AMERICA

Inventec Corp., TAO

Inventec Corp., IPT

Santa Clara RD Center

英业达股份有限公司(桃园厂) 桃园市桃园区大智路88号

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370

英业达科技有限公司(上海) 中華人民共和國上海市闵行区浦星公路699号 邮政编码: 201114 201114 No.789 Puxing Road, Minhang District, Shanghai, China Tel:86-21-6429-8888 Fax:86-21-6429-8848

5201 Great America Pkwy., Suite 525, Santa Clara, CA 95054, USA Tel: +1-408-642-3395

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders. All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only. Actual products may look different from the photos.

© 2020 Inventec Corp.

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