Page 1

Application note for USB 3.1 Type C

Small Outline Solutions

Our Solutions: Ultra low capacitance for 0.2pf@VR Fast Acting surge and ESD capable solution from 2.8V-20V Bi/Uni protection withstanding>4A(8/20us) for data line and 30KV ESD


Best Signal integrity Solution in Small Packages Focused on signal integrity,the FESD05BLCS for DFN1006 package is the best solution for super speed lines,as it offers the lowest parasitic capacitance and inductans.smaller package present less parasitics.

Function

Desginators

Part No.

ESD Level (Contact)

I/O Cap.@OP

Operating Voltage

Package

Super Speed Data

SSTX/SSRX

FESD05BLCS

20KV

0.2pf

5V

DFN1006-2L

USB2.0

D+/D-

ESD3LCS

20KV

0.2pf

5V

DFN1006-3L

Logic

SBU1/2,CC1/2

FM05VDB

30KV

10pf

5V

DFN1006-2L

Charging

VBUS1/2

FW56XX Series

30KV

35pf-600pf

3.3-20V

DFN1610-2L


DFN1610-2L for Power line Protection Part No.

Vrwm

Surge 8/20u S

ESD Level

Cj(pf)

FW5628WU

2.8V

24A

30KV

50

FW5633WU

3.3V

28A

30KV

350

FW5605WU

5V

24A

30KV

350

FW5607WU

7V

80A

30KV

600

FW5612WU

12

12.5A

30KV

150

FW5615WU

15

10A

30KV

100

FW5620WU

20

5A

30KV

60

台灣未來芯航電 股份有限公司 桃園市 桃園區中正路987巷 50弄2號 +886-3-3573583 cherry@futurewafer.com.tw

造訪我們的網站: www.futurewafer.com.tw

Application note usb3 1 typec small package  
Application note usb3 1 typec small package  
Advertisement