Development Trend of Printed Circuit Board
Best online seller for high precise double‐sided PCB: http://www.haixiang‐pcb.com/ Multilayer board increases the wiring area and soft board breakthrough space constraints: Currently there are two main categories of PCB: one is in accordance with layers, and the second is classified according to its hardness. According to layers, the printed circuit board can be divided into single‐sided, double sided and multilayer boards, generally multilayer boards are four layers or six layers, complex boards are even up to dozens of layers. Single panel is the most basic PCB, the name suggests that its wire focus on the single side, and the part is on the other side (but SMD parts are on the same side with the wire), because the single panel design is restricted by area, so it can be only used for simple lines. The early electronic products or traditional products which have less changes use mostly single panels. Double‐sided panel has wire on the upper and lower layers; the upper and lower wires are connected to each other by guide hole. Therefore, the same size double‐sided panels have double conductor design area than the single‐sided panels, and solve the problem of more electromagnetic interference generated by wire interleaving in single panels, therefore suitable for more complex circuit design.
Multilayer boards use single‐sided and double‐sided panel together, which can add more wiring space. Usually the most common is using two double‐sided boards as an inner panel and the outer layer uses two single‐sided plates, to form four layer multilayer boards through combining the positioning system and the insulating adhesive material. In addition, by classified in accordance with softness, printed circuit board is divided into rigid circuit boards, flexible circuit boards, and rigid‐flex boards. Rigid circuit board is usually 0.2mm to
2.0mm in thickness, whereas the flexible printed circuit board is typically 0.2mm, and is thickened at the place which needs to be welded. The emergence of flexible circuit boards is mainly because the institutional space is limited, so bendable PCB is needed to reach space requirements. Most of the flexible circuit board materials area polyester film, polyimide film and fluorinated ethylene propylene film materials. High‐density interconnect technology promotes miniaturization of mechanical design In recent years, along with sophisticated semiconductor technology, and information products for the smaller volume requirements, the PCB technology develops towards high density interconnect (HDI) direction; This is a printed circuit board technology using micro blind buried hole technology to allow higher line density. It is not only light weight, high density line, so that the overall mechanism design has the advantages of miniaturization, and can also improve radio frequency interference, electromagnetic interference, etc., so its applications are more and more widely. In addition to the 50% of current mobile phones, more and more laptops, tablet PCs, digital cameras, car electronics and other electronic products also begin to use HDI printed circuit boards. Media contact: Website: http://www.haixiang-pcb.com/ E-mail: firstname.lastname@example.org
Published on Dec 1, 2013
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