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Explore the Edge with Inventec in 5G Era. E850G4 X250

http://ebg.inventec.com/


E850G4 OTII based Edge Computing Server

E850G4 is the first edge line product by Inventec, targeting multi-access edge computing (MEC), content acceleration, network-in-a-box, and network function virtualization (NFV) applications, among others, in the blooming new market of 5G and edge datacenter. E850G4 is developed based on China Open Telecom IT Infrastructure (OTII) hardware specifications, providing high scalability and great storage capacity in a compact 450mmin-depth edge chassis that meets both server and telecommunication industry standards, including up to seven PCIe Gen3 slots, twelve DDR4 Dimm slots that support Intel Optane DC memory, and up to eight SFF SAS/SATA/ NVMe hot-pluggable drive bays. It is generally compatible with facilities owned by cloud and communication service providers in various edge levels, meeting the hardware requirements of vRAN, virtual core networks and multiple edge computing applications.

Balanced Computing Performance, Optimized IO Workload

E850G4 is equipped with dual socket 2nd Gen IntelÂŽ Xeon ÂŽ Scalable Processors , enabling non-uniform memory access (NUMA) and single CPU operation, offering balanced computing performance. Meanwhile, the series provides onboard dual 10G SFP+ ports and a rich variety of network expansion options from standard NICs and SmartNICs with remote direct memory access (RDMA) support, bringing up to 200GbE high-speed network connectivity and optimal IO workloads.

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

E850G4 is designed for various edge computing scenarios, such as distributed deployments of high-accuracy core computing platform, online games, live broadcast, storage and acceleration of CDN, smart city applications, as well as industrial internet of things (IIOT), etc., all of the above demand features such as low latency, high bandwidth, and high security. E850G4 provides great elasticity and adaptability, fully utilizing the efficiency of network deployments, resulting in your optimal TCO! Model Name Form Factor

Processor Memory Slot Chipset Disk Drive Bay

Expansion Slot Network Controller

E850G4

2U1N Rack-Mounted W x H x D: 438 x 87 x 450mm (17.24" x 3.43" x 17.72") Dual Socket; IntelŽ XeonŽ Processor Scalable Family 12x DDR4 DIMM slot, Up to 1.5 TB IntelŽ C620 series (C622) Primary bays: 6 (+2) 2.5" SAS/SATA/NVMe hot-plug drive [3&,H*HQ[ /RZ3URॅOH

[3&,H*HQ[ /RZ3URॅOH

Onboard: Dual port 10G SFP+ Supporting 10G/25G/100G standard PCIe NIC/SmartNIC cards

Storage Controller

Onboard: 3x SATA slimline x4 2x SATA 7-pin slot

System Management

IPMI 2.0 compliant+ KVM with Dedicated LAN

Power Supply

800W CRPS 1+1 redundancy 6056 dual rotor fan 4+1 redundancy

Fan

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Š 2019 Inventec Corp.


X250 SmartNIC Card for Next-Gen Workloads

In virtualization environments, general Network Interface Controller (NIC) cards can no longer satisfy the evolving needs of applications. Inventec X250 SmartNIC solution offers dual port 25G high speed connectivity in a full-height, half-length and single-width PCIe form factor, combining a controller that is based on Broadcom Ž StingrayTM SmartNIC SoC family with an integrated ARM CPU, and an Intel Ž Arria Ž 10 FPGA. It can be tailored to add specific acceleration applications, or HYHQIXOॅOOXQLTXHIXQFWLRQVWKDWDUH\HWWREH seen in today's architecture. Most importantly, X250 offers flexibility that is not constrained by the existing hardware infrastructure. The programmability makes X250 adaptable with the growth of your business, open to all the possibilities in application of network acceleration, smart security, software define storage, network function virtualization (NFV), among others.

