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REQUIREMENTS OF INDUSTRY FOR THE EDUCATION OF PRINTED CIRCUIT BOARD DESIGNERS (ANFORDERUNGEN DER INDUSTRIE AN DIE AUSBILDUNG VON LEITERPLATTEN DESIGNER Paul Svasta and Norocel Codreanu “Politehnica University of Bucharest Faculty of Electronics, Telecommunications and Information Technology Center for Technological Electronics and Interconnection Techniques

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


“TIE”, THE “INTERCONNECTION TECHNIQUES IN ELECTRONICS” PROFESSIONAL STUDENT CONTEST

1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


A=>„….Universitäten und Hochschulen müssen für steten und guten ausgebildeten Nachwuchs sorgen, wobei neben den Grundlagen für einen Layouter viele weitere Kenntnisse praxisnah vermittelt werden müssen.“ ……………………………………………………………….. B=>„…Einem wesentlichen Beitrag für den Erfolg (oder auch Misserfolg) von elektronischen Produkten leisten die Layouter. Es ist ihre Aufgabe, die Vorgaben der Schaltungsentwickler in ein Produkt umsetzen, welches nicht nur funktioniert, sondern auch zuverlässig, kostengünstig und mit höchsten Ausbeuten zu fertigen ist.“ __________________ Produktion von Leiterplatten und Systemen, August 2012 Seite 1750, Band 14 Dr.-Ing. Habil. Heinz Wohlrabe, Zentrum mikrotechnischer Produktion der TU Dresde n 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Undergraduate Microsystems Packaging Education : Needs , Status and Challenges, Rao Tummala and Leyla Conrad, Packaging Research Center, Georgia Institute of Technology, Proceedings of Electronic Components & Technology Conference (ECTC), Orlando, Florida, 2001, pag 1276-1282

“The human resource needs of the 21st century will be dramatically different from the past and fall into two categories: (1) the educational background and skills of these new engineers (quality); and (2) the number of skilled engineers (quantity).


Skills Quality Need (a)Deep fundamental, system-level and manufacturing knowledge; (b) Global knowledge of the marketplace such as markets, business, economics, foreign language and culture.


The gap in skills between what industry would like in tomorrow's engineering workforce vs. what the universities are currently producing


DESIGN OF ELECTRONIC MODULES & ASSEMBLIES Student Professional Contest

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


The “TIE” contest- since 1992! “A way to turn your hobby into profession” 

  

In 1992 the authors had the idea to create a professional student contest, named TIE (Interconnection Technologies in Electronics). The contest has to established a solid bridge between the innovative companies in electronics industry and universities, with emphasis on professional PCB design, based on IPC standards. For correlating all the activities around the TIE event, a university network, EPETRUN (Electronic Packaging Education Research Training Network University), has been created in Romania. Today, also Hungary (based on the enthusiastic team from Budapest University of Technology and Economics) has joint the network. Subsequently, in context of TIE and EPETRUN, with support of industry professionals, an Industrial Advisor Committee (IAC) was created. The current state of the TIE competition, reached after twenty years of experience, in accordance with the electronics industry applications, can be considered mature, being already “crystallised” in a solid structure, with subjects very similar with the design requirements which are found in the electronics industry, which topics taken from real industrial projects. The aim of TIE is to verify that students understand the PCB design chain and are able to follow all the necessary steps to design printed circuits with constraints. 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


2014 2015

Participant universities

2013


1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


To train a student, who will be involved in PCB design as part of his/her job, it is necessary to be able to offer him/her a broad range of knowledge, as:         

analogue electronics; digital electronics; power and switching electronics (linear and switched mode power supplies); testing of electronic circuits (testing interfaces, specific equipment, testing steps); various world standards (IPC, IEEE, etc.); thermal management (virtual and real, evaluation of the current capacity of PCB traces); fabrication processes for conventional and special printed circuits, as HDI, RF, microwave, etc. (technological processes and their limits); assembling processes of electronic modules (assembling technologies and their limits, inspection technologies); signal/power integrity, EMC/EMI (modelling and simulation of transmission lines, cross-talk, ringing, computation of controlled impedances, estimation of the propagation time, choosing the proper materials). 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Future PCB designer Know How

Electronic packaging oriented knowledge curriculum in the frame of university education 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


PCB design criteria

The relevance of DFX (X – manufacturing, testing, environment, etc.) rules increases and students need to be faced with projects that enable them to design small electronic products from their very first step in university education

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


“TIE”– Design Contest of electronic modules and assemblies 

INTERCONNECTION TECHNIQUES IN ELECTRONICS (TIE) Objective : promoting computer aided design (CAE-CAD-CAM) of electronic modules and assemblies among students in electronics.

21 editions, since 1992.

The TIE map

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


TIE Committees Steering Committee (SC);  Technical Committee (TC);  European Consultants Committee;  Industrial Advisor Committee (IAC);  Advertising Committee;  Student Committee;  Local Organizing Committee. 

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


IAC & TIE 

Industry

 Representative

of electronics industry;  Involved in subject conception;  Evaluation and certification. 

TIE  Engineering

students;  Trained human resource for the future.

Some IAC members are former TIE participants!

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Industrial Advisor Committee 2012 Chairman: Cosmin Moisa, Continental Automotive, Timişoara Co- Chairman: Gabriel Chindriş, Ph.D., Technical University of Cluj-Napoca, Members:

Members: Cosmin Frecia, Kuhnke Production Romania SRL, Romania Zsolt Mathe, Tehnologistic SRL, Cluj-Napoca Gabriel Neagu, Electronica Azi, Bucharest Catalin Negrea, Continental Automotive, Timişoara Mugurel Niculescu, Sytron Technologies Overseas, Bucharest Flaviu Nistor, Continental Automotive System SRL, Sibiu Mihai Petculescu, Maquardt Schaltsystems SCS, Sibiu Emil Popa, Wenglor Electronic SRL, Sibiu Mariana Poparlan, Simea, Sibiu Mihai Savu, Samway, Bucharest Cristian Codreanu, Kromberg & Schubert Romania Me SRL, Sibiu Emilian Stoica, Simea, Sibiu 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Technical Committee-2012 Chairman:

Assoc. Prof. Norocel Codreanu, Ph.D., “Politehnica” University of Bucharest,

Co-Chairman:

Assist.Eng. Emanoil Toma, “Lucian Blaga” University of Sibiu

Members:

Constantin Barabaşa, Ph.D., “Gh. Asachi” Technical University of Iaşi Marius Carp, Ph.D., “Transilvania” University of Braşov, Emilian Ceuca, Ph.D., “1 Decembrie 1918” University of Alba Iulia Assoc. Prof. Eugen Coca, Ph.D., “Ştefan cel Mare” University of Suceava Assist. Eng. Cristinel Crăciun, University of “Dunărea de Jos” Galaţi Assist Eng. Silviu Epure, University of “Dunărea de Jos” Galaţi, Assoc. Prof. Tecla Goraş, Ph.D., “Gh. Asachi” Technical University of Iaşi Assist Eng. Claudiu Lung, University of Baia Mare Lect. Eng. Alin Mazăre, Ph.D., University of Piteşti Attila Géczy, Budapest University of Technology and Economics Lect. Eng. Marius Rangu, Ph.D., “Politehnica” University of Timişoara Eng. Liviu Viman, Ph.D., Technical University of Cluj-Napoca 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


TIE 2012 IAC&TC Family Picture 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Some examples of TIE subjects

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 1

The project goal is to design and generate layout and fabrication files for a single board portable MP3 player.

Block diagram a single board MP3 player

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 1 The single board MP3 player PCB should follow the exploded view presented below

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 1 The single board MP3 player schematic

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 2

The project goal is to design and generate layout and fabrication files for the electronic system of a vehicle instrument cluster.

Vehicle instrument cluster 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 2 Block diagram of the instrument cluster system

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 2

Mechanical drawing for back panel aluminum housing 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 2

Instrument cluster schematic 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 3

The project goal is to design and generate layout and fabrication files for the PCB panel of a temperature control unit.

Temperature Control Unit Block diagram of the temperature controller

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 3

Mechanical drawing for back aluminum housing (internal) 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example 3

Temperature controller schematic 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Topics          

CAD of electronic circuits (SCH); creation of virtual components (parts); SCH post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation); CAD of the on-board interconnection structure (PCB); creation of PCB footprints; professional inter-tool communication techniques between SCH and PCB environments; PCB post-processing (generation of netlists, reports, export/import files, post-processing files for technical documentation and manufacturing); standardization aspects for PCB design; elements of analogue, digital and mixed design; elements of signal integrity and electromagnetic compatibility at the PCB level. 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Issue

Description of checking

Grading, examples [points]

Points max

Schematics Correctness of the schematic project, components, signals,

1/terminal, 10/IC, 5/discrete comp.,

80

PCB Layout Correctness of number /type of layers, spacing, footprints, etc. placement, routing, solder and silk mask, other PCB restrictions

1/pad size, number, spacing 5/differential routing,

168

Mechanical Correctness of mechanical holes, 4/mechanical holes board geometry and shape, etc. 6/global fiducials

32

Fabrication Manufacturing (Gerber/Drill) files, NPT/PTH (holes), PnP file, Evaluation team TOTAL

14

11/Gerber/Drill files 2/PnP file, 1/TST file Name

stud

Signature 294

Evaluator 1 Evaluator 2 Student/I agree with the evaluation of my subject and I accept my final score. 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


On-going regulations      

All subjects are in English; The amount of time for the qualification session is of 90 – 180 minutes and for the final session is of 240 minutes; Subjects are generated in accordance to IPC requirements; After handing-in the subjects, the students have 30 minutes to study the contest subjects; The students who participate at the final stage are awarded with diplomas and prizes: three prizes and five mentions; The contest rules can be found on the web-page of the contest ( www.tie.ro), in English and Romanian, and on the web-pages of the EPETRUN university network, depending on the specific of their web-pages.

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


ď Ž

TIE subject example Example of TIE requirement given to students as bibliography

Example of a requirement reflected in the TIE subject

Example taken from the evaluation grid to match the requirement in the subject

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


“Certificate of Competence� in PCB design awarded by IAC to the best students 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


“TIE”– Design Contest of electronic modules and assemblies The TIE map

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


“TIE”– Design Contest of electronic modules and assemblies The TIE map

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


TIE participants 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Overview during the TIE contest 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


The two authors, Prof. Paul Svasta, general chair of TIE (right picture) and Assoc. Prof. Norocel Codreanu, technical chair (left picture), supervising the competition 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


4 hours of contest = 240 minutes of hard work!!!

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Student at work during the TIE contest 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


EVALUATION – hard work, too! (Evaluators: members of TC & IAC)

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Awarding cups

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Awarding cups Two winners’ cups are awarded. The small cup is of the winner student! The large cup is of the university, being transferred, from one year to another, to the winner university.

The names of all TIE winners, since 1992, are written on the large cup! Of coarse, on printed circuit boards!!! 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony sponsored by Continental 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the awarding ceremony 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the workshop presentations 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the workshop presentations 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Image from the workshop Q&A session 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Some of the attendees at the workshop 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Prof. Zsolt Illyefalvi-Vitez making a presentation 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Triple Helix model

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Some of sponsors

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


1. 2. 3. 4. 5.

Introduction Multi-disciplinary approach in education Knowledge evaluation TIE Triple Helix Model Conclusions

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


  

 

In an era when all surrounding products are controlled by electronics, the industry demand for PCB designers is very high; In this global context, TIE has become an international event in 2009; As Prof. Zsolt Illyefalvi- Vitéz (BUTE) said, TIE is a „one day hands-on realtime competition and is really an unrivalled Component Packaging and Manufacturing Technology event in Europe, best for undergraduates in electronics”; The TIE contest presented in this work is not necessarily a competition between students and universities, but a certification event in the rapidly developing computer aided design techniques and systems; The TIE event wants to train and support skilled designers for the European industry, not only for the local/Central European industry; Based on the solid concept of training students in accordance to the actual requirements of the industry, TIE has answered a long-awaited issue, making the bridge between the theoretical approach and the practical engineering.

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Future editions TIE 2013, Brasov, Romania, April 24-27, 2013;  TIE 2014, Alba Iulia, Romania;  TIE 2015, Timisoara, Romania. 

ANY EUROPEAN UNIVERSITY IS WELCOMED TO “TIE 2013”! 20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


Vielen Dank f端r Ihre Aufmerksamkeit !

20. FED-Konferenz, 20.- 22.9.2012, Maritim Hotel, Internationales Congress Center Dresden


REQUIREMENTS OF INDUSTRY FOR THE EDUCATION OF PRINTED CIRCUIT BOARD DESIGNERS