Issuu on Google+

Application Note

3D MID Technology

3D MID Technology Due to their three-dimensional set-up Molded Interconnect Devices (3D MID) define new requirements on dispensing as well as pick-and-place systems. H채cker Automation GmbH provides a sophisticated process solution for fully automatic 3D assembly, which already has proven in batch production. It is based on the interaction between a special 3D Alignment Support and a 3D Camera Head.

Page | 1


Application Note

Requirements of 3D MID Assembly

3D MID Technology

Modular Platform The World of 3D Assembly and Interconnection is getting more and more complex. Three-dimensional devices will be more cost-intensive because of small spaces with a simultaneous increasing of the range of functions. Most of these specific needs of 3D assembly can be performed with the VICO platform. With more than 60 extension devices for one standardized platform various applications of 3D MID can be realized with short set-up times. This pool of devices will be steadily enhanced and improved to ensure an innovative and sustainable process.

Page | 2


Application Note

Requirements of 3D MID Assembly

3D MID Technology

3D Camera Head The 3D Camera Head is used in 3D applications which require an automated, real 3D recognition of substrates and parts as well as fully automated inspection of mounted assemblies. The module operates with a stereoscopic camera system, which is observing the object from different perspectives. From image data obtained the machine’s control software calculates the exact position of an object (cartesian coordinates) and even its surface conditions. So it also benefits of an automated 3D position correction in order to compensate structure tolerances. The Z-Axis stroke up to 150 mm allows to recognize positions in deep cavities.

3D Alignment Support The 3D Alignment Support – extension device for all VICO platforms consists of 2 axes, both of them capable of being actuated independently of one another. Thus the machine is able to adjust the mounted 3D substrate (i.e. concave/convex shaped 3D MID) by rotating and tilting movements in order to match a favourable position for the next process step. Dispensing and placing heads can reach every point within the complete half-space above the substrate. By using dispensing and placing heads with a Z-axis stroke of 150 mm it is even possible to reach positions in large cavities. Due to spatial adjustment of the substrate, minor deviations from calculated placing and dispensing positions could appear as a result of mechanical tolerances. In order to guarantee fully automatic processing the machine’s recognition system does not only have to determine the position of the substrate in the plane, but also its exact vertical position within the working area of the machine.

Page | 3


Application Note

3D MID Technology

Extension Modules Vision Systems

3D Camera Head - Stereoscopic camera system for VICO XTec and VICO Laser - Several modules with search areas (3,25 x 2,425) mm or (6,5 x 4,85) mm - Accuracy from ±2 µm up to ±4 µm - Correction from level offset of components to ensure a coplanar assembly

2D Subside Camera - Accuracy from ±2 µm up to ±4 µm - Correction from offset of components 3D Subside Camera - Accuracy from ±2 µm up to ±4 µm - Correction from level offset of components to ensure a coplanar assembly

Horizontal Inspection Camera

Page | 4


Application Note

Working heads

3D MID Technology

3D Placing Head - 3D Adjustment of parts in order to compensate geometrical differences - Positioning accuracy:<±5 µm - Adjustment: Tilting: ΘX,Y = ±4° Rotation: ΘZ > 360° - Z-Axis stroke up to 150 mm 2D Placing Head - Positioning accuracy:<±5 µm - Adjustment: Rotation: ΘZ > 360° - Z-Axis stroke up to 150 mm Dispensing Head - Feedback loop-controlled dispensing - Positioning accuracy ± 10 μm @ 3 sigma - Dosing accuracy ± 0.1 nl @ 6 sigma - Capable of solder paste application - Resolution to picoliter level - Z-Axis stroke up to 150 mm Laser Soldering Head - Pyrometer-based control loop for energy input - Spot diameter: >0.3 mm - Soldering profiles for each spot definable - Z-Axis stroke up to 150 mm - Successfully processed: 01005 SMD on thermal sensitive plastic LED modules on concave MID UV-Light Head - Single/multiple spot - Z-Axis stroke up to 150 mm

Page | 5


Application Note

Part and Substrate Handling

3D MID Technology

3D Alignment Support - Rotation angle: >360° - Tilting angle: ≤100° - Z-Axis stroke up to 45 mm - Dispensing/Placing area: complete half-space above substrate - Optional: light source and heating

Inline 3D Alignment Support - 3D Alignment Support in combination with SMEMA conveyor - Rotation angle: >360° - Tilting angle: ±90° - Z-Axis Stroke up to 50 mm - Optional: light source and heating

3D Manipulation Unit - consists of 3 linear and 2 rotating axes offering real 3D adjustment - can host parts as well as tools - by combining several 3D manipulation units complex movement sequences can be implemented - hand-over of components - full space adjustment and sophisticated micro assembly processes (i.e. folding flex PCB)

Page | 6


Application Note

Part and Substrate Handling

3D MID Technology

Conveyor - SMEMA-compatible - Width-adjustable or fixed Vibratory conveyer

Tapefeeder - 8 mm to 44 mm Flip Station

Waffle Pack - 2 to 4 inch Gel Pak速

Wafer handling - Several wafer frames - Wafer up to 8 inch - Wafer Changing Unit

Page | 7


Application Note

Company profile

3D MID Technology

Häcker Automation GmbH provides solutions for advanced processes in microsystems technology. The company’s core areas of competence are Micro Assembly, Nano + Micro Dispensing and Micro Laser Soldering. Operating since 1995 the German based company focuses on highly innovative market segments like 3D MID, Micro Optics/Sensors, MEMS and Medical Technology. In order to achieve best possible results, the service portfolio provided by Häcker Automation covers all aspects of the product life cycle. It ranges from technology consulting, simultaneous engineering and process development through prototyping and advanced testing to machine and device manufacturing as well as training and maintenance.

Häcker Automation GmbH Inselsbergstrasse 17 D-99891 Schwarzhausen Germany Phone: +49 (0)36259 300 0 Fax: +49 (0)36259 300 29 E-Mail: contact@haecker-automation.com www.haecker-automation.com www.facebook.com/haecker.automation www.youtube.com/user/haeckerautomation www.twitter.com/_haecker

Page | 8


3D MID Technology