F l e x i b i l i t y, P r o g r a m m a b i l i t y, a n d H i g h Performance

Highlights • NIC + FPGA FHHL PCIe Accelerator Card • Dual 25G (SFP28) Ethernet Port • PCIe Gen3 x16 Host Interface with x8/x8 bifurcation

Model Name Form Factor NIC FPGA Memory Storage Network Host Interface TDP

In X250, the FPGA gets its own PCIe channels, connecting to both the ARM and the host x86 CPU. Performance can be extracted from it if treating the NIC and the FPGA as two independent devices with two PCIe x8 bifurcated from the x16 slot. The FPGA offers programmability and high performance, while the ARM runs embedded Linux - new features can be added-in to either or both of them, providing great flexibility. You can even make prototypes in the ARM and then migrate to the FPGA to gain better performance! X250 series is generally customizable to accelerate features in SDN, 5G RAN, and edge computing.

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders.

X250

Full Height/Half Length/Single Width Standard PCIe Card BroadcomÂŽ StingrayTM BCM58804

IntelŽ ArriaŽ 10 GX660 Series Onboard: 2 channels of DDR4 2400MHz 16GB *%H00&ॆDVK Dual port 25G SFP28 PCIe Gen3 x16 (two x8 bi-fabrication) 75W

$OOWLWOHDQGLQWHOOHFWXDOSURSHUW\ULJKWVLQDQGWRWKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos contained therein, remain the exclusive property of Inventec or its VXSSOLHUV,QYHQWHFUHVHUYHVWKHULJKWWRPRGLI\WKLVGRFXPHQWWKH6SHFLॅFDWLRQV and photos from time to time without notifying the Party.

Š 2019 Inventec Corp.


Dedicated to Best TCO Solution

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Steven Lin

阚承义 Andy Kan

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 330, Taiwan (R.O.C.) Office TEL: +886-3-3900000 ext. 23950 Email: lin.steven@inventec.com

英业达上海(浦东厂区) 中国上海市闵行区浦星路789号(漕河径出口加工区) 手机:+86 136-0166-1477 E-mail:kan.andy@inventec.com.cn

Sales & Marketing, BU6, EBG, Inventec Corp.

Inventec Data Center Solutions

英业达数据中心解决方案

业务总监 中国渠道与技术方案业务部 行销业务处

Global Office TAIWAN

CHINA

NORTH AMERICA

Inventec Corp., TAO

Inventec Corp., IPT

Santa Clara RD Center

英业达股份有限公司(桃园厂) 桃园市桃园区大智路88号

No.88, Dazhi Rd., Taoyuan Dist., Taoyuan City 33068, Taiwan Tel: 886-3-390-0000 Fax: 886-3-376-2370

英业达科技有限公司(上海) 中華人民共和國上海市闵行区浦星公路699号 邮政编码: 201114 201114 No.789 Puxing Road, Minhang District, Shanghai, China Tel:86-21-6429-8888 Fax:86-21-6429-8848

5201 Great America Pkwy., Suite 525, Santa Clara, CA 95054, USA Tel: +1-408-642-3395

Inventec logos are trademarks or registered trademarks of Inventec Corporation. Intel, the Intel logo, Xeon, the Xeon inside, are trademarks or registered trademarks of Intel Corporation in the U.S. and/or other countries. All trademarks and logos are the properties of their representative holders. All title and intellectual property rights in and to this document, the Specifications and photos contained therein, remain the exclusive property of Inventec or its suppliers. Inventec reserves the right to modify this document, the Specifications and photos from time to time without notifying the Party. The entire materials provided herein are for reference only. Actual products may look different from the photos.

© 2019 Inventec Corp.

MKT-EBOOK-EN-V.2/2019-07-15

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Inventec SmartNICEdge Solutions –E850G4 / X250 Product Brief (EN)  

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Inventec SmartNICEdge Solutions –E850G4 / X250 Product Brief (EN)  

Inventec SmartNIC/Edge Solutions - E850G4 / X250 Product Brief EBG Website http://ebg.inventec.com/

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