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231st ECS MEETING

NEW ORLEANS L

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Plasma Nano Science and Technology

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May 28-June 2, 2017 Hilton New Orleans Riverside

Dielectrics for Interconnect, Interposers, and

D02 Dielectric Science and Technology Division

D03 Packaging Dielectric Science and Technology Division

This Symposium aims to provide forum for extensive and in-depth discussions in the field of plasma nanoscience and nanotechnology as well as developing the next-generation plasma-based nanotechnologies. One of the motivations to organize this Symposium is an ever-increasing and more and more widespread use of plasma-based tools and techniques for nanoscale synthesis and processing. The Symposium is planned as an expert meeting with open participation and will include overviews of some of the most important research directions in this field followed by the comments and detailed discussions of the main challenges and strategic directions for the future development given by leaders in relevant areas. It is also planned to develop a coordinated international approach towards achieving stronger impact of this research field on the emerging nanoscale and other technologies that may benefit from the use of effective, cheap, and environmentally-friendly plasma-based technologies.

Low dielectric constant materials have been critical to reducing the RC time constant for interconnect on-chip, on-interposers, and in electronic packages and boards. The ITRS calls for dramatic improvements in dielectric constant (both permittivity and loss) and other physical properties, such as thermal expansion, thermal conductivity and modulus, at all levels of interconnect including chips, interposers, packages, and substrates. This symposium will focus on advances in dielectric materials, processing, characterization, and reliability for interconnect dielectrics. The application areas include (1) on-chip; (2) organic, silicon, and glass interposers, (3) package substrates; (4) printed circuit boards; and (5) other interconnect media. The topics include new dielectric materials, patterning methods for dielectric materials, chemical/mechanical/ electrical properties and their characterization, applications of dielectric materials in microelectronic devices, and reliability of dielectric materials. An “enhanced” edition of ECS Transactions is planned to be available at the meeting. All authors accepted for presentation are obligated to submit their full text manuscript for the issue no later than March 10, 2017. All manuscripts will be submitted online, and must be in either MS Word or PDF format. All abstracts will be submitted online, questions and inquiries should be sent to the symposium organizers: Paul Kohl, Georgia Institute of Technology, email: Paul.Kohl@chbe.gatech.edu; Oana Leonte, Berkeley Polymer Technology, email: odleonte@comcast.net; John Flake, Louisiana State University, email: john.flake@gmail.com.

Research topics: • Fundamental topics related to nanoscale synthesis and processing using low-temperature plasmas, ion beams, lasers, etc. • Elementary processes of plasma-surface interactions during nanoscale synthesis and processing • Physical and chemical mechanisms of growth of nanostructures using plasma-based and related processes • Self-assembly and self-organization on plasma-exposed surfaces • Surface science of plasma-exposed surfaces • Deterministic control in nanoscale synthesis and processing: from nucleation to device integration • Present and future industrial applications of plasma-based nanoscale synthesis and processing • Design of plasma processes, reactors, and associated tools and instrumentation for nanoscale synthesis and processing • Diagnostics of plasma species during nanoscale synthesis and processing using low-temperature plasmas and related tools • Multiscale modelling and numerical simulations of associated processes in the plasma, plasma sheath, solid and nanostructure surfaces • Analysis of industrial viability and competitive advantages of plasma-based and related nanotools with any other existing approaches • Nanomaterials characterization and surface analysis • Comparative analysis of performance of different plasma types and sources (e.g., low- vs atmospheric pressure, thermal vs nonequilibrium plasmas etc.) • Applications of plasma modified materials • Any other relevant topics An “enhanced” edition of ECS Transactions is planned to be available at the meeting. All authors accepted for presentation are obligated to submit their full text manuscript for the issue no later than March 10, 2017. All manuscripts will be submitted online, and must be in either MS Word or PDF format. All abstracts will be submitted online, questions and inquiries should be sent to the symposium organizers: Uros Cvelbar, Institute Jozef Stefan, email: uros.cvelbar@ijs.si; Sreeram Vaddiraju, Texas A&M University, email: sreeram.vaddiraju@tamu.edu; Mahendra Sunkara, University of Louisville, email: mahendra@louisville.edu.

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E—Electrochemical / Electroless Deposition

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Green Electrodeposition 4 Electrodeposition Division

The vision of this symposium addresses electrodeposition technology that can play a major role in the long term sustainability of processing advanced materials, development of novel coatings, as well as fabrication techniques which enable sustainable development. A “standard” issue of ECS Transactions is planned for this symposium. All authors accepted for presentation are encouraged to submit their full text manuscript for the issue no later than June 11, 2017. All manuscripts will be submitted online, and must be in either MS Word or PDF format. All abstracts will be submitted online, questions and inquiries should be sent to the symposium organizers: Sudipta Roy, University of Strathclyde, email: sudipta.roy@strath.ac.uk; Giovanni Zangari, University of Virginia, email: gz3e@virginia.edu; Sachio Yoshihara, Utsunomiya University, email: sachioy@cc.utsunomiya-u.ac.jp.

CALL FOR PAPERS • 231st ECS Meeting • New Orleans, LA • May 28 – June 2, 2017 • www.electrochem.org


Call for Papers, 231st ECS Meeting, New Orleans/LA