Best Precision Ceramics Machining services, offering an enriched and a world class experience In the earlier times, the work was done manually by people. Hardest and the easiest of tasks were performed and completed with hands as there was no other option. With the changing time and technology booming in high spirits, many things have changed. With the result of new inventions and high tech facilities, the manual works have been replaced by work done with the help of machines. Machines have proved to be way faster and effective which has removed a heavy load a burden off the shoulders of companies and businesses. Precision Ceramics Machining services offer the ability to machine a variety of materials to produce products such as capacitors and lenses. The most common materials used are Alumina, Aluminum Nitride, Beryllium oxide, Ceremic, Copper, Gallium Arsenide, Garnet, Lithium Niobate, Piezoceramic and piezoelectric materials, plastic pyrex and Aluminum Garnet. The service can also machine any maretial of any required shape. The machining process includes milling, surface grinding, ID slicing and dicing and most of the machining is done for biomedical, Electronics, Optics, Opteelectronics and Photonics industries. Silicon wafer dicing Materials is a kind of dicing that is a variant of OD grinding on a smaller scale than surface grinding. Many times, small electronic parts are scribed. Wafers are mounted on dicing tapes so that once diced, the die will remain on the tape from machining until further steps in the assembly process. The dicing experience allows the machinists to optically align to microscopic patterns and make very precise cuts and grooves. By the proper selection of processing conditions and blade materials, wide variety of hard materials can be effectively cut with minimal chipping and kerf loss. Dicing may even be used to cut precious stones like sapphire, diamond and other crystals into very small pieces with great precision. One of the kinds of dicing is Bevel cutting. It creates a V groove or a chamber in the substrate. The major issues that arise are bottom side chipping and smoothness of the cut surface.
The simplest Bevel cutting involves mounting the substrate on dicing tape and cutting it into a tape. This allows the singulated parts to be cleaned and removed from the tape easily. The difficulty is that the tape does not support the bottom side of the substrate very well, resulting in bottom side chips of up to
several millimeters. Wax mounting the substrate on glass gives better bottom side support and constantly less chipping.