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3D MICRO STRUCTURES IN GLASS BY ISLE WITH HIGH SPEED MICRO SCANNER J. Gottmann, M. Hermans, J. Ortmann, N. Repiev, F. Riedel, I. Kelbassa, R. Poprawe

© Fraunhofer ILT

www.lightfab.de RWTH Aachen Univ.


3D MICRO STRUCTURES IN GLASS BY ISLE WITH HIGH SPEED MICRO SCANNER  Motivation: Digital Photonic Production in Glass  ISLE-parts and Micro Scanner  Scalability

Seite 2

© Fraunhofer ILT


Digital Photonic Production – Vision Individualisation for free

Complexity forfor freefree Individualisation

Cost

Cost

Photonic

Photonic

Production

Production

Conventional Production

Conventional Production Lot size

Producer

Producer

Product complexity

Customer Product

Product Environment

Providing-Value

Value-Co-Creation

Innovative business models

Š Fraunhofer ILT

Innovative products


Selective Laser-Induced Etching, “SLE” Processing steps: 1) Selective modification of the structure in the volume by fs laser radiation

2) Selective wet chemical etching of the modified structure

© Fraunhofer ILT

fs laser radiation v=1-10,000 mm/s

Wet etching HF or KOH


Experimental – Selective Etching

S~1400

l

2 mm

ď Ž Etch rate of unmodified material r0 =0.21Âľm/h Âą 0.015Âľm/h ď Ž Selectivity S: đ?‘† =

Š Fraunhofer ILT

đ?‘&#x;đ?‘  +đ?‘&#x;0 đ?‘&#x;0

; High Selectivity ďƒ  high aspect ratio


Motivation – What is Possible By stacking single lines together SLE enables 3D-Microproduction of  Precise (blind) holes & grooves  Complex microfluidic devices  Already assembled micromechanics

in transparent materials like fused silica and sapphire for applications like electrical vias, cell detection and sorting, filtering, drop making, fibre tip placement, injection nozzles etc.

Bellouard 2012

© Fraunhofer ILT

Matsuo 2008


Digital Photonic Production with ISLE ISLE: In-volume Selective Laser-induced Etching

1 mm

3D-CAD Model

Selective Modification

Removal of Modified Material

in Layers

by Laser Radiation

by Wet Chemical Etching

Š Fraunhofer ILT


Digital Photonic Production: CAD to CAM

CAD:  3D object in common file type  Check for closed volumes  Connection to surface for etching For CAM:

 Definition of laser tracks & layers  Automatic slicing  Check for artifacts © Fraunhofer ILT


Digital Photonic Production: CAM

CAM:  Alignment and process control with included microscope  Automatic control of translation stage, scanner and laser © Fraunhofer ILT


Digital Photonic Production: CAM & Process control

 Automatic control of translation stage, scanner and laser  Alignment and process control with included microscope © Fraunhofer ILT


Digital Photonic Production: Resulting Microfluidics

Diffraction at modified lines before etching

 3D microfluidic device after etching before separation  Transparency is increased when filled with water (immersion) © Fraunhofer ILT


Digital Photonic Production: Resulting Microfluidics

ď Ž 3D microfluidic device after etching before separation Š Fraunhofer ILT


Digital Photonic Production: 3D Mixer

2 mm

 3D microfluidics with glass-ball inside reaction chamber © Fraunhofer ILT


DPP: Planetary drive with herringbone gearing

2 mm

ď Ž Planetary drive with herringbone gearing printed in fused silica Š Fraunhofer ILT


DPP: Laval Nozzle

2 mm

 Laval nozzle inset manufactured with SLE in fused silica © Fraunhofer ILT


Micro Holes Cut in Fused Silica

Holes cut in 1 mm fused silica e.g. for

 Optical Fiber placement  Filtering applications  Openings in casings

 Inlets for gases or fluids  Electrical vias Min. hole diameter ~ 30 µm Max. hole diameter ~ 1 mm Max. hole length ~ 2 mm Max. hole taper ~ 20 µm Precision ~ 2 µm © Fraunhofer ILT

500 µm


3D Microfluidic Device e.g. for Medical Diagnosis

3D micro channel in fused silica for characterization of living cells:

 Buried flat channel  Tapered inlet  Connectors for flexible tubes

 Prototypes and series from your CAD data  CAD data handling on request

Min. channel height ~30 µm Min. channel width ~ 10 µm Max. structure height ~ 2 mm

Max. structure width ~ 10 mm © Fraunhofer ILT

1 mm


3D Micro Mechanics e.g. for Micro Fluidics

3D micro mechanics in fused silica:

 Free rotatable gear  Produced already mounted on axis  Available in buried micro channel

 Prototypes and series from your CAD data  CAD data handling by us possible

Min. gap height ~20 µm Min. gap width ~ 10 µm Max. structure height ~ 2 mm

Max. structure width ~ 10 mm © Fraunhofer ILT

1 mm


Micro Scanner for Integration in Your System

Flexible Micro Scanner for your xyz stage system Designed for:  Research and application labs  1 µm focus radius (l~1µm), >0.2 m/s on 500 µm  Prototypes and small series of micro structures  Matched for Lasers with 0.1-5 MHz, 1-20 W Properties

 Scanning field 1 mm with lens f=10 mm  Reflected-light microscope included  CAM software, adapted to your system

 Extendable with modules tailored for your needs © Fraunhofer ILT


High speed Micro Scanner for Volume Production

High speed micro scanner for high throughput:

 1 µm focus radius (l~1µm), 10 m/s on 500 µm  Series of micro channels and holes  Matched for Lasers with 5-100 MHz, 20-150 W Properties:  Scanning field 1 mm with lens f=10 mm  x-y stage and fast focusing included  Microscope & absorbed power meter included  CAM software  Tailored scanner for optimized throughput

© Fraunhofer ILT

500 µm


Scope of Applications for Micro Scanners

Small focus (< 2 µm), high precision (< 1 µm) combined with large scanning velocity (0.1-10 m/s) are demanded in e.g.:  Micro structuring by ablation with high precision  Cutting of shaped holes  Crack free markings inside glasses  Fabrication of waveguides  Nanostructures (Ripples, Nanoplanes)

 2 photon polymerization with high velocity  Structuring by ISLE

© Fraunhofer ILT


OUTLINE  Motivation: Digital Photonic Production in Glass  ISLE-parts and Micro Scanner  Scalability by High Speed Micro Scanner

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© Fraunhofer ILT


ISLE with high average power laser (30 W) 8 mm long micro-channels in fused silica  Scanning velocity 10 m/s on 630 µm circles, Focus radius 1 µm, 0.5 & 5 ps

 Repetition rate 27 MHz, Average power 10–30 W  Crack-free channels with 0.5 ps possible Scanning 0.5 ps 630 µm 16,2 W

0.5 ps 24,3 W

5 ps 24,3 W Seite 23

© Fraunhofer ILT

630 µm


Drilling of Glass with High Speed Micro Scanner 27W

18W

8W

5.4W

400 µm

Drilling of 1 mm fused silica by ISLE with High Speed Micro Scanner:  Laser: Edgewave, 1064 nm, 10 ps, 80 W, 7 MHz

 Focus diameter: 2 µm  Hole Diameter: 200 µm, Pitch: 400 µm, Depth: 1,000 µm  Track velocity: 3 m/s, Processing time per hole: 23 ms

 Removal rate: 1.3 mm3/s resp. 0.17 mm3/Ws © Fraunhofer ILT


Drilling of Glass with High Speed Micro Scanner 34W

24W

8W

5.4W

400 µm

Drilling of 1 mm fused silica by ISLE with High Speed Micro Scanner:  Laser: Edgewave, 1064 nm, 10 ps, 80 W, 7 MHz

 Focus diameter: 2 µm  Hole Diameter: 200 µm, Pitch: 400 µm, Depth: 1,000 µm  Track velocity: 3 m/s, Processing time per hole: 14 ms

 Removal rate: 2.2 mm3/s resp. 0.28 mm3/Ws © Fraunhofer ILT


Drilling of Glass with High Speed Micro Scanner 40W

30W

11.5W

5.4W

400 µm

Drilling of 1 mm fused silica by ISLE with High Speed Micro Scanner:  Laser: Edgewave, 1064 nm, 10 ps, 80 W, 7 MHz

 Focus diameter: 2 µm  Hole Diameter: 200 µm, Pitch: 400 µm, Depth: 1,000 µm  Track velocity: 3 m/s, Processing time per hole: 9 ms

 Removal rate: 3.5 mm3/s resp. 0.3 mm3/Ws © Fraunhofer ILT


Drilling of Glass with High Speed Micro Scanner 40W

30W

11.5W

5.4W

400 µm

Drilling of 1 mm fused silica by ISLE with High Speed Micro Scanner:  Laser: Edgewave, 1064 nm, 10 ps, 80 W, 7 MHz

 Focus diameter: 2 µm  Hole Diameter: 200 µm, Pitch: 400 µm, Depth: 1,000 µm  Track velocity: 3 m/s, Processing time per hole: 6 ms

 Removal rate: 5.2 mm3/s resp. 0.45 mm3/Ws © Fraunhofer ILT


Summary  ISLE is suitable for Digital Photonic Production  ISLE is Scalable  3D Microfluidics and Assembled Micro Mechanics  Flexible Micro Scanner for Prototypes from CAD  High Speed Micro Scanner for high Throughput of e.g. Holes and Micro Channels  Spin-off LightFab for: Micro Scanners and Production of ISLE-parts Acknowledgement:  Funding: NRW.Transfer Science-to-Business Pre-Seed to prepare the spin-off

© Fraunhofer ILT


Outlook Our Tasks:  First time right  Float glasses  Process control  Process chains Needs:  Description of modification processes  Control of stress, crack prevention  Basis for selectivity: Defects or thermal history?  Fast dynamic diagnosis  Control of focus: time & phase & aberrations (PFT) © Fraunhofer ILT


Digital printing of 3d components in glass enabled by selective laser induced etching  
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