CAGR Value :
Global air cooled heatsinks market was valued at USD 6,675 million in 2024 and is projected to reach USD 9,686 million by 2032, exhibiting a CAGR of 5.5% during the forecast period. While North America currently holds significant market share, the Asia-Pacific region is expected to witness the fastest growth due to expanding electronics manufacturing in China and Southeast Asia.
Report Studies :
Project Objectives
Project Scope
The project covers the entire process from product research and development to market promotion. In terms of products, it is responsible for the hardware design.
Air cooled heatsinks are thermal management devices that dissipate heat through direct air flow, primarily used in electronics and industrial applications. These components feature a metal base (typically aluminum or copper) with fin arrays that maximize surface area for efficient heat transfer. The cooling process occurs through forced convection (with fans) or natural convection, making them cost-effective solutions for medium-power applications like computer processors, servers, LED lighting, and power converters. However, their efficiency depends heavily on ambient conditions and fin design parameters such as surface area and thermal conductivity.
The project team consists of senior engineers from the department who are responsible for product research and development.
By Types : Bonded-fin Heatsinks
Pressed-fin Heatsinks
Extruded Heatsinks
Stamped Heatsinks
Others
By Applications : Electronics
Industrial Equipment
Others
Key Industry Players
Alpha (U.S.)
TE Connectivity (Switzerland)
Ohmite (U.S.)
Apex Microtechnology (U.S.)
Radian (U.S.)
Boyd Corporation (U.S.)
Thermal Solutions (U.S.)
Miba Cooling (Austria)
Mersen (France)
Vitesse Systems (U.S.)
Littelfuse (U.S.)
Jingbo Group (China)