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NXP Mini Logic Streamlines Board Design
NXP advances Mini Logic solutions with MicroPak (XSON) state-of-the-art packaging. Designed for use in portable applications, where board space is always an issue, Mini Logic gates in XSON packages are dramatically smaller, leading to compact and slimmer overall designs.
STREAMLINING BOARD DESIGN
form factors with reduced battery sizes to further advance today’s portable electronic products.
Use of NXP’s Mini Logic product solutions, especially the innovative MicroPak leadless packages, can save up to 85% of board space, speed up time to market, provide a competitive edge, and result in considerable cost savings.
TARGET APPLICATIONS
Why? Because Mini Logic allows designers to select the specific logic functions and package footprints that best suit the application— greater efficiency that simplifies layout, supports last-minute feature improvements, eases board production, and lowers cost. NXP’s Mini Logic offering also includes the lowest power logic solutions available (AXP family), enabling smaller
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NXP offers the industry’s largest, most comprehensive portfolio of 0.8V to 5.0V Mini Logic products, along with MicroPak, the world’s smallest 5-pin logic package. Whether an application requires low voltage, low power, or the stringent specifications of automotive qualification, whether it has space constraints or a rapid time-to-market need, NXP has the ideal Mini Logic solution to help consumer, portable, and automotive applications